Abstract: A semiconductor device includes: M*1st conductors in a first layer of metallization (M*1st layer) and being aligned correspondingly along different corresponding ones of alpha tracks and representing corresponding inputs of a cell region in the semiconductor device; and M*2nd conductors in a second layer of metallization (M*2nd layer) aligned correspondingly along beta tracks, and the M*2nd conductors including at least one power grid (PG) segment and one or more of an output pin or a routing segment; and each of first and second ones of the input pins having a length sufficient to accommodate at most two access points; each of the access points of the first and second input pins being aligned to a corresponding different one of first to fourth beta tracks; and the PG segment being aligned with one of the first to fourth beta tracks.

Abstract: An implantable micro-biosensor a substrate, a first electrode, a second electrode, a third electrode, and a chemical reagent layer. The first electrode is disposed on the substrate and used as a counter electrode. The second electrode is disposed on the substrate and spaced apart from the first electrode. The third electrode is disposed on the substrate and used as a working electrode. The chemical reagent layer at least covers a sensing section of the third electrode so as to permit the third electrode to selectively cooperate with the first electrode or the first and second electrodes to measure a physiological signal in response to the physiological parameter of the analyte.

Abstract: An implantable micro-biosensor a substrate, a first electrode, a second electrode, a third electrode, and a chemical reagent layer. The first electrode is disposed on the substrate and used as a counter electrode. The second electrode is disposed on the substrate and spaced apart from the first electrode. The third electrode is disposed on the substrate and used as a working electrode. The chemical reagent layer at least covers a sensing section of the third electrode so as to permit the third electrode to selectively cooperate with the first electrode or the first and second electrodes to measure a physiological signal in response to the physiological parameter of the analyte.

Abstract: A webcam module, including a front casing, a rear casing, a support base, a lens, a blocking cover, and a lever, is provided. The front casing has a lens hole. The rear casing is disposed at the front casing and forms an accommodating space. The support base is rotatably disposed in the accommodating space. The lens is disposed on a front side surface of the support base facing the front casing. The blocking cover is slidably sleeved around the support base and faces the front casing. The lever is connected to the blocking cover and protrudes above the front casing and the rear casing. The lever is adapted to drive the blocking cover to slide along the support base. The lever is adapted to drive the blocking cover and the support base to rotate relative to the front casing with an axis as the center.

Abstract: A paper separation mechanism includes a separation roller assembly, a one-way clutch module, a transmission gear assembly connected with and driving the one-way clutch module, a driving motor for driving the transmission gear assembly, and a locking module. The separation roller assembly includes a separation shaft, a separation roller fastened around the separation shaft, and a pickup roller disposed to the separation roller. The one-way clutch module includes a gear shaft, and a one-way clutch mounted around the gear shaft. The locking module includes a swing arm, a hooking portion fastened to a bottom of the swing arm, a blocking portion fastened under the swing arm, and a spring disposed to the bottom of the swing arm. One side of the swing arm is fastened to the gear shaft, the other side of the swing arm is fastened to the separation shaft.

Abstract: A method of making a patch antenna includes the steps of: stamping a first metal plate to form a first plate body, a first aperture and a first protruding portion to thereby form a radiation metal layer; stamping a second metal plate to form a second plate body, a second aperture and a second protruding portion to thereby form a grounding metal layer; placing the metal layers in a mold to couple together the first and second protruding portions; and introducing an insulation material into the mold to form a dielectric layer between the metal layers.

Abstract: A multifunction input device includes a backlight module, a medium layer, a touch panel and a switching unit. The backlight module includes a light-guiding plate, a reflector directly disposed on the bottom surface of the light-guiding plate, and at least one light-emitting element disposed beside the light-guiding plate, and the light-guiding plate has a plurality of light output microstructure blocks matched with each other to form at least one keyboard pattern. The medium layer is directly disposed on the top surface of the light-guiding plate, and the transmittance rate of the medium layer is about 20% to 80%. The touch panel is directly disposed on the medium layer. The switching unit is applied to the touch panel to control the at least one light-emitting element. The medium layer is a single medium layer directly disposed between the light-guiding plate and the touch panel.

Abstract: The present invention provides a TSV-based oscillator WLP structure and a method for fabricating the same. The method of the present invention comprises steps: providing a silicon base having an oscillator unit disposed thereon; forming on the silicon base at least one package ring surrounding the oscillator unit; and disposing a silicon cap on the package ring to envelop the oscillator unit. The present invention adopts a cap and a base, which are made of the same material, to effectively overcome the problem of thermal stress occurring in a conventional sandwich package structure. Further, the present invention elaborately designs the wiring on the lower surface of the base to reduce the package size and decrease consumption of noble metals.

Abstract: A patch antenna includes: a dielectric layer made of an insulation material, and having upper and lower surfaces, and a through hole; a radiation metal layer disposed on the upper surface of the dielectric layer, and having a first plate body, a first aperture aligned with the through hole, and a first protruding portion extending from a peripheral edge of the first aperture into the through hole; and a grounding metal layer disposed on the lower surface of the dielectric layer, and having a second plate body, a second aperture aligned with the through hole, and a second protruding portion extending from a peripheral edge of the second aperture into the through hole. The first and second protruding portions contact each other in the through hole so that the radiation and grounding metal layers are electrically connected. A method of making a patch antenna is also disclosed.

Abstract: The present invention provides a TSV-based oscillator WLP structure and a method for fabricating the same. The method of the present invention comprises steps: providing a silicon base having an oscillator unit disposed thereon; forming on the silicon base at least one package ring surrounding the oscillator unit; and disposing a silicon cap on the package ring to envelop the oscillator unit. The present invention adopts a cap and a base, which are made of the same material, to effectively overcome the problem of thermal stress occurring in a conventional sandwich package structure. Further, the present invention elaborately designs the wiring on the lower surface of the base to reduce the package size and decrease consumption of noble metals.

Abstract: A method of making a patch antenna includes the steps of: stamping a first metal plate to form a radiation metal layer having a first protruding portion; stamping a second metal plate to form a grounding metal layer having a second protruding portion; and attaching the radiation metal layer and the grounding metal layer to opposite surfaces of a dielectric layer to couple together the first and second protruding portions.

Abstract: The invention relates to a flat antenna structure. The flat antenna structure includes a first metal plate, an intermediate layer, a metal ring, and a second metal plate. The intermediate layer has a first hole, and the intermediate layer is installed above and connected to the first metal plate. The metal ring is connected to the first metal plate through the first hole. The second metal plate has a second hole. The second metal plate is connected to the metal ring and the first metal plate. The intermediate layer and the metal ring are wrapped by the first metal plate and the second metal plate. The second metal plate can be electrically connected to the first metal plate via the metal ring, and a resonator is formed between the first metal plate and the second metal plate. A characteristic of the flat antenna can be adjusted by changing the diameters of the first hole and the metal ring.

Abstract: A patch antenna includes: a dielectric layer made of an insulation material, and having upper and lower surfaces, and a through hole; a radiation metal layer disposed on the upper surface of the dielectric layer, and having a first plate body, a first aperture aligned with the through hole, and a first protruding portion extending from a peripheral edge of the first aperture into the through hole; and a grounding metal layer disposed on the lower surface of the dielectric layer, and having a second plate body, a second aperture aligned with the through hole, and a second protruding portion extending from a peripheral edge of the second aperture into the through hole. The first and second protruding portions contact each other in the through hole so that the radiation and grounding metal layers are electrically connected. A method of making a patch antenna is also disclosed.

Abstract: The invention relates to a flat antenna structure. The flat antenna structure includes a first metal plate, an intermediate layer, a metal ring, and a second metal plate. The intermediate layer has a first hole, and the intermediate layer is installed above and connected to the first metal plate. The metal ring is connected to the first metal plate through the first hole. The second metal plate has a second hole. The second metal plate is connected to the metal ring and the first metal plate. The intermediate layer and the metal ring are wrapped by the first metal plate and the second metal plate. The second metal plate can be electrically connected to the first metal plate via the metal ring, and a resonator is formed between the first metal plate and the second metal plate. A characteristic of the flat antenna can be adjusted by changing the diameters of the first hole and the metal ring.

Abstract: A patch antenna includes: a dielectric layer made of an insulation material, and having upper and lower surfaces, and a through hole; a radiation metal layer disposed on the upper surface of the dielectric layer, and having a first plate body, a first aperture aligned with the through hole, and a first protruding portion extending from a peripheral edge of the first aperture into the through hole; and a grounding metal layer disposed on the lower surface of the dielectric layer, and having a second plate body, a second aperture aligned with the through hole, and a second protruding portion extending from a peripheral edge of the second aperture into the through hole. The first and second protruding portions contact each other in the through hole so that the radiation and grounding metal layers are electrically connected. A method of making a patch antenna is also disclosed.

Abstract: A latch sensor for a pod transport gripper for transferring semiconductor wafers is disclosed. The transport gripper has a left bar and a right bar, as well as a cross bar connecting the left and the right bars. The gripper also has a left clamp and a right clamp disposed on interior sides of the left bar and the right bar, respectively, to clamp a pod, such as a front-opening unified pod (FOUP), for transport. A number of latches are disposed on the cross bar, and correspond to a number of latch holes of the pod. The gripper has at least one latch sensor disposed on either the left bar, the right bar, or both, to determine whether the latches have properly engaged the latch holes of the pod.

Abstract: A latch sensor for a pod transport gripper for transferring semiconductor wafers is disclosed. The transport gripper has a left bar and a right bar, as well as a cross bar connecting the left and the right bars. The gripper also has a left clamp and a right clamp disposed on interior sides of the left bar and the right bar, respectively, to clamp a pod, such as a front-opening unified pod (FOUP), for transport. A number of latches are disposed on the cross bar, and correspond to a number of latch holes of the pod. The gripper has at least one latch sensor disposed on either the left bar, the right bar, or both, to determine whether the latches have properly engaged the latch holes of the pod.

Abstract: An assay for emetic activity among inhibitors of type 4 phosphodiesterase (PDE 4) is disclosed. The assay comprises: (A) administering to a test mammal an anesthetic compound in an amount sufficient to cause an anesthetic effect; (B) administering to the test mammal a test compound that has PDE 4 inhibitory activity; (C) observing the test mammal for changes in the anesthetic effect, and (D) correlating any change in the anesthetic effect observed in the anesthetized test mammal to a standard.