Patents by Inventor Chi-Ching Lu

Chi-Ching Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11967546
    Abstract: A semiconductor structure includes a first interposer; a second interposer laterally adjacent to the first interposer, where the second interposer is spaced apart from the first interposer; and a first die attached to a first side of the first interposer and attached to a first side of the second interposer, where the first side of the first interposer and the first side of the second interposer face the first die.
    Type: Grant
    Filed: July 21, 2022
    Date of Patent: April 23, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shang-Yun Hou, Hsien-Pin Hu, Sao-Ling Chiu, Wen-Hsin Wei, Ping-Kang Huang, Chih-Ta Shen, Szu-Wei Lu, Ying-Ching Shih, Wen-Chih Chiou, Chi-Hsi Wu, Chen-Hua Yu
  • Publication number: 20240086611
    Abstract: Systems, methods and devices are provided, which can include an engineering change order (ECO) base. A base layout cell includes metal layer regions, conductive gate patterns arranged above metal layer regions; oxide definition (OD) patterns, metal-zero layer over oxide-definition (metal-zero) patterns, at least one cut metal layer (CMD) pattern; and at least one via region. The base layout cell can be implemented in at least two non-identical functional cells. A first functional cell of the at least two non-identical functional cells includes first interconnection conductive patterns arranged connecting metal-zero structures corresponding to at least two metal-zero patterns in a first layout, and a second functional cell of the at least two non-identical functional cells includes second interconnection conductive patterns arranged connecting metal-zero structures corresponding to at least two metal-zero patterns in a second layout.
    Type: Application
    Filed: November 20, 2023
    Publication date: March 14, 2024
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shang-Hsuan Chiu, Chih-Liang Chen, Hui-Zhong Zhuang, Chi-Yu Lu, Kuang-Ching Chang
  • Patent number: 11923337
    Abstract: A method of manufacturing a carrying substrate is provided. At least one circuit component is disposed on a first circuit structure. An encapsulation layer is formed on the first circuit structure and encapsulates the circuit component. A second circuit structure is formed on the encapsulation layer and electrically connected to the circuit component. The circuit component is embedded in the encapsulation layer via an existing packaging process. Therefore, the routing area is increased, and a package substrate requiring a large size has a high yield and low manufacturing cost.
    Type: Grant
    Filed: August 29, 2019
    Date of Patent: March 5, 2024
    Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Chi-Ching Ho, Bo-Hao Ma, Yu-Ting Xue, Ching-Hung Tseng, Guan-Hua Lu, Hong-Da Chang
  • Patent number: 9029433
    Abstract: A photocurable adhesive composition is provided, which comprises: a) a (meth)acrylate oligomer having one or more functional groups, b) a mono-functional monomer, a multi-functional monomer, or a mixture thereof, c) a photoinitiator, and d) a plasticizer having a refractive index of no less than 1.48. The photocurable adhesive composition of the present invention has good light transmittance, high refractive index and appropriate flowability and softness, and is easy to be coated and adhered. The photocurable adhesive composition of the present invention can be applied to optical products and simplify the manufacture processes, and provide adhesion property while retaining good reworkability and optical properties.
    Type: Grant
    Filed: December 30, 2011
    Date of Patent: May 12, 2015
    Assignee: Eternal Materials Co., Ltd.
    Inventors: Chi-Yu Huang, Chi-Ching Lu, Hsiun-Chia Shih
  • Publication number: 20120172477
    Abstract: A photocurable adhesive composition is provided, which comprises: a) a (meth)acrylate oligomer having one or more functional groups, b) a mono-functional monomer, a multi-functional monomer, or a mixture thereof, c) a photoinitiator, and d) a plasticizer having a refractive index of no less than 1.48. The photocurable adhesive composition of the present invention has good light transmittance, high refractive index and appropriate flowability and softness, and is easy to be coated and adhered. The photocurable adhesive composition of the present invention can be applied to optical products and simplify the manufacture processes, and provide adhesion property while retaining good reworkability and optical properties.
    Type: Application
    Filed: December 30, 2011
    Publication date: July 5, 2012
    Inventors: CHI-YU HUANG, CHI-CHING LU, HSIUN-CHIA SHIH
  • Publication number: 20030152421
    Abstract: The present invention of a table corner strengthener includes a supporting frame, a plurality of side connecting beams and a supporting post; both of the side connecting beam and the supporting post are hollow columnar bodies; the side supporting frame in the supporting frame has an outer periphery to be fitly inserted into the inner periphery of the columnar body of the side connecting beam; the features thereof are that all the side supporting frames are fixedly jointed two by two through the fastening connection between two adjacent and vertical lateral planes of a columnar wedge; the supporting frame is also placed into a cut opening inside the supporting post through the wedge thus to engage with the supporting post; a screw hole inside the supporting post fitly corresponds to a through hole on the lateral plane of each side supporting frame in the supporting frame; therefore, the action force exerted from the supporting frame onto the supporting post can be shared by the cut opening to increase the stre
    Type: Application
    Filed: February 12, 2002
    Publication date: August 14, 2003
    Inventor: Chi-Ching Lu