Abstract: A copper-silver dual-component metal electroplating solution includes copper methanesulfonate, silver methanesulfonate, methanesulfonic acid, chlorine ions, and water. An electroplating method for forming a copper-silver dual-component metal by using such an electroplating solution, the steps of which includes (a) contacting the copper-silver dual-component metal electroplating solution with a substrate; (b) applying an operating voltage, the current density of which is controlled to be between 0.1 and 2 ASD in order to carry out electroplating on the substrate. Therefore, the electroplating solution has environmental characteristics, such as less poisoning hazards, through the design of methanesulfonic acid and methanesulfonate electroplating solution. Also, the potential and the current are adjusted during the electroplating in order to obtain a copper-silver dual-component metal plating layer with a specific silver content.

Abstract: A copper-silver dual-component metal electroplating solution includes copper methanesulfonate, silver methanesulfonate, methanesulfonic acid, chlorine ions, and water. An electroplating method for forming a copper-silver dual-component metal by using such an electroplating solution, the steps of which includes (a) contacting the copper-silver dual-component metal electroplating solution with a substrate; (b) applying an operating voltage, the current density of which is controlled to be between 0.1 and 2 ASD in order to carry out electroplating on the substrate. Therefore, the electroplating solution has environmental characteristics, such as less poisoning hazards, through the design of methanesulfonic acid and methanesulfonate electroplating solution. Also, the potential and the current are adjusted during the electroplating in order to obtain a copper-silver dual-component metal plating layer with a specific silver content.

Abstract: A nonplanar antenna embedded package structure and a method of manufacturing the same are introduced. The structure includes a nonplanar antenna component. The nonplanar antenna component comprises an antenna substrate, metal wiring, through-hole, and metal bump. The substrate surface covers the metal wiring. The through-hole penetrates the substrate from the antenna substrate bottom side but does not penetrate the metal wiring, and does not affect its appearance. The metal bump is implanted in the through-hole from the antenna substrate bottom side to join the metal wiring. An electronic component having a copper cable is provided. An end of the copper cable protrudes from the electronic component and is inserted into the through-hole of the antenna component to join the metal bump, thereby forming the nonplanar antenna embedded package structure characterized by: preventing the antenna metal wiring from exposing, and reducing interference otherwise arising from antenna resonance frequency and noise.

Abstract: A method of electroplating a cobalt alloy to a wiring surface includes providing a substrate having a metal wiring; electroplating a cobalt-based alloy to the metal wiring at a deposition rate of 15-30 ?m/hr to form thereon a cobalt-based alloy electroplated layer 0.5 ?m-5 ?m thick, wherein the main constituent element of the cobalt-based alloy is cobalt; plating gold to the cobalt-based alloy electroplated layer to form thereon a gold plated layer 0.03 ?m-0.3 ?m thick. The surface of the cobalt-based alloy electroplated layer features a crystalline-phase structure full of micro-protuberances, and the thickness of the gold plated layer is reduced to 0.03 ?m.

Abstract: A method of manufacturing a nickel-based alloy barrier layer of a wiring connection terminal includes providing a substrate having a metal wiring; electroplating a nickel or a nickel-based alloy to the metal wiring at a deposition rate of 15-30 ?m/hr to form a first layer thereon, wherein the first layer is of a thickness of 0.5 ?m-5 ?m, and the nickel-based alloy layer has nickel content of at least 50%; and plating a gold layer to the first layer to form thereon a second layer of a thickness of 0.03 ?m-0.3 ?m. The surface of the nickel-based alloy electroplated layer features a crystalline-phase structure full of micro-protuberances, and the thickness of the gold plated layer is reduced to 0.03 ?m.

Abstract: A method of manufacturing a three-dimensional integrated circuit comprising an aluminum nitride interposer is introduced. The method includes providing a first circuit component; providing a plurality of first conductive blocks on the first circuit component; providing an aluminum nitride interposer on the first circuit component, wherein the aluminum nitride interposer has microvias each comprising therein a conductor with an end in contact with a corresponding one of the first conductive blocks; providing second conductive blocks on the aluminum nitride interposer, wherein the second conductive blocks are in contact with the other ends of the conductors in the microvias; and providing at least a second circuit component disposed on the aluminum nitride interposer and electrically connected to the first circuit component through the first and second conductive blocks and the conductors.

Abstract: A method and system for formation of vertical microvias in an opaque ceramic thin-plate by femtosecond laser pulses are introduced. The method includes (a) thin an opaque ceramic substrate and reduce its thickness to a range of 20-100 ?m to provide the ceramic thin-plate; (b) place the ceramic thin-plate on a carrier; and (c) drill the ceramic thin-plate by the femtosecond laser pulses, wherein the femtosecond laser pulses have the following parameters, including a pulse width <100 fs, a pulse frequency of 1,000˜10,000 Hz, a laser with a central wavelength of 800 nm, and a movable stage with a speed of 20-200 ?m/s. Hence, vertical mirovias with high aspect ratio can be fabricated in an opaque ceramic thin-plate.

Abstract: A manufacturing method of antenna shaping includes providing a nonplanar insulating substrate; coarsening and modifying a surface of the substrate and rendering the substrate surface hydrophilic by a plasma process to form a modified substrate; performing copper electroless plating on the modified substrate; electroplating a copper layer to attain a required thickness; defining antenna wiring width and clearance by multi-axis mechanical processing; and performing antenna metal wiring shaping with a copper etching plating solution. Furthermore, metal wiring shaping and processing is performed with a mechanical cutting tool of a multi-axis processing machine without using any photomask, so as to control substrate surface coarsening uniformity and enhance hydrophilicity of the surface of the modified substrate, with a precise plating technique for enhancing the quality of copper wire coating, cutting costs, and speeding up the processing process.

Abstract: A manufacturing method of nonplanar 3D antenna shaping includes providing a nonplanar insulating substrate; performing coarsening and modification on the surface of the substrate, followed by rendering the substrate surface hydrophilic in a plasma process to form a modified substrate; performing copper electroless plating on the modified substrate to plate a copper layer on the substrate, so as to achieve a required thickness. The width of the metal wiring is efficiently reduced to microscale by 3D photolithography; therefore, the range of its low-frequency application is reduced to less than 2 GHz. The method involves controlling substrate surface coarseness uniformity, modifying the substrate surface hydrophilic, and applying a precise plating technique with a view to enhancing the quality of copper wire coating.

Abstract: A nonplanar antenna embedded package structure and a method of manufacturing the same are introduced. The structure includes a nonplanar antenna component. The nonplanar antenna component comprises an antenna substrate, metal wiring, through-hole, and metal bump. The substrate surface covers the metal wiring. The through-hole penetrates the substrate from the antenna substrate bottom side but does not penetrate the metal wiring, and does not affect its appearance. The metal bump is implanted in the through-hole from the antenna substrate bottom side to join the metal wiring. An electronic component having a copper cable is provided. An end of the copper cable protrudes from the electronic component and is inserted into the through-hole of the antenna component to join the metal bump, thereby forming the nonplanar antenna embedded package structure characterized by: preventing the antenna metal wiring from exposing, and reducing interference otherwise arising from antenna resonance frequency and noise.