Abstract: A cholesterol liquid crystal display device integrated with solar modules includes a first transparent substrate, a second transparent substrate, a first cholesterol liquid crystal module and a solar module. The first cholesterol liquid crystal module is arranged between the first transparent substrate and the second transparent substrate. The solar module is arranged between the first transparent substrate and the first cholesterol liquid crystal module. Therefore, the cholesterol liquid crystal display device of the present invention does not need a backlight module. By combining the light transmission characteristics of the cholesterol liquid crystal display device with the coating process characteristics of the solar module, the cholesterol liquid crystal display device with energy conservation and environmental protection is formed.

Abstract: The present disclosure provides a method of cleaning a semiconductor wafer during a process of fabricating a semiconductor device. The method includes loading a semiconductor wafer into a wafer handling system. The method includes removing contaminant particles from an edge region of the wafer from the back side, wherein alignment marks are located in the edge region. The method includes collecting the removed contaminant particles and discarding the collected contaminant particles out of the wafer handling system. The disclosure also provides an apparatus for fabricating a semiconductor device. The apparatus includes a wafer cleaning device that is operable to clean a predetermined region of the wafer on the back surface thereof. The predetermined region of the wafer at least partially overlaps with one or more alignment marks.

Abstract: A method includes rotating a wafer at a first speed for a first time duration. The wafer is rotated at a second speed that is lower than the first speed for a second time duration after the first time duration. The wafer is rotated at a third speed that is higher than the second speed for a third time duration after the second time duration. A photoresist is dispensed on the wafer during the first time duration and at least a portion of a time interval that includes the second time duration and the third time duration.

Abstract: The present disclosure provides a method of cleaning a semiconductor wafer during a process of fabricating a semiconductor device. The method includes loading a semiconductor wafer into a wafer handling system. The method includes removing contaminant particles from an edge region of the wafer from the back side, wherein alignment marks are located in the edge region. The method includes collecting the removed contaminant particles and discarding the collected contaminant particles out of the wafer handling system. The disclosure also provides an apparatus for fabricating a semiconductor device. The apparatus includes a wafer cleaning device that is operable to clean a predetermined region of the wafer on the back surface thereof. The predetermined region of the wafer at least partially overlaps with one or more alignment marks.

Abstract: A method includes rotating a wafer at a first speed for a first time duration. The wafer is rotated at a second speed that is lower than the first speed for a second time duration after the first time duration. The wafer is rotated at a third speed that is higher than the second speed for a third time duration after the second time duration. A photoresist is dispensed on the wafer during the first time duration and at least a portion of a time interval that includes the second time duration and the third time duration.

Abstract: The present disclosure provides an apparatus for fabricating a semiconductor device. The apparatus includes a mechanical structure that is operable to secure a position of a semiconductor wafer. The wafer has a front surface and a back surface. The apparatus includes a wafer cleaning device that is operable to clean a predetermined region of the wafer on the back surface. The predetermined region of the wafer at least partially overlaps with one or more alignment marks. The present disclosure also provides a method of fabricating a semiconductor device. The method includes loading a semiconductor wafer into a wafer handling system. The method includes removing contaminant particles from an edge region of the wafer from the back side. The alignment marks are located in the edge region. The method includes collecting the removed contaminant particles and discarding the collected contaminant particles out of the wafer handling system.