Abstract: A structure and a method for packaging an organic optoelectronic device are provided. In this method, a first substrate is provided, and a first barrier layer is disposed on the first substrate. An organic optoelectronic device is formed on the first barrier layer, and a first recess is also formed on the first barrier layer, in which the first recess forms a closed loop to surround the organic optoelectronic device. A sealant fills the first recess, and a second barrier layer is disposed on the organic optoelectronic device, in which the sealant attaches the second barrier layer to the first barrier layer to surround the organic optoelectronic device.

Abstract: An electronic device package of the disclosure includes a gas barrier substrate, a base layer, an electronic device and a barrier film. The base layer is disposed on the gas barrier substrate and made of a light curing material. The electronic device is disposed on the base layer. The barrier film is disposed on the gas barrier substrate, in which the barrier film and the gas barrier substrate clad the electronic device and the base layer. The disclosure also provides a manufacturing method of an electronic device package.

Abstract: A transistor structure including a gate, an insulation layer, a patterned semiconductor layer, a source, a drain and a light absorption layer and a manufacturing method thereof are provided. The gate is disposed on a substrate. An area of the gate overlaps an area of the patterned semiconductor layer. The insulation layer is disposed between the gate and the patterned semiconductor layer. The source and the drain are separated from each other and in contact with the patterned semiconductor layer. The patterned semiconductor layer is disposed between the light absorption layer and the substrate. An area of the light absorption layer overlaps an area of the patterned semiconductor layer. An absorption spectrum of the light absorption layer overlaps an absorption spectrum of the patterned semiconductor layer.

Abstract: An electronic device package of the disclosure includes a gas barrier substrate, a base layer, an electronic device and a barrier film. The base layer is disposed on the gas barrier substrate and made of a light curing material. The electronic device is disposed on the base layer. The barrier film is disposed on the gas barrier substrate, in which the barrier film and the gas barrier substrate clad the electronic device and the base layer. The disclosure also provides a manufacturing method of an electronic device package.

Abstract: A transistor structure including a gate, an insulation layer, a patterned semiconductor layer, a source, a drain and a light absorption layer and a manufacturing method thereof are provided. The gate is disposed on a substrate. An area of the gate overlaps an area of the patterned semiconductor layer. The insulation layer is disposed between the gate and the patterned semiconductor layer. The source and the drain are separated from each other and in contact with the patterned semiconductor layer. The patterned semiconductor layer is disposed between the light absorption layer and the substrate. An area of the light absorption layer overlaps an area of the patterned semiconductor layer. An absorption spectrum of the light absorption layer overlaps an absorption spectrum of the patterned semiconductor layer.

Abstract: A structure and a method for packaging an organic optoelectronic device are provided. In this method, a first substrate is provided, and a first barrier layer is disposed on the first substrate. An organic optoelectronic device is formed on the first barrier layer, and a first recess is also formed on the first barrier layer, in which the first recess forms a closed loop to surround the organic optoelectronic device. A sealant fills the first recess, and a second barrier layer is disposed on the organic optoelectronic device, in which the sealant attaches the second barrier layer to the first barrier layer to surround the organic optoelectronic device.

Abstract: A lighting device including a light converting structure, a light accommodating structure, and a lighting device that utilizes a light converting structure and/or a light accommodating structure to obtain a thinner configuration. The light converting structure includes a bottom conical recess to accommodate a light source, and a top conical recess to distribute the lights emitted from the light source. The light accommodating structure includes a through hole with a small opening and a large opening. A light source is accommodated in the through hole at the large opening, and the lights emitted from the light source output at the small opening.

Abstract: A structure and a method for packaging an organic optoelectronic device are provided. In this method, a first substrate is provided, and a first barrier layer is disposed on the first substrate. An organic optoelectronic device is formed on the first barrier layer, and a first recess is also formed on the first barrier layer, in which the first recess forms a closed loop to surround the organic optoelectronic device. A sealant fills the first recess, and a second barrier layer is disposed on the organic optoelectronic device, in which the sealant attaches the second barrier layer to the first barrier layer to surround the organic optoelectronic device.

Abstract: A structure, a method for manufacturing a structure, and an illuminating structure of a thin film transistor are disclosed. In the method, a substrate is provided, and a patterned first conductor layer is formed on the substrate. A patterned semiconductor layer, a patterned insulation layer, and a patterned second conductor layer are formed after forming the patterned first conductor layer, in which the patterned insulation layer contacts with the patterned second conductor layer. A first permeation barrier layer which covers the patterned second conductor layer and the patterned insulation layer is formed.

Abstract: A method for packaging an organic photoelectric device is disclosed. In the method, an inorganic substrate is provided, an organic layer is coated or pasted on the inorganic substrate to form a hybrid substrate. An organic photoelectric device is formed on the hybrid substrate, and the organic layer and the organic photoelectric device are patterned to define a package region. A permeation barrier layer is disposed on the package region to cover the organic photoelectric device.

Abstract: A structure and a method for packaging an organic optoelectronic device are provided. In this method, a first substrate is provided, and a first barrier layer is disposed on the first substrate. An organic optoelectronic device is formed on the first barrier layer, and a first recess is also formed on the first barrier layer, in which the first recess forms a closed loop to surround the organic optoelectronic device. A sealant fills the first recess, and a second barrier layer is disposed on the organic optoelectronic device, in which the sealant attaches the second barrier layer to the first barrier layer to surround the organic optoelectronic device.

Abstract: A light guiding structure includes a light transmissive body and microstructures; the light transmissive body includes an upper conical groove and a lower accommodating groove, and the upper conical groove has a curved surface with a continually varied slope; the microstructures are disposed on the light transmissive body. A lighting device includes a circuit board, a light source and the aforesaid light guiding structure; the light source and the light guiding structure are disposed on the circuit board, and the light source is accommodated within the lower accommodating groove.

Abstract: A light panel is disclosed. The light panel comprises a circuit assembly, a plurality of light sources, a light reflective structure, and a diffuser layer. The light reflective structure has a plurality of concaves, which are continuously connected to form a plurality of ridges. Each of the concaves has an opening formed on the bottom surface thereof, and each of the light sources is disposed corresponding to each of the openings of the concaves. The diffuser layer is supported by the ridges of the light reflective structure. In some aspects of the present invention, the diffuser layer may have a sloping inner surface or is coated with patterned diffuser coatings on the top surface. Each light source can be added with a lens.

Abstract: An electronic device and a display panel thereof are provided. The electronic device includes a first display panel and a casing. The first display panel has a first displaying part and a second displaying part. The first display panel includes a first bending mechanism which is disposed between the first displaying part and the second displaying part to bend or spread the first display panel. The casing has a first surface and a second surface opposite to the first surface. The casing includes a rail mechanism which is disposed on the second surface. The second displaying part is slid on the rail mechanism to shift the first display panel relatively to the casing.

Abstract: A lighting device, a light spreading plate for the lighting device and a method for manufacturing the same are provided. The lighting device comprises a light source plate and the light spreading plate. The light source plate comprises a plurality of light sources. The light spreading plate comprises a light travelling layer formed with a plurality of light spreading units. Each of the light spreading units is formed with a main body being defined with a top surface, a bottom surface and a peripheral. The main body has a thickness being tapered towards the peripheral. The main body comprises a top surface having a cone-shaped recess and a bottom surface having a bowl-shaped recess. The cone-shaped recess and the bowl-shaped recess of each of the spreading units are opposite to each other, and one of the cone-shaped recess and bowl-shaped recess is fitted for one of the light sources.

Abstract: Embodiments of the present invention include a light converting structure, a light accommodating structure, and a lighting device. The light converting structure includes a bottom conical recess to accommodate a light source, and a top conical recess to distribute the lights emitted from the light source. The light accommodating structure includes a through hole with a small opening and a large opening. A light source is accommodated in the through hole at the large opening, and the lights emitted from the light source output at the small opening. The lighting device utilizing the light converting structure and/or the light accommodating structure obtains a thinner configuration.

Abstract: A direct-lit light guiding structure, a direct-lit light guiding panel and a lighting device are disclosed. The light guiding structure includes a light transmissive body and microstructures; the light transmissive body includes an upper conical groove and a lower accommodating groove, and the upper conical groove has a curved surface with a continually varied slope; the microstructures are disposed on the light transmissive body. The lighting device includes a circuit board, a light source and the aforesaid light guiding structure; the light source and the light guiding structure are disposed on the circuit board, and the light source is accommodated within the lower accommodating groove. With these arrangements, the direct-lit light guiding structure can receive the light rays emitted from the light source, and then output the lights uniformly. Further, a plurality of direct-lit light guiding structures can be connected with one another to form the direct-lit light guiding panel.

Abstract: A light panel is disclosed. The light panel comprises a circuit assembly, a plurality of light sources, a light reflective structure, and a diffuser layer. The light reflective structure has a plurality of concaves, which are continuously connected to form a plurality of ridges. Each of the concaves has an opening formed on the bottom surface thereof, and each of the light sources is disposed corresponding to each of the openings of the concaves. The diffuser layer is supported by the ridges of the light reflective structure. In some aspects of the present invention, the diffuser layer may have a sloping inner surface or is coated with patterned diffuser coatings on the top surface. Each light source can be added with a lens.

Abstract: A method of fabricating an organic thin film transistor is provided. The method includes forming a source, a drain and a gate on a substrate and forming a dielectric layer to isolate the gate from the source and isolate the gate from the drain. An organic active material layer is formed on the substrate to fill a channel region between the source and the drain and cover the source and the drain. A barrier material layer is formed on the organic active material layer. Thereafter, the barrier material layer and the organic active material layer are patterned to form a barrier layer and an organic active layer and expose the source and the drain.

Abstract: A lighting device, a light spreading plate for the lighting device and a method for manufacturing the same are provided. The lighting device comprises a light source plate and the light spreading plate. The light source plate comprises a plurality of light sources. The light spreading plate comprises a light travelling layer formed with a plurality of light spreading units. Each of the light spreading units is formed with a main body being defined with a top surface, a bottom surface and a peripheral. The main body has a thickness being tapered towards the peripheral. The main body comprises a top surface having a cone-shaped recess and a bottom surface having a bowl-shaped recess. The cone-shaped recess and the bowl-shaped recess of each of the spreading units are opposite to each other, and one of the cone-shaped recess and bowl-shaped recess is fitted for one of the light sources.