Abstract: Disclosed is a method for preparing an electrode having an electrochemical catalyst layer, comprising the steps of: providing a substrate having a conductive layer thereon, immersing the substrate in a first solution having a conditioner to form a conditioner layer on the surface of the conductive layer, and immersing the substrate in a second solution having polymer-capped noble metal nanoclusters to form an electrochemical catalyst layer on the conditioner layer of the substrate. This method can reduce the amount of noble metal used in the electrochemical catalyst layer and is suitable for mass production.

Abstract: A method for manufacturing copper wires on a substrate for a flat panel display device is disclosed. The method comprises following steps: providing a substrate; forming a seed layer on the surface; forming a patterned photoresist on the surface of the seed layer to expose a part of the seed layer; and plating a copper layer on the exposed part of the seed layer. As the copper layer is plated, an electrolyte solution comprises a sulfur-containing compound is used. The angle between the surface of the copper layer and the contact surface of the seed layer is greater than 0 degree and less than 90 degree. Through the method illustrated above, the film step-coverage in the following process can be improved, the generated voids in device can be reduced, the manufacturing steps can be simplified, and the complicated etching process can be avoided.

Abstract: Disclosed is a method for preparing an electrode having an electrochemical catalyst layer, comprising the steps of: providing a substrate having a conductive layer thereon, immersing the substrate in a first solution having a conditioner to form a conditioner layer on the surface of the conductive layer, and immersing the substrate in a second solution having polymer-capped noble metal nanoclusters to form an electrochemical catalyst layer on the conditioner layer of the substrate. This method can reduce the amount of noble metal used in the electrochemical catalyst layer and is suitable for mass production.

Abstract: A method for manufacturing copper wires on a substrate for a flat panel display device is disclosed. The method comprises following steps: providing a substrate; forming a seed layer on the surface; forming a patterned photoresist on the surface of the seed layer to expose a part of the seed layer; and plating a copper layer on the exposed part of the seed layer. As the copper layer is plated, an electrolyte solution comprises a sulfur-containing compound is used. The angle between the surface of the copper layer and the contact surface of the seed layer is greater than 0 degree and less than 90 degree. Through the method illustrated above, the film step-coverage in the following process can be improved, the generated voids in device can be reduced, the manufacturing steps can be simplified, and the complicated etching process can be avoided.

Abstract: A process for preparing metal nanoparticles, comprising reacting suitable metal salts and anionic surfactant containing an anionic group of carboxylic group (COO−), sulfate group (SO42−) or sulfonate group (SO32−) as reducing agent in water under reflux at a temperature of 50-140° C., such that under the reducing power of said anionic surfactant itself, the metal salts can be effectively reduced into metal nanoparticles having a uniform particle size and that the reaction will be not too fast, no large microparticle will be formed, the yield will not be lowered, and the nanoparticle thus prepared can be dispersed stably in polar and non-polar solvent.

Abstract: A process for preparing metal nanoparticles, comprising reacting suitable metal salts and anionic surfactant containing an anionic group of carboxylic group (COO−), sulfate group (SO42−) or sulfonate group (SO32−) as reducing agent in water under reflux at a temperature of 50-140° C., such that under the reducing power of said anionic surfactant itself, the metal salts can be effectively reduced into metal nanoparticles having a uniform particle size and that the reaction will be not too fast, no large microparticle will be formed, the yield will not be lowered, and the nanoparticle thus prepared can be dispersed stably in polar and non-polar solvent.

Abstract: A method of activating a non-conductive substrate for use in electroless deposition is proposed, in which an aqueous solution containing nanoparticles of noble metals and their alloys is used as an activation solution in an electroless plating process, so as to electrolessly deposit a conductive metal deposition on the substrate and into micrometer-sized trenches formed on the substrate. By using this method with provision of a solution of a copper or nickel salt, copper or nickel can be deposited on the non-conductive substrate, allowing high aspect-ratio trenches on the substrate to be filled with copper or nickel for subsequent use in fabrication of integrated circuit interconnection.

Abstract: A method for manufacturing a membrane electrode assembly of a fuel cell by solvent pretreatment to the electrolyte membrane of the membrane electrode assembly is disclosed. A prepared electrolyte membrane is soaked in alcohol solvent for pre-expanding the electrolyte membrane at first, a catalyst layer is uniformly coated onto at least one side of the pre-expanded electrolyte membrane, and then the electrolyte membrane is dried for evenly shrinking the electrolyte membrane and the catalyst layer. Finally, the electrolyte membrane with catalyst layers is interposed between two gas diffusion electrodes, and the resulting sheet is pressed with heating to form the membrane electrode assembly.

Abstract: A process for the fabrication of submicron copper interconnection useful on IC structures without deposition of copper seed is described. A dense metal layer can be deposited through contact displacement reaction between diffusion barrier layer and metal ions in solution under appropriate conditions. The metal layer formed by the displacement deposition can serve as the conducting material for subsequent copper electroplating. Moreover, the costly process for applying seed layer through CVD or PVD can be eliminated.

Abstract: A polymer electrolyte for use in lithium batteries is disclosed. It contains: (a) a poly(vinyl chloride-co-vinyl acetate), or PVCAC, which is a copolymer containing 5 to 25 mol % of a vinyl chloride monomer, and 75 to 95 mol % of a vinyl acetate monomer; (b) a lithium salt; and (c) an organic solvent mixture. The organic solvent mixture contains at least one component selected from the group consisting of EC and PC and a high-boiling-point organic solvent. Preferably, the amount of the PVCAC is about 16-40 mol % of the polymer electrolyte, lithium about 3-12 mol %, and the organic solvent mixture about 48-81 mol %, when the polymer electrolyte was freshly prepared. Preferrably, the high-boiling-point is DMF or NMP. Within the organic solvent mixture, if DMF is used, it should preferably be about 20-60 mol % of the total organic solvent mixture. If NMP is used, it should preferably be about 10-40 mol % of the total organic solvent mixture.

Abstract: A process of directly plating onto a nonconductive substrate is disclosed. The process comprises the steps of:1) conditioning: modifying a surface of the nonconductive substrate with selected organic hydrocarbons or polymers to enhance its property of adsorbing catalysts;2) catalyzing: immersing the conditioned substrate into a catalyst colloid-containing solution or a catalyst complex-containing solution to let the catalyst be adsorbed onto the substrate;3) accelerating: reducing the catalyst with a suitable acid or basic solution (adapted to the catalyst colloid), or with a reducing agent (adapted to the catalyst complex) to reduce the catalyst being adsorbed onto the substrate;4) enhancing: immersing the substrate after accelerating step into an enhancing agent containing a compound with two ligands;5) electroplating: proceeding with a plating process.