Abstract: A method for multi-link operation (MLO) is provided. The method for MLO may be applied to an apparatus. The method for MLO may include the following steps. A multi-chip controller of the apparatus may assign different data to a plurality of chips of the apparatus, wherein each chip corresponds to one link of multi-links. Each chip may determine whether transmission of the assigned data has failed. A first chip of the chips may transmit the assigned data to an access point (AP) in response to the first chip determining that the transmission of the assigned data has not failed.

Abstract: A semiconductor device includes: M*1st conductors in a first layer of metallization (M*1st layer) and being aligned correspondingly along different corresponding ones of alpha tracks and representing corresponding inputs of a cell region in the semiconductor device; and M*2nd conductors in a second layer of metallization (M*2nd layer) aligned correspondingly along beta tracks, and the M*2nd conductors including at least one power grid (PG) segment and one or more of an output pin or a routing segment; and each of first and second ones of the input pins having a length sufficient to accommodate at most two access points; each of the access points of the first and second input pins being aligned to a corresponding different one of first to fourth beta tracks; and the PG segment being aligned with one of the first to fourth beta tracks.

Abstract: Various solutions for extended reality (XR) enhancement in mobile communications are described. An apparatus establishes a communication with a network node of a wireless network. The apparatus performs an operation with respect to XR-related computation offloading from a user end to result in XR enhancement at the user end.

Abstract: A device includes first and second gate structures respectively extending across the first and second fins, and a gate isolation plug between a longitudinal end of the first gate structure and a longitudinal end of the second gate structure. The gate isolation plug comprises a first dielectric layer and a second dielectric layer over the first dielectric layer. The first dielectric layer has an upper portion and a lower portion below the upper portion. The upper portion has a thickness smaller than a thickness of the lower portion of the first dielectric layer.

Abstract: A system and methods of forming a dielectric material within a trench are described herein. In an embodiment of the method, the method includes introducing a first precursor into a trench of a dielectric layer, such that portions of the first precursor react with the dielectric layer and attach on sidewalls of the trench. The method further includes partially etching portions of the first precursor on the sidewalls of the trench to expose upper portions of the sidewalls of the trench. The method further includes introducing a second precursor into the trench, such that portions of the second precursor react with the remaining portions of the first precursor to form the dielectric material at the bottom of the trench.

Abstract: A semiconductor structure includes a first gate structure, a second gate structure coupled to the first gate structure, a source region, a first drain region, and a second drain region. The source region is surrounded by the first gate structure and the second gate structure. The first drain region is separated from the source region by the first gate structure. The second drain region is separated from the source region by the second gat structure. A shape of the first drain region and a shape of the second drain region are different from each other from a plan view.

Abstract: A wafer container includes a frame, a door and at least a pair of shelves. The frame has opposite sidewalls. The pair of the shelves are respectively disposed and aligned on the opposite sidewalls of the frame. Various methods and devices are provided for holding at least one wafer to the shelves during transport.

Abstract: A method for controlling movement of an autonomous vehicle includes: estimating a set of tire force margins with respect to each wheel of the vehicle and a set of dynamic chassis margins associated with a chassis module of the vehicle; based on the margins, determining whether the vehicle is capable of moving in accordance with a decision command; when the determination is negative, outputting a request for update of the decision command; and when an updated decision command has not been received, calculating a set of marginal actuating signals based on the decision command, the margins, required slip angles respectively for the wheels and a center of percussion of the vehicle so as to make the autonomous vehicle move accordingly.

Abstract: A method for controlling movement of an autonomous vehicle includes: estimating a set of tire force margins with respect to each wheel of the vehicle and a set of dynamic chassis margins associated with a chassis module of the vehicle; based on the margins, determining whether the vehicle is capable of moving in accordance with a decision command; when the determination is negative, outputting a request for update of the decision command; and when an updated decision command has not been received, calculating a set of marginal actuating signals based on the decision command, the margins, required slip angles respectively for the wheels and a center of percussion of the vehicle so as to make the autonomous vehicle move accordingly.

Abstract: In driving a segmented LED loading, an alternating current (AC) voltage is rectified into a direct current (DC) voltage; the DC voltage is regulated into an input voltage and the input voltage is maintained higher than a lowest voltage used for lighting at least one LED segment of the segmented LED loading; the input voltage and a current flowing through the segmented LED loading is detected to generate a switch control signal and a current control signal; respective operation states of each of a plurality of switches of a LED segment switch module are controlled by the switch control signal to control each LED segment of the segmented LED loading as power-supply state or no-power-supply state; and the current of the segmented LED loading is regulated based on the current control signal.

Abstract: The present disclosure relates to a switch circuit. The switch circuit comprises: a plurality of storing elements and a plurality of switch elements. The plurality of switch elements coupled the plurality of storing elements for generating a step-down mode. Moreover, the switch elements, controllers and parts of resistors in the present disclosure are integrated in an integrated circuit so as to effectively reduce size and weight of the driving circuit, advance the circuit suitability, and decrease the development cost of the circuit.

Abstract: The present disclosure relates to a switch circuit. The switch circuit comprises: a plurality of storing elements and a plurality of switch elements. The plurality of switch elements coupled the plurality of storing elements for generating a step-down mode. Moreover, the switch elements, controllers and parts of resistors in the present disclosure are integrated in an integrated circuit so as to effectively reduce size and weight of the driving circuit, advance the circuit suitability, and decrease the development cost of the circuit.

Abstract: A bag of a notebook computer for containing the notebook computer is provided. The bag includes an upper cover, a lower cover, and a carrying handle. The lower cover is pivotally connected with the upper cover. The upper cover is capable of being closed to the lower cover to form a containing space for containing the notebook computer, and it is capable of being opened from the lower cover to expose the notebook computer. The carrying handle is connected with the upper cover and the lower cover, respectively, and it is disposed across a connecting place of the upper cover and the lower cover. When the lower cover is disposed at a supporting surface and the upper cover is opened, the carrying handle lifts the lower cover so that an angle is formed between the lower cover and the supporting surface.

Abstract: A fan module including a fan and a light source set is provided. The fan includes a frame and a blade set. The frame has a accommodating space, an air inlet and an air outlet, and the air inlet and the air outlet are communicated with each other. The blade set is provided at the accommodating space. The light source set is provided at the frame as an independent module and has a circuit board and a plurality of light-emitting elements provided at the circuit board. Another fan module including a blade set base, a light source set, and a support is provided, wherein the light source set is provided at the blade set base. The light source set includes a circuit board and at least one light-emitting elements provided at the circuit board, and the circuit board is disposed between the blade set base and the support.

Abstract: A heat dissipation module including a heat sink, a thermal medium, and a thermal medium cap is provided. The heat sink is suitable to be disposed on a heat source, and the heat sink has a plurality of grooves. The thermal medium is disposed on a surface of the heat sink contacting the heat source. In addition, the thermal medium cap has a cover and a plurality of fixing portions extending from the cover. The thermal medium is covered by the cover, and the fixing portions penetrate the grooves.

Abstract: A heat sink back plate module suitable for fixing a heat sink on a heat source disposed on a motherboard is provided. A plurality of positioning holes is disposed around the heat source. The heat sink back plate module includes a plate body and a plurality of guideposts. The plate body having a plurality of locking holes is disposed under the motherboard. An internal thread is disposed in each locking hole. A portion of the locking holes are aligned to the positioning holes on the motherboard. The guideposts are assembled in the locking holes corresponding to the positioning holes. Each of the guideposts has an external thread disposed at one end. The external thread of the guidepost is locked in the internal thread of the locking hole corresponding to the positioning holes.

Abstract: A thermal module with heat pipe is disclosed to include a heat-dissipation plate, which has an accommodation groove that accommodates a heat pipe that is bonded to the accommodation groove with a bonding glue, and at least one retaining groove formed in the accommodation groove for retaining the bonding glue to prevent overflow of the bonding glue during its fluid state so as to improve the yield rate of the fabrication of the thermal module with heat pipe, avoid a further follow-up process, facilitate the quality control, save the cost, and keep a good looking of the finished product.