Abstract: A multilayer ceramic electronic component includes a ceramic body having a plurality of dielectric layers and internal electrodes having lead portions narrower than capacitance portions, the first and second external electrodes and dummy electrodes, wherein the first and second external electrodes disposed on both end surfaces of the ceramic body in the length direction, to be connected to the first and second lead portions, respectively, and dummy electrodes disposed on positions of margin portions of the dielectric layers corresponding to the first and second lead portions, to be spaced apart from the first and second internal electrodes, in a width direction of the ceramic body.

Abstract: There is provided a multilayer ceramic electronic component. The multilayer ceramic electronic component includes a ceramic main body including a dielectric layer, and first and second internal electrodes disposed to face each other within the ceramic main body and having the dielectric layer interposed therebetween. When an average roughness of center lines of the first and second internal electrodes is Ra, a maximum distance from a virtual line corresponding to Ra to a bottom of a pit (d) formed below the virtual line is 0.1 ?m to 13 ?m. The surface roughness of the internal electrode printed surface is improved to decrease the occurrence of electrical shorts.

Abstract: There is provided a multilayer ceramic electronic component, including: a ceramic body having dielectric layers and first and second internal electrodes alternately stacked therein; and first and second external electrodes electrically connected to the first and second internal electrodes and formed at both ends of the ceramic body, wherein the ceramic body includes an effective layer contributing to capacitance formation and a protective layer provided on at least one of upper and lower surfaces of the effective layer, the protective layer including one or more step absorbing layers provided at both ends thereof, so that the multilayer ceramic electronic component can have excellent reliability by reducing defects such as electrode spreading, cracks, delamination and the like.

Abstract: There is provided a multilayer ceramic electronic component. The multilayer ceramic electronic component includes a ceramic main body including a dielectric layer, and first and second internal electrodes disposed to face each other within the ceramic main body and having the dielectric layer interposed therebetween. When an average roughness of center lines of the first and second internal electrodes is Ra, a maximum distance from a virtual line corresponding to Ra to a bottom of a pit (d) formed below the virtual line is 0.1 ?m to 13 ?m. The surface roughness of the internal electrode printed surface is improved to decrease the occurrence of electrical shorts.

Abstract: There is provided a ceramic electronic component and a method of manufacturing the same. The method of manufacturing the ceramic electronic component includes: forming a fluorine coating layer on a ceramic sintered body, the fluorine coating layer having wettability of an external electrode paste lower than that of the external electrode paste on the ceramic sintered body and including carbon; and forming an external electrode by applying the external electrode paste on a surface of the ceramic sintered body.