Patents by Inventor Chihan LEE

Chihan LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polyamide compound
    Patent number: 11787905
    Abstract: Provided is a polyamide compound excellent in various properties such as heat resistance and impact resistance. The polyamide compound contains a dicarboxylic acid unit represented by the general formula (1) and a diamine unit having a 9,9-bisarylfluorene skeleton. This polyamide compound is excellent in heat resistance and impact resistance.
    Type: Grant
    Filed: January 27, 2020
    Date of Patent: October 17, 2023
    Assignee: TOYOTA BOSHOKU KABUSHIKI KAISHA
    Inventor: Chihan Lee
  • Polyamide compound
    Patent number: 11220577
    Abstract: A novel polymer having self-healing properties is provided. The polyamide compound contains a dicarboxylic acid unit represented by the following formula (1) and a diamine unit represented by the following general formula (2). This polyamide compound is excellent in self-healing properties.
    Type: Grant
    Filed: January 27, 2020
    Date of Patent: January 11, 2022
    Assignee: TOYOTA BOSHOKU KABUSHIKI KAISHA
    Inventor: Chihan Lee
  • POLYAMIDE COMPOUND
    Publication number: 20200247952
    Abstract: Provided is a polyamide compound excellent in various properties such as heat resistance and impact resistance. The polyamide compound contains a dicarboxylic acid unit represented by the general formula (1) and a diamine unit having a 9,9-bisarylfluorene skeleton. This polyamide compound is excellent in heat resistance and impact resistance.
    Type: Application
    Filed: January 27, 2020
    Publication date: August 6, 2020
    Applicant: TOYOTA BOSHOKU KABUSHIKI KAISHA
    Inventor: Chihan LEE
  • POLYAMIDE COMPOUND
    Publication number: 20200247950
    Abstract: A novel polymer having self-healing properties is provided. The polyamide compound contains a dicarboxylic acid unit represented by the following formula (1) and a diamine unit represented by the following general formula (2). This polyamide compound is excellent in self-healing properties.
    Type: Application
    Filed: January 27, 2020
    Publication date: August 6, 2020
    Applicant: TOYOTA BOSHOKU KABUSHIKI KAISHA
    Inventor: Chihan LEE
  • Polyamide compound, and method for producing same
    Patent number: 10450415
    Abstract: To provide a polyamide compound having better properties than conventional polyamide compounds. A polyamide compound comprising a dicarboxylic acid unit represented by the following general formula (1) and a diamine unit represented by the following general formula (2). The polyamide compound of the present invention is characterized by having high energy absorption and high water-absorption resistance rate, and being amorphous (transparent).
    Type: Grant
    Filed: June 17, 2016
    Date of Patent: October 22, 2019
    Assignee: TOYOTA BOSHOKU KABUSHIKI KAISHA
    Inventor: Chihan Lee
  • POLYAMIDE COMPOUND, AND METHOD FOR PRODUCING SAME
    Publication number: 20180127544
    Abstract: To provide a polyamide compound having better properties than conventional polyamide compounds. A polyamide compound comprising a dicarboxylic acid unit represented by the following general formula (1) and a diamine unit represented by the following general formula (2). The polyamide compound of the present invention is characterized by having high energy absorption and high water-absorption resistance rate, and being amorphous (transparent).
    Type: Application
    Filed: June 17, 2016
    Publication date: May 10, 2018
    Applicant: TOYOTA BOSHOKU KABUSHIKI KAISHA
    Inventor: Chihan LEE