Patents by Inventor Chi Chong

Chi Chong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240128129
    Abstract: A method of detecting atomic scale defects in semiconductors, comprising the steps of scanning the surface of the semiconductor with a field emission scanning electron microscope (SEM) to form an SEM image thereof; scanning the SEM image with a light detector and monochromator to obtain a cathodoluminescence (CL) spatial intensity map of the SEM image; determining the CL spectra, i.e.
    Type: Application
    Filed: October 5, 2023
    Publication date: April 18, 2024
    Applicant: THE UNIVERSITY OF HONG KONG
    Inventors: Chi Chung Francis Ling, Sihua Li, Lok Ping Ho, Wing Chong Tony Chau
  • Patent number: 11857605
    Abstract: Provided herein are thiosuccinyl-crosslinked hemoglobin conjugates useful as blood replacement agents and therapeutic proteins, pharmaceutical compositions comprising the same and the methods of use and preparation thereof.
    Type: Grant
    Filed: February 28, 2022
    Date of Patent: January 2, 2024
    Assignee: Billion King International Limited
    Inventors: Kwok Chu Butt, Norman Fung-Man Wai, Hiu Chi Chong, Wing Tat Choi, Colin Pak Fai Yeh, Benjamin Chi Yin Wai
  • Patent number: 11692022
    Abstract: Provided herein are thiosuccinyl-crosslinked hemoglobin analogs useful as blood replacement agents, pharmaceutical compositions comprising the same and the methods of use and preparation thereof.
    Type: Grant
    Filed: August 25, 2022
    Date of Patent: July 4, 2023
    Assignee: Billion King International Limited
    Inventors: Kwok Chu Butt, Norman Fung-Man Wai, Hiu Chi Chong, Wing Fung Wu, Colin Pak Fai Yeh, Benjamin Chi Yin Wai
  • Publication number: 20230111100
    Abstract: Provided herein are thiosuccinyl-crosslinked hemoglobin analogs useful as blood replacement agents, pharmaceutical compositions comprising the same and the methods of use and preparation thereof.
    Type: Application
    Filed: August 25, 2022
    Publication date: April 13, 2023
    Inventors: Kwok Chu BUTT, Norman Fung-Man WAI, Hiu Chi CHONG, Wing Fung WU, Colin Pak Fai YEH, Benjamin Chi Yin WAI
  • Patent number: 11479597
    Abstract: Provided herein are thiosuccinyl-crosslinked hemoglobin analogs useful as blood replacement agents, pharmaceutical compositions comprising the same and the methods of use and preparation thereof.
    Type: Grant
    Filed: August 27, 2020
    Date of Patent: October 25, 2022
    Assignee: Billion King International Limited
    Inventors: Kwok Chu Butt, Norman Fung-Man Wai, Hiu Chi Chong, Wing Fung Wu, Colin Pak Fai Yeh, Benjamin Chi Yin Wai
  • Patent number: 11463356
    Abstract: A packet forwarding network may include spine and leaf switches that forward network traffic between end hosts. The packet forwarding network may be implemented on multiple network racks in a rack-based system. A controller may control the underlying spine and leaf switches to form on-premise virtual private cloud (VPC) resources. In particular, the controller may form enterprise VPC (EVPC) tenants, each having a virtual router that performs routing between different segments within the corresponding EVPC tenant. The different segments may separately include web, application, and database servers, as end hosts. The controller may form a system VPC tenant having a virtual system router that performs routing between different EVPC tenants. A segment in an internal VPC tenant formed by the controller and/or an external VPC tenant formed by the controller may provide external network access for one or more of the EVPC tenants.
    Type: Grant
    Filed: July 21, 2020
    Date of Patent: October 4, 2022
    Assignee: Arista Networks, Inc.
    Inventors: Richard Forster, Kanzhe Jiang, Sudeep Modi, Shunjia Yu, Onkar Bhat, Ganesh Kasinathan, Zhao Dong, Weifan Fu, Jialiu Wang, Saadet Savas, Alan Hase, Alok Gupta, Prashant Gandhi, Chi Chong, Jai Prakash Shukla
  • Publication number: 20220280616
    Abstract: Provided herein are thiosuccinyl-crosslinked hemoglobin conjugates useful as blood replacement agents and therapeutic proteins, pharmaceutical compositions comprising the same and the methods of use and preparation thereof.
    Type: Application
    Filed: February 28, 2022
    Publication date: September 8, 2022
    Inventors: Kwok Chu BUTT, Norman Fung-Man WAI, Hiu Chi CHONG, Wing Tat CHOI, Colin Pak Fai YEH, Benjamin Chi Yin WAI
  • Publication number: 20210112000
    Abstract: A packet forwarding network may include spine and leaf switches that forward network traffic between end hosts. The packet forwarding network may be implemented on multiple network racks in a rack-based system. A controller may control the underlying spine and leaf switches to form on-premise virtual private cloud (VPC) resources. In particular, the controller may form enterprise VPC (EVPC) tenants, each having a virtual router that performs routing between different segments within the corresponding EVPC tenant. The different segments may separately include web, application, and database servers, as end hosts. The controller may form a system VPC tenant having a virtual system router that performs routing between different EVPC tenants. A segment in an internal VPC tenant formed by the controller and/or an external VPC tenant formed by the controller may provide external network access for one or more of the EVPC tenants.
    Type: Application
    Filed: July 21, 2020
    Publication date: April 15, 2021
    Inventors: Richard Forster, Kanzhe Jiang, Sudeep Modi, Shunjia Yu, Onkar Bhat, Ganesh Kasinathan, Zhao Dong, Weifan Fu, Jialiu Wang, Saadet Savas, Alan Hase, Alok Gupta, Prashant Gandhi, Chi Chong, Jai Prakash Shukla
  • Publication number: 20210061885
    Abstract: Provided herein are thiosuccinyl-crosslinked hemoglobin analogs useful as blood replacement agents, pharmaceutical compositions comprising the same and the methods of use and preparation thereof.
    Type: Application
    Filed: August 27, 2020
    Publication date: March 4, 2021
    Inventors: Kwok Chu BUTT, Norman Fung-Man WAI, Hiu Chi CHONG, Wing Fung WU, Colin Pak Fai YEH, Benjamin Chi Yin WAI
  • Patent number: 7679382
    Abstract: A stepped printed circuit board for a probe card and for clamping by a testing machine is disclosed. The stepped printed circuit board includes a main body and a protruding body. The main body has a conductive circuit pattern arranged therein and a border area for the clamping of the testing machine. The protruding body is joined to a bottom side of the main body beyond the border area and defines with the bottom side of the main body an elevational difference. The protruding body has a conductive circuit pattern arranged therein and electrically connected to the conductive circuit pattern of the main body.
    Type: Grant
    Filed: August 30, 2006
    Date of Patent: March 16, 2010
    Assignee: MPI Corporation
    Inventors: Fu-Chin Lu, Chi-Chong Chien
  • Publication number: 20070199972
    Abstract: A transducer assembly for a bonding apparatus is provided that comprises a horn having first and second base ends and a bonding tool attached to the horn between the first and second base ends. First and second ultrasonic generators are secured to the first and second base ends respectively. A first fastening mechanism is located on the horn between the bonding tool and the first ultrasonic generator and a second fastening mechanism is located on the horn between the bonding tool and the second ultrasonic generator such that the horn is releasably attachable to a mounting interface using the first and second fastening mechanisms. There are also transducer mounting positions disposed on the mounting interface for mounting the mounting interface to a bond head.
    Type: Application
    Filed: February 28, 2006
    Publication date: August 30, 2007
    Inventors: Chi Chong, Hing Li, Wing Lam
  • Patent number: 7263676
    Abstract: One embodiment of the invention provides a system that analyzes the propagation of noise through an integrated circuit. During operation, the system obtains an input noise signal to be applied to a cell within the integrated circuit. The system then looks up parameters specifying how noise affects the cell, and then uses the parameters to determine how the input noise signal affects the cell. This can involve determining if the input noise signal will cause the cell to fail and/or determining a propagated noise signal that emanates from the cell.
    Type: Grant
    Filed: April 9, 2003
    Date of Patent: August 28, 2007
    Assignee: Synopsys, Inc.
    Inventors: Alexander Gyure, Jindrich Zejda, Peivand Fallah-Tehrani, Wenyuan Wang, Chi-Chong Lo, Seyed Alireza Kasnavi, Mahmoud Shahram, Yansheng Luo, William Chiu-Ting Shu
  • Publication number: 20070090847
    Abstract: A stepped printed circuit board for a probe card and for clamping by a testing machine is disclosed. The stepped printed circuit board includes a main body and a protruding body. The main body has a conductive circuit pattern arranged therein and a border area for the clamping of the testing machine. The protruding body is joined to a bottom side of the main body beyond the border area and defines with the bottom side of the main body an elevational difference. The protruding body has a conductive circuit pattern arranged therein and electrically connected to the conductive circuit pattern of the main body.
    Type: Application
    Filed: August 30, 2006
    Publication date: April 26, 2007
    Applicant: MJC Probe Incorporation
    Inventors: Fu-Chin Lu, Chi-Chong Chien
  • Publication number: 20060175377
    Abstract: A capillary holder for mounting a capillary onto a horn is provided that comprises a mounting hole formed in the horn that has a first width along a first axis that is smaller than a width of the capillary and a second width along a second axis perpendicular to the first axis that is larger than the width of the capillary. In particular, the mounting hole is configured such that application of a flexion force to reduce the second width simultaneously expands the first width so as to fit the capillary when the first width is larger than the width of the capillary, and removal of said flexion force contracts the first width whereby to grip the capillary using an elastic force of the horn.
    Type: Application
    Filed: February 7, 2005
    Publication date: August 10, 2006
    Inventors: Bao Zhai, Ka Kwan, Man Chan, Chi Chong, Yam Wong, Hing Li
  • Patent number: 7007252
    Abstract: One embodiment of the invention provides a system that characterizes cells within an integrated circuit. During operation, the system obtains a number of input noise signals to be applied to the cell. The system then simulates responses of the cell to each of the input noise signals, and stores a representation of the responses. This allows a subsequent analysis operation to access the stored representation to determine a response of the cell instead of having to perform a time-consuming simulation operation.
    Type: Grant
    Filed: April 9, 2003
    Date of Patent: February 28, 2006
    Assignee: Synopsys, Inc.
    Inventors: Alexander Gyure, Jindrich Zejda, Peivand Fallah-Tehrani, Wenyuan Wang, Chi-Chong Lo, Mahmoud Shahram, Yansheng Luo, William Chiu-Ting Shu, Seyed Alireza Kasnavi
  • Publication number: 20050255673
    Abstract: An apparatus and method is provided for detaching a semiconductor chip from an adhesive tape on which it is mounted. The apparatus comprises a platform adapted to contact the adhesive tape at a position of the chip and a retaining force generator coupled to the platform for drawing the adhesive tape in a direction away from the chip. An elevation device is projectable from the platform that is movable both laterally across a surface of the platform and vertically with respect to the platform for elevating the chip. By moving the elevation device across a width of the chip while lifting the chip, controlled lifting of the chip and propagation of delamination between the chip and the adhesive tape may be achieved.
    Type: Application
    Filed: May 11, 2004
    Publication date: November 17, 2005
    Inventors: Yiu Cheung, Chou Liu, Ching Yiu, Chi Chong
  • Publication number: 20050034577
    Abstract: The invention provides an apparatus and method for indexing a length of film for severance. The apparatus comprises a linear feeding device operative to hold the film and to feed a predetermined amount of film to a trimming device by moving linearly between an initial position and another position towards the trimming device. A film holder located between the linear feeding device and the trimming device is operable between a first position wherein a gap is provided for the film to pass through during feeding to the trimming device, and a second position for clamping the film when severing the film with the trimming device.
    Type: Application
    Filed: August 14, 2003
    Publication date: February 17, 2005
    Inventors: Yuk Au, Siu Lau, Yiu Cheung, Chi Chong, Wan Lo
  • Publication number: 20040205682
    Abstract: One embodiment of the invention provides a system that analyzes the propagation of noise through an integrated circuit. During operation, the system obtains an input noise signal to be applied to a cell within the integrated circuit. The system then looks up parameters specifying how noise affects the cell, and then uses the parameters to determine how the input noise signal affects the cell. This can involve determining if the input noise signal will cause the cell to fail and/or determining a propagated noise signal that emanates from the cell.
    Type: Application
    Filed: April 9, 2003
    Publication date: October 14, 2004
    Inventors: Alexander Gyure, Jindrich Zejda, Peivand Fallah-Tehrani, Wenyuan Wang, Chi-Chong Lo, Seyed Alireza Kasnavi, Mahmoud Shahram, Yansheng Luo, William Chiu-Ting Shu
  • Publication number: 20040205680
    Abstract: One embodiment of the invention provides a system that characterizes cells within an integrated circuit. During operation, the system obtains a number of input noise signals to be applied to the cell. The system then simulates responses of the cell to each of the input noise signals, and stores a representation of the responses. This allows a subsequent analysis operation to access the stored representation to determine a response of the cell instead of having to perform a time-consuming simulation operation.
    Type: Application
    Filed: April 9, 2003
    Publication date: October 14, 2004
    Applicant: Entire Interest
    Inventors: Alexander Gyure, Jindrich Zejda, Peivand Fallah-Tehrani, Wenyuan Wang, Chi-Chong Lo, Mahmoud Shahram, Yansheng Luo, William Chiu-Ting Shu, SEYED ALIREZA KASNAVI