Abstract: Various embodiments of the present disclosure are directed towards an integrated chip including a dielectric structure sandwiched between a first electrode and a bottom electrode. A passivation layer overlies the second electrode and the dielectric structure. The passivation layer comprises a horizontal surface vertically below a top surface of the passivation layer. The horizontal surface is disposed above a top surface of the dielectric structure.

Abstract: A device includes a first package connected to an interconnect substrate, wherein the interconnect substrate includes conductive routing; and a second package connected to the interconnect substrate, wherein the second package includes a photonic layer on a substrate, the photonic layer including a silicon waveguide coupled to a grating coupler and to a photodetector; a via extending through the substrate; an interconnect structure over the photonic layer, wherein the interconnect structure is connected to the photodetector and to the via; and an electronic die bonded to the interconnect structure, wherein the electronic die is connected to the interconnect structure.

Abstract: A machine learning method includes: distinguishing foregrounds and backgrounds of a first image to generate a first mask image; cropping the first image to generate second and third images; cropping the first mask image to generate second and third mask images, wherein a position of the second mask image and a position of the third mask image correspond to a position of the second image and a position of the third image, respectively; generating a first feature vector group of the second image and a second feature vector group of the third image by a model; generating a first matrix according to the first and second feature vector groups; generating a second matrix according to the second and third mask images; generating a function according to the first and second matrices; and adjusting the model according to the function.

Abstract: Methods and systems for multi-stage DV encoding and decoding. A skip command may be issued by a microprocessor or DRAM controller via a physical link when DRAM bandwidth is overtaxed. Corresponding encoding and decoding systems implementing the proposed DV encoding or decoding method are also provided.

Abstract: Methods and systems for multi-stage DV encoding and decoding. A skip command may be issued by a microprocessor or DRAM controller via a physical link when DRAM bandwidth is overtaxed. Corresponding encoding and decoding systems implementing the proposed DV encoding or decoding method are also provided.

Abstract: A digital video (DV) storage system comprises an interface module receiving an incoming signal and converting the incoming signal into an incoming bit-stream; a DV demuxer directly connected to the interface module for receiving the incoming bit-stream, wherein the DV demuxer de-multiplexes received blocks in the incoming bit-stream into at least video blocks being in video sections and audio blocks being in audio sections; and memory coupled to the DV demuxer for storing the video blocks and audio blocks. By directly connecting the interface module to the DV demuxer, and by not buffering the incoming bit-stream outside the interface module and the DV demuxer, the memory bandwidth requirement of the memory is greatly reduced, and the interface module and the DV demuxer can be easily implemented together in a single IC.

Abstract: The present invention is a bits stream control system for digital data. The bits stream control system comprises an encoder, a bits stream truncator, and a buffer. The encoder is used for encoding the digital data into a plurality of bits streams. The bits stream truncator is used for truncating or not truncating each of the bits streams to generate a plurality of corresponding modified bits streams according to a predetermined bit budget policy. The buffer is used for storing the modified bits streams.

Abstract: The present invention provides an immune modulator administration method whereby the modulators are formulated into a patch or cream to help patients in managing the diseases and alleviate the immune syndromes. The patch comprises a baking layer, a penetration enhancing layer, a carrier layer and a pressure sensitive adhesive layer. The application of immune modulators onto a topical patch or cream renders a method in the management of immune disorders either systemic or localized. The invention also provides clinicians a convenient mechanism for monitoring therapy responses. Furthermore, utilization of the present invention improves the quality of life for the living being to which the immune modulators are administrated. The concept and formulations of the present invention dramatically improve effectiveness of the treatment of autoimmune diseases such as psoriasis, rheumatoid arthritis, systematic lupus erythematosus, autoimmune hepatitis, hepatitis B and hepatitis C.