Abstract: A chip package structure including a lead frame, a chip, a plurality of solder bumps, a solder resist layer and an encapsulant is provided. The lead frame has a plurality of inner leads. Each of the inner leads has an upper surface, a lower surface, two side surfaces opposite to each other and a bonding area on the upper surface. The chip is disposed on the lead frame and has an active surface. Each of the solder bumps connects the active surface and the bonding area of each of the inner leads. The solder resist layer is disposed on at least one of the lower surface or the two side surfaces of each of the inner leads. The encapsulant covers the lead frame, the chip, the solder bumps and the solder resist layer. A manufacturing method of the chip package structure is also provided.

Abstract: A quad flat no-lead package includes an encapsulant, and a plurality of chip pads, a plurality of bond pads and a chip disposed in the encapsulant. Each chip pad is connected to at least one of the chip pads adjacent thereto by a first extending portion. The chip pads and the bond pads are arranged in an array. The chip pads are disposed at the center of the array and the bond pads are disposed around the chip pads. Each of the bond pads and at least one of the bond pads or one of the chip pads adjacent thereto each has a second extending portion formed therebetween and corresponding to each other. Every two of the second extending portions corresponding to each other are separated by a groove. The chip is mounted on a top surface of the chip pads and is electrically coupled to the bond pads.

Abstract: A flat no-lead package includes an encapsulating material, and a die pad, a chip, a plurality of first contact pads and a plurality of second contact pads disposed in the encapsulating material. The encapsulating material has a package bottom surface. The die pad has a plurality of die pad extensions extending from the edges thereof. The chip is mounted on the die pad. The first contact pads are disposed near the edges of the encapsulating material and electrically coupled to the chip. The second contact pads are located between the die pad and the first contact pads and electrically coupled to the chip. Each of the second contact pads have a second contact pad extension corresponding to one of the die pad extensions respectively. The bottom surfaces of the first contact pads, the second contact pads and the second contact pad extensions are exposed on the package bottom surface.

Abstract: A flat no-lead package includes an encapsulating material, and a die pad, a chip, a plurality of first contact pads and a plurality of second contact pads disposed in the encapsulating material. The encapsulating material has a package bottom surface. The die pad has a plurality of die pad extensions extending from the edges thereof. The chip is mounted on the die pad. The first contact pads are disposed near the edges of the encapsulating material and electrically coupled to the chip. The second contact pads are located between the die pad and the first contact pads and electrically coupled to the chip. Each of the second contact pads have a second contact pad extension corresponding to one of the die pad extensions respectively.

Abstract: A quad flat no-lead package includes an encapsulant, and a plurality of chip pads, a plurality of bond pads and a chip disposed in the encapsulant. Each chip pad is connected to at least one of the chip pads adjacent thereto by a first extending portion. The chip pads and the bond pads are arranged in an array. The chip pads are disposed at the center of the array and the bond pads are disposed around the chip pads. Each of the bond pads and at least one of the bond pads or one of the chip pads adjacent thereto each has a second extending portion formed therebetween and corresponding to each other. Every two of the second extending portions corresponding to each other are separated by a groove. The chip is mounted on a top surface of the chip pads and is electrically coupled to the bond pads.

Abstract: A chip packaging structure includes an encapsulating material, plurality of first leads, plurality of second leads, a first chip, a second chip and an adhesion layer. The encapsulating material has a top package surface and a corresponding bottom package surface. Each first lead has a first inner lead portion and a first outer lead portion. The first chip is located on the first inner lead portion and electrically coupled to the first leads. Each second lead has a second inner lead portion and a second outer lead portion. The second chip is located on the second inner lead portion and electrically coupled to the second leads. The adhesion layer is located between the first leads and second leads so that the first leads and second leads are connected to each other.

Abstract: A chip package including a die pad, a plurality of leads, a chip, an adhesive, and a molding compound is provided. The die pad has a top surface and a bottom surface opposite to the top surface, wherein the die pad has a blocking portion disposed on the top surface, and the leads are disposed around the die pad. The chip is disposed on the top surface of the die pad surrounded by the blocking portion and is electrically connected to the leads. A top surface of the blocking portion is higher than the top surface of the die pad surrounded by the blocking portion. The adhesive is disposed between the chip and the die pad. The molding compound encapsulates the chip, a portion of the leads, and the die pad.

Abstract: A chip package including a die pad, a plurality of leads, a chip, an adhesive, and a molding compound is provided. The die pad has a top surface and a bottom surface opposite to the top surface, wherein the die pad has a blocking portion disposed on the top surface, and the leads are disposed around the die pad. The chip is disposed on the top surface of the die pad surrounded by the blocking portion and is electrically connected to the leads. A top surface of the blocking portion is higher than the top surface of the die pad surrounded by the blocking portion. The adhesive is disposed between the chip and the die pad. The molding compound encapsulates the chip, a portion of the leads, and the die pad.