Abstract: The present disclosure provides one embodiment of a semiconductor structure. The semiconductor structure includes a semiconductor substrate having a first region and a second region; a first semiconductor mesa formed on the semiconductor substrate within the first region; a second semiconductor mesa formed on the semiconductor substrate within the second region; and a field effect transistor (FET) formed on the semiconductor substrate. The FET includes a first doped feature of a first conductivity type formed in a top portion of the first semiconductor mesa; a second doped feature of a second conductivity type formed in a bottom portion of the first semiconductor mesa, the second semiconductor mesa, and a portion of the semiconductor substrate between the first and second semiconductor mesas; a channel in a middle portion of the first semiconductor mesa and interposed between the source and drain; and a gate formed on sidewall of the first semiconductor mesa.

Abstract: There is provided an optical sensor package including a substrate, a base layer, an optical detection region, a light source and a light blocking wall. The base layer is arranged on the substrate. The light detection region and the light source are arranged on the base layer. The light blocking wall is arranged on the base layer, and located between the light detection region and the light source to block light directly propagating from the light source to the light detection region.

Abstract: A packet transmission method is provided. The packet transmission method may be applied to an apparatus. The packet transmission method may include the following steps. A path engine circuit of the apparatus may receive a packet from a modem circuit of the apparatus or from a Wi-Fi chip of the apparatus. Then, the path engine circuit may transmit the packet from the modem circuit to the Wi-Fi chip, or transmit the packet from the Wi-Fi chip to the modem circuit or a central processing unit (CPU) of the apparatus.

Abstract: A semiconductor device includes: M*1st conductors in a first layer of metallization (M*1st layer) and being aligned correspondingly along different corresponding ones of alpha tracks and representing corresponding inputs of a cell region in the semiconductor device; and M*2nd conductors in a second layer of metallization (M*2nd layer) aligned correspondingly along beta tracks, and the M*2nd conductors including at least one power grid (PG) segment and one or more of an output pin or a routing segment; and each of first and second ones of the input pins having a length sufficient to accommodate at most two access points; each of the access points of the first and second input pins being aligned to a corresponding different one of first to fourth beta tracks; and the PG segment being aligned with one of the first to fourth beta tracks.

Abstract: The present invention relates to a chip tray positioning device, which mainly comprises a frame body, a tray conveying module, a pulling module, a pushing module and a controller. The tray conveying module is disposed on the frame body, electrically connected to the controller and controlled to convey a chip tray from the start area to the end area. The pulling module and the pushing module are disposed on the frame body, electrically connected to the controller and controlled to cause the chip tray to be abutted against the end wall and the lateral wall of the frame body, thereby realizing the positioning of the chip tray and eliminating an error formed in the transfer process of the chip tray. In addition, the controller also controls the pushing module to knock the chip tray at a specific frequency so that the chip tray is vibrated.

Abstract: A pre-forming adaptor for semiconductor packaging includes at least one lead frame and at least one packaging enclosure bonded with the at least one lead frame. Each of the lead frame and the packaging enclosure has a pre-forming shape provided according to a predetermined package outline of a semiconductor device.

Abstract: The present invention provides an electrostatic charge detecting packaging device comprising a carrier, multiple dies, and multiple electrostatic-charge-sensitive components; the carrier has a surface; the dies are mounted on the surface of the carrier; and the electrostatic-charge-sensitive components are mounted on the surface of the carrier; since an electrostatic voltage tolerance of each of the electrostatic-charge-sensitive components is lower than an electrostatic voltage tolerance of each of the dies, accumulated electrostatic charges are more likely to discharge towards the electrostatic-charge-sensitive components than towards the dies, and as such, by electrically testing whether the electrostatic-charge-sensitive components are functioning normally when packaging the dies, the present invention allows personnel to debug for knowing which packaging steps exactly cause more serious problems that lead to damaging electrostatic discharges in the dies.

Abstract: A die suction assistance device is provided to a wafer. The wafer is diced into multiple dies, and a tape is taped on a bottom side of the wafer. The die suction assistance device includes a platform and multiple support structures mounted in the platform. Multiple air ducts are formed among adjacent support structures. When the wafer is air-tightly mounted on the platform, the wafer is supported by the support structures. When an external vacuum device vacuums air out of the platform, a vacuum environment with negative pressure is created in the air ducts. This allows the tape to partially separate from a backside of each of the dies towards the air ducts, and allows the dies to be picked up respectively by a suction nozzle with less chance of being damaged, securing integrities of dies.

Abstract: An electrolyte of a redox flow battery, including a negative electrolyte and a positive electrolyte, is provided. The negative electrolyte includes a negative active material and a negative solvent, and the positive electrolyte includes a positive active material and a positive solvent. An initial volume of the negative electrolyte is greater than an initial volume of the positive electrolyte. A redox flow battery including the electrolyte is also provided.

Abstract: A wafer container includes a frame, a door and at least a pair of shelves. The frame has opposite sidewalls. The pair of the shelves are respectively disposed and aligned on the opposite sidewalls of the frame. Various methods and devices are provided for holding at least one wafer to the shelves during transport.

Abstract: The application discloses examples of a device housing of an electronic device including a magnesium-alloy substrate. The device housing further including a treatment layer applied over the magnesium-alloy substrate and a metallic coating layer applied over the treatment layer to provide a metallic luster. Further, a paint coating layer is disposed over a first portion of the metallic coating layer. Further, a top coating layer is applied over the paint coating layer and a visible second portion of the metallic coating layer.

Abstract: A side wettable package includes a molding compound, a chip and multiple conductive pads exposed from a bottom surface of the molding compound. The conductive pads include peripheral conductive pads arranged near a side wall of the molding compound. Each of the peripheral conductive pads is over etched to form an undercut. When the side wettable package is connected to a circuit board via solder, the solder ascends to the undercut of the peripheral conductive pads for improving connection yield and facilitating inspection of soldering quality.

Abstract: A method of repairing an oral defect model includes performing a three-dimensional oral defect model obtaining step, a defect cutting line detecting step, a defect point selecting step and a smoothing step. The three-dimensional oral defect model obtaining step is performed to scan an oral cavity to obtain a three-dimensional oral defect model message. The defect cutting line detecting step is performed to detect a defect cutting line of the three-dimension oral defect model message, and drive a displayer to display the defect cutting line. The defect point selecting step is performed to select at least one defect feature point of the defect cutting line via the displayer. The smoothing step is performed to perform a smoothing process at the at least one defect feature point, and convert the three-dimensional oral defect model message into a three-dimensional oral repaired model message to smooth the defect cutting line.

Abstract: A display control integrated circuit (IC) applicable to performing video output (VO) generator reset control in a display device includes multiple sub-circuits such as a VO generator and a display output control circuit. The VO generator generates an input vertical synchronization (IVS) signal for controlling playback of video data. The display output control circuit performs display output control, and more particularly, generates a set of display control signals to control a display output module within the display device to perform display operations. The set of display control signals may include a display vertical synchronization (DVS) signal for being used as timing reference of a timing controller within the display output module. During a time interval between time points when two consecutive pulses carried by the DVS signal appear, the display output control circuit sends a reset signal to the VO generator at an intermediate time point to reset it.

Abstract: A method of repairing an oral defect model includes performing a three-dimensional oral defect model obtaining step, a defect cutting line detecting step, a defect point selecting step and a smoothing step. The three-dimensional oral defect model obtaining step is performed to scan an oral cavity to obtain a three-dimensional oral defect model message. The defect cutting line detecting step is performed to detect a defect cutting line of the three-dimension oral defect model message, and drive a displayer to display the defect cutting line. The defect point selecting step is performed to select at least one defect feature point of the defect cutting line via the displayer. The smoothing step is performed to perform a smoothing process at the at least one defect feature point, and convert the three-dimensional oral defect model message into a three-dimensional oral repaired model message to smooth the defect cutting line.

Abstract: A display panel includes a first substrate, a second substrate, a display medium layer, pixel units, and a light-shielding conductive pattern layer. The first substrate has a first inner surface and a first outer surface, and the first outer surface serves as a display surface of the display panel. The second substrate is disposed opposite to the first substrate and has a second inner surface and a second outer surface. The display medium layer is disposed between the first inner surface and the second inner surface. The pixel units are disposed between the display medium layer and the first inner surface, and at least one of the pixel units includes an active element. The light-shielding conductive pattern layer is disposed between the display medium layer and the second inner surface, at least partially overlaps the active element in a vertical projection direction, and includes a first patterned light-shielding conductive layer and a first patterned low-reflection layer.

Abstract: The present invention discloses an image processing device and an image processing method. The image processing method includes steps of: referring to multiple frames or an auxiliary data associated with the frames to determine whether the frames contain substantially the same frames; selecting the frames according to whether the frames contain substantially the same frames to generate multiple selected frames; and performing video processing on the selected frames. When the frames do not contain substantially the same frames, the selected frames are the same as the frames, and when the frames contain substantially the same frames, the selected frames are part of the frames.

Abstract: A smart diaper sensor, which may be disposed inside a diaper, and may include a sensing element and a wireless RF circuit. The wireless RF circuit may include a transmitter and a wake-up receiver. The wake-up receiver may receive a wake-up signal transmitted from a backend platform to wake up the transmitter. The sensing element may sense the environmental status inside the diaper to generate a sensing signal. The transmitter may receive the sensing signal, and then transmit the sensing signal to the backend platform.

Abstract: The present invention discloses an image processing device and an image processing method. The image processing method includes steps of: referring to multiple frames or an auxiliary data associated with the frames to determine whether the frames contain substantially the same frames; selecting the frames according to whether the frames contain substantially the same frames to generate multiple selected frames; and performing video processing on the selected frames. When the frames do not contain substantially the same frames, the selected frames are the same as the frames, and when the frames contain substantially the same frames, the selected frames are part of the frames.

Abstract: Facility for transferring data over a network between two network endpoints by transferring hash signatures over the network instead the actual data. The hash signatures are pre-generated from local static data and stored in a hash database before any data is transferred between source and destination. The hash signatures are created on both sides of a network at the point where data is local, and the hash database consists of hash signatures of blocks of data that are stored locally. The hash signatures are created using different traversal patterns across local data so that the hash database can represent a larger dataset then the actual physical storage of the local data. If no local data is present, then arbitrary data is generated and then remains static.