Patents by Inventor Chi-Chih Huang
Chi-Chih Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240128947Abstract: An in-phase noise suppression device includes a signal transmitting unit and a grounding unit. The signal transmitting unit includes a number (N) of signal transmitting circuits, where N?3. Each of the signal transmitting circuits has an input terminal and an output terminal, receives a level signal at the input terminal thereof, and outputs the level signal at the output terminal thereof. The grounding unit includes a grounding circuit that is connected to the signal transmitting unit. The level signals respectively received by the signal transmitting circuits at the input terminals thereof, when being respectively transmitted along the signal transmitting circuits, generate at least two balanced digital signals and in-phase noise. The signal transmitting unit and the grounding circuit cooperatively constitute a noise suppression device so as to suppress the in-phase noise generated in the signal transmitting circuits.Type: ApplicationFiled: October 12, 2023Publication date: April 18, 2024Inventors: Chi-Hsuan CHENG, Yang-Chih HUANG
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Publication number: 20240112924Abstract: An integrated circuit package including integrated circuit dies with slanted sidewalls and a method of forming are provided. The integrated circuit package may include a first integrated circuit die, a first gap-fill dielectric layer around the first integrated circuit die, a second integrated circuit die underneath the first integrated circuit die, and a second gap-fill dielectric layer around the second integrated circuit die. The first integrated circuit die may include a first substrate, wherein a first angle is between a first sidewall of the first substrate and a bottom surface of the first substrate, and a first interconnect structure on the bottom surface of the first substrate, wherein a second angle is between a first sidewall of the first interconnect structure and the bottom surface of the first substrate. The first angle may be larger than the second angle.Type: ApplicationFiled: January 5, 2023Publication date: April 4, 2024Inventors: Hsu-Hsien Chen, Chen-Shien Chen, Ting Hao Kuo, Chi-Yen Lin, Yu-Chih Huang
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Publication number: 20230076598Abstract: An image sensor module comprises an image sensor having a light sensing area, a cover glass for covering the light sensing area, a dam between the image sensor and the cover glass, which surrounds the light sensing area, and has an outer wall and an inner wall, where a cross-section of the inner wall parallel to the surface of the light sensing area of the image sensor forms a sawtooth pattern and/or, where a cross-section of the inner wall orthogonal to the surface of the light sensing area of the image sensor forms an inclined surface.Type: ApplicationFiled: October 26, 2022Publication date: March 9, 2023Applicant: OmniVision Technologies, Inc.Inventors: Wei-Feng Lin, En-Chi Li, Chi-Chih Huang
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Patent number: 11562928Abstract: A chip comprises a semiconductor substrate having a first side and a second side opposite to the first side, a plurality of conductive metal patterns formed on the first side of the semiconductor substrate, a plurality of solder balls formed on the first side of the semiconductor substrate, and at least one code pattern formed using laser marking on the first side of the semiconductor substrate in a space free from the plurality of conductive metal patterns and the plurality of solder balls, wherein the at least one code pattern is visible from a backside of the chip, the at least one code pattern represents a binary number having four bits; and the binary number represents a decimal number to represent a tracing number of the chip.Type: GrantFiled: January 25, 2019Date of Patent: January 24, 2023Assignee: OmniVision Technologies, Inc.Inventors: Wei-Feng Lin, Chi-Chih Huang
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Patent number: 11515347Abstract: An image sensor module comprises an image sensor having a light sensing area, a cover glass for covering the light sensing area, a dam between the image sensor and the cover glass, which surrounds the light sensing area, and has an outer wall and an inner wall, where a cross-section of the inner wall parallel to the surface of the light sensing area of the image sensor forms a sawtooth pattern and/or, where a cross-section of the inner wall orthogonal to the surface of the light sensing area of the image sensor forms an inclined surface.Type: GrantFiled: January 20, 2020Date of Patent: November 29, 2022Assignee: OmniVision Technologies, Inc.Inventors: Wei-Feng Lin, En-Chi Li, Chi-Chih Huang
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Patent number: 11201124Abstract: The present disclosure provides a semiconductor device. The semiconductor device includes a semiconductor substrate and a first deep trench isolation (DTI) structure filled with a dielectric material formed on the semiconductor substrate. The first DTI structure is disposed in the first seal ring region and is extended into the semiconductor substrate. The semiconductor substrate has a pixel array region and a first seal ring region. The first seal ring region is proximate to an edge of the semiconductor substrate and surrounds the pixel array region. The first DTI structure is formed in the first seal ring region and surrounds the pixel array region.Type: GrantFiled: July 29, 2019Date of Patent: December 14, 2021Assignee: OMNIVISION TECHNOLOGIES, INC.Inventors: Chia-Ying Liu, Wu-Zang Yang, Chia-Jung Liu, Chi-Chih Huang
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Patent number: 11164708Abstract: Example of backlit switches are described. In an example, a backlit switch includes a printed circuit board (PCB) and a dome-type button coupled to the PCB. The dome-type button has a light transmitting portion. A light source is mounted on a first side of the PCB, and a tact switch is mounted on a second side of the PCB that is opposite to the first side. Further, a projection is provided to trigger the tact switch, in response to pressing of the dome-type button.Type: GrantFiled: June 21, 2018Date of Patent: November 2, 2021Assignee: Hewlett-Packard Development Company, L.P.Inventors: Yu Chen So, Weiming Tseng, Chi-Chih Huang, Lien-Chia Chiu
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Publication number: 20210225914Abstract: An image sensor module comprises an image sensor having a light sensing area, a cover glass for covering the light sensing area, a dam between the image sensor and the cover glass, which surrounds the light sensing area, and has an outer wall and an inner wall, where a cross-section of the inner wall parallel to the surface of the light sensing area of the image sensor forms a sawtooth pattern and/or, where a cross-section of the inner wall orthogonal to the surface of the light sensing area of the image sensor forms an inclined surface.Type: ApplicationFiled: January 20, 2020Publication date: July 22, 2021Applicant: OmniVision Technologies, Inc.Inventors: Wei-Feng Lin, En-Chi Li, Chi-Chih Huang
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Publication number: 20210125802Abstract: Example of backlit switches are described. In an example, a backlit switch includes a printed circuit board (PCB) and a dome-type button coupled to the PCB. The dome-type button has a light transmitting portion. A light source is mounted on a first side of the PCB, and a tact switch is mounted on a second side of the PCB that is opposite to the first side. Further, a projection is provided to trigger the tact switch, in response to pressing of the dome-type button.Type: ApplicationFiled: June 21, 2018Publication date: April 29, 2021Applicant: Hewlett-Packard Development Company, L.P.Inventors: Yu Chen So, Weiming Tseng, Chi-Chih Huang, Lien-Chia Chiu
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Publication number: 20210035926Abstract: The present disclosure provides a semiconductor device. The semiconductor device includes a semiconductor substrate and a first deep trench isolation (DTI) structure filled with a dielectric material formed on the semiconductor substrate. The first DTI structure is disposed in the first seal ring region and is extended into the semiconductor substrate. The semiconductor substrate has a pixel array region and a first seal ring region. The first seal ring region is proximate to an edge of the semiconductor substrate and surrounds the pixel array region. The first DTI structure is formed in the first seal ring region and surrounds the pixel array region.Type: ApplicationFiled: July 29, 2019Publication date: February 4, 2021Inventors: CHIA-YING LIU, WU-ZANG YANG, CHIA-JUNG LIU, CHI-CHIH HUANG
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Publication number: 20200357842Abstract: An image sensor module comprises: a substrate having a first side and second side, the first side being an opposite of the second side, an image sensor attached to the first side of the substrate, bonding wires to bond the image sensor to pads on the first side of the substrate, a protective structure disposed on the first side of the substrate surrounding the image sensor, the bonding wires, and the pads, the protective structure having a dam and a lid, a cover glass disposed on the protective structure, and a set of solder balls attached to the second side of the substrate.Type: ApplicationFiled: July 24, 2020Publication date: November 12, 2020Applicant: OmniVision Technologies, Inc.Inventors: Wei-Feng Lin, Chi-Chih Huang, Yu-Mei Su
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Publication number: 20200243384Abstract: A chip comprises a semiconductor substrate having a first side and a second side opposite to the first side, a plurality of conductive metal patterns formed on the first side of the semiconductor substrate, a plurality of solder balls formed on the first side of the semiconductor substrate, and at least one code pattern formed using laser marking on the first side of the semiconductor substrate in a space free from the plurality of conductive metal patterns and the plurality of solder balls, wherein the at least one code pattern is visible from a backside of the chip, the at least one code pattern represents a binary number having four bits; and the binary number represents a decimal number to represent a tracing number of the chip.Type: ApplicationFiled: January 25, 2019Publication date: July 30, 2020Applicant: OmniVision Technologies, Inc.Inventors: Wei-Feng Lin, Chi-Chih Huang
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Patent number: 10243014Abstract: A method of image sensor package fabrication includes forming a cavity in a ceramic substrate, and placing an image sensor in the cavity in the ceramic substrate. An image sensor processor is also placed in the cavity in the ceramic substrate, and the image sensor and the image sensor processor are wire bonded to electrical contacts. Glue is deposited on the ceramic substrate, and a glass layer is placed on the glue to adhere the glass layer to the ceramic substrate. The image sensor processor and the image sensor are disposed in the cavity between the glass layer and the ceramic substrate.Type: GrantFiled: February 20, 2018Date of Patent: March 26, 2019Assignee: OmniVision Technologies, Inc.Inventors: Wei-Feng Lin, Chi-Chih Huang, En-Chi Li
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Publication number: 20190027531Abstract: An image sensor module comprises: a substrate having a first side and second side, the first side being an opposite of the second side, an image sensor attached to the first side of the substrate, bonding wires to bond the image sensor to pads on the first side of the substrate, a protective structure disposed on the first side of the substrate surrounding the image sensor, the bonding wires, and the pads, the protective structure having a dam and a lid, a cover glass disposed on the protective structure, and a set of solder balls attached to the second side of the substrate.Type: ApplicationFiled: July 19, 2017Publication date: January 24, 2019Inventors: Wei-Feng Lin, Chi-Chih Huang, Yu-Mei Su
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Patent number: 10185191Abstract: A panel carrier includes a substrate, a die-attach region, a short sidewall, and a conductor. The die-attach region is on a top substrate surface of the substrate for supporting the LCoS panel. The short sidewall is on a first side of the die-attach region and has a top sidewall surface at a first height above the top substrate surface exceeding 0.4 millimeters and an aperture spanning the top sidewall surface and the top substrate surface. The conductor at least partially fills the aperture for electrically connecting to the conductive layer. A method for mechanically and electrically connecting a LCoS panel to a panel carrier having a short sidewall includes electrically connecting a transparent conductive layer of the LCoS panel to a conductive material, within the short sidewall, with a conductive adhesive having a thickness, between the transparent conductive layer and the short sidewall, less than two-hundred micrometers.Type: GrantFiled: August 2, 2016Date of Patent: January 22, 2019Assignee: OmniVision Technologies, Inc.Inventors: En-Chi Li, Chi-Chih Huang
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Patent number: 10163954Abstract: A trenched device wafer includes a device substrate layer having a top surface; a plurality of devices in the device substrate layer, and a trench in the top surface. The trench extends into the device substrate layer, and is located between a pair of adjacent devices of the plurality of devices. A method for forming a device die from a device wafer includes forming a trench in a top surface of the device wafer between two adjacent devices of the device wafer. The trench has a bottom surface located (a) at a first depth beneath the top surface and (b) at a first height above a wafer bottom surface. The method also includes, after forming the trench, decreasing a thickness of the device wafer, between the two adjacent devices, to a thickness less than the first height.Type: GrantFiled: April 11, 2016Date of Patent: December 25, 2018Assignee: OmniVision Technologies, Inc.Inventors: Yumei Su, Chi-Chih Huang, Wei-Feng Lin
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Patent number: 10034590Abstract: A cleaning device may include a solution tank configured to store cleaning solution. The device delivers the cleaning solution from a pump discharge of the cleaning device to a flow meter. The device initiates a priming mode by opening a first valve associated with a bypass line of the device, closing a second valve associated with a cleaning head of the cleaning device, and delivering the cleaning solution from a discharge of the flow meter to the inlet of the solution tank through the bypass line. When the device is primed, it initiates cleaning by closing the first valve associated with the bypass line, opening the second valve associated with the cleaning head, and delivering the cleaning solution to the cleaning head.Type: GrantFiled: January 19, 2018Date of Patent: July 31, 2018Assignee: Diversey, Inc.Inventors: Stephen J. Balas, Stephen D. Herr, Henry L. Hillman, Jr., Victor Chi-Chih Huang, Ralph McCann, Kevin L. Thomas
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Publication number: 20180182797Abstract: A method of image sensor package fabrication includes forming a cavity in a ceramic substrate, and placing an image sensor in the cavity in the ceramic substrate. An image sensor processor is also placed in the cavity in the ceramic substrate, and the image sensor and the image sensor processor are wire bonded to electrical contacts. Glue is deposited on the ceramic substrate, and a glass layer is placed on the glue to adhere the glass layer to the ceramic substrate. The image sensor processor and the image sensor are disposed in the cavity between the glass layer and the ceramic substrate.Type: ApplicationFiled: February 20, 2018Publication date: June 28, 2018Inventors: Wei-Feng Lin, Chi-Chih Huang, En-Chi Li
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Publication number: 20180140153Abstract: A cleaning device may include a solution tank configured to store cleaning solution. The device delivers the cleaning solution from a pump discharge of the cleaning device to a flow meter. The device initiates a priming mode by opening a first valve associated with a bypass line of the device, closing a second valve associated with a cleaning head of the cleaning device, and delivering the cleaning solution from a discharge of the flow meter to the inlet of the solution tank through the bypass line. When the device is primed, it initiates cleaning by closing the first valve associated with the bypass line, opening the second valve associated with the cleaning head, and delivering the cleaning solution to the cleaning head.Type: ApplicationFiled: January 19, 2018Publication date: May 24, 2018Inventors: Stephen J. Balas, Stephen D. Herr, Henry L. Hillman, JR., Victor Chi-Chih Huang, Ralph McCann, Kevin L. Thomas
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Patent number: 9935144Abstract: An image sensor package includes a ceramic substrate with a cavity disposed in the ceramic substrate. A glass layer is adhered to the ceramic substrate and encloses the cavity in the ceramic substrate. An image sensor is disposed in the cavity between the glass layer and the ceramic substrate to electrically isolate the image sensor. An image sensor processor is disposed in the cavity and electrically coupled to the image sensor to receive image data from the image sensor.Type: GrantFiled: November 28, 2016Date of Patent: April 3, 2018Assignee: OmniVision Technologies, Inc.Inventors: Wei-Feng Lin, Chi-Chih Huang, En-Chi Li