Patents by Inventor Chi H. Sheu

Chi H. Sheu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7374715
    Abstract: According to one embodiment of the invention, a co-cured resin transfer molding manufacturing method includes providing a tool having one or more tooling details and disposing one or more preforms proximate the one or more tooling details. The one or more preforms are either dry or binderized. The method further includes disposing a high permeability medium outwardly from the one or more tooling details, disposing a prepreg skin panel outwardly from the high permeability medium, disposing the one or more tooling details and the prepreg skin panel within the tool, injecting a resin into the one or more preforms, and curing the one or more preforms and the prepreg skin panel.
    Type: Grant
    Filed: May 22, 2002
    Date of Patent: May 20, 2008
    Assignee: Northrop Grumman Corporation
    Inventors: Christopher H. Husmann, Chi H. Sheu, Denise M. Shimazu
  • Patent number: 6668561
    Abstract: A pressure regulated structure includes a first layer, a second layer, a non-metallic honeycomb assembly, and a vent. The honeycomb assembly is between the first layer and the second layer and includes a plurality of walls forming cells, at least some of the walls including laser-formed apertures to allow fluid communication between cells. The vent is fluidly coupled to the honeycomb assembly, wherein fluid in the cells of the honeycomb assembly may be removed through the vent to decrease pressure in the structure.
    Type: Grant
    Filed: June 27, 2002
    Date of Patent: December 30, 2003
    Assignee: Northrop Grumman Corporation
    Inventors: Chi H. Sheu, Carl A. Reis, George V. Case
  • Publication number: 20030218267
    Abstract: According to one embodiment of the invention, a co-cured resin transfer molding manufacturing method includes providing a tool having one or more tooling details and disposing one or more preforms proximate the one or more tooling details. The one or more preforms are either dry or binderized. The method further includes disposing a high permeability medium outwardly from the one or more tooling details, disposing a prepreg skin panel outwardly from the high permeability medium, disposing the one or more tooling details and the prepreg skin panel within the tool, injecting a resin into the one or more preforms, and curing the one or more preforms and the prepreg skin panel.
    Type: Application
    Filed: May 22, 2002
    Publication date: November 27, 2003
    Applicant: Northrop Grumman Corporation
    Inventors: Christopher H. Husmann, Chi H. Sheu, Denise M. Shimazu
  • Patent number: 5580512
    Abstract: A method for the manufacture of low cost "oriented" composite molding compounds using discontinuous fibers embedded in a resin matrix. The method involves the steps of aligning discontinuous fibers by use of a strong electric field while simultaneously inserting the fibers onto a polymer substrate comprised of an uncured resin matrix. A preferred embodiment includes the incorporation of a mesh or a glass capillary array located parallel and adjacent to the polymer substrate to further ensure fiber alignment. After the fibers are attached to the uncured resin matrix, the aligned fibers are forced to lie down parallel along the surface of the polymer substrate by mechanically forcing the fibers flat. The newly formed reinforced polymer films may then be stacked with the fibers of each ply oriented to achieve the desired mechanical properties, and then cured to produce an improved composite laminate which can be machined to form a high strength shaped member.
    Type: Grant
    Filed: April 7, 1995
    Date of Patent: December 3, 1996
    Assignee: Northrop Grumman Corporation
    Inventors: Robert W. Koon, Chi H. Sheu, Brent R. Meredith