Patents by Inventor Chi-Jung Tsai

Chi-Jung Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240128249
    Abstract: An electronic package is provided, in which a circuit structure is stacked on a carrier structure having a routing layer via support structures, where electronic elements are disposed on upper and lower sides of the circuit structure and the carrier structure, and the electronic elements and the support structures are encapsulated by a cladding layer, such that the electronic package can effectively increase the packaging density to meet the requirements of multi-functional end products.
    Type: Application
    Filed: December 8, 2022
    Publication date: April 18, 2024
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Chih-Hsien CHIU, Wen-Jung TSAI, Chi-Ching HO
  • Patent number: 11880234
    Abstract: An electronic device includes a display surface, a back surface with a first portion and a second portion, and a support assembly. The support assembly includes a first, second, and third boards. The first board includes a first surface, detachably covering the first portion, and a second surface. The second board is bendably connected to the first board and combined with the second portion. The third board includes a pivoted end and a free end. The pivoted end is pivotally connected to the second surface and covers the second board and a portion of the first board. When the first board rotates relative to the first portion, the third board also rotates relative to the second board, the second surface faces the third board, and the second board simultaneously moves along the third board. Accordingly, the display surface is raised up a distance relative to the free end.
    Type: Grant
    Filed: January 26, 2022
    Date of Patent: January 23, 2024
    Assignee: ASUSTeK COMPUTER INC.
    Inventors: Chi-Rong Hsu, Yi-Ting Chen, Po-Nien Chen, Chi-Jung Tsai, Wei Hsiang Tang
  • Publication number: 20220334611
    Abstract: An electronic device includes a display surface, a back surface with a first portion and a second portion, and a support assembly. The support assembly includes a first, second, and third boards. The first board includes a first surface, detachably covering the first portion, and a second surface. The second board is bendably connected to the first board and combined with the second portion. The third board includes a pivoted end and a free end. The pivoted end is pivotally connected to the second surface and covers the second board and a portion of the first board. When the first board rotates relative to the first portion, the third board also rotates relative to the second board, the second surface faces the third board, and the second board simultaneously moves along the third board. Accordingly, the display surface is raised up a distance relative to the free end.
    Type: Application
    Filed: January 26, 2022
    Publication date: October 20, 2022
    Applicant: ASUSTeK COMPUTER INC.
    Inventors: Chi-Rong Hsu, Yi-Ting Chen, Po-Nien Chen, Chi-Jung Tsai, Wei Hsiang Tang
  • Publication number: 20140001326
    Abstract: A mounting apparatus for a duplex module of a printer, includes a bracket, a left lock hung on a left portion of the bracket, a right lock hung on a right portion of the bracket; and a left transmission module and a right transmission module movably mounted on the bracket. The duplex module is secured to the bracket. The left transmission module abuts the left lock. The right transmission module abuts the right lock. The left transmission module and the right transmission module move synchronously to move the left lock and the right lock synchronously to attach the duplex module to the printer or detach the duplex module from the printer.
    Type: Application
    Filed: August 17, 2012
    Publication date: January 2, 2014
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: CHI-JUNG TSAI
  • Publication number: 20130340546
    Abstract: A transmission mechanism includes a guide rod, a gear assembly meshed with the guide rod, a blocking member attached to the guide rod, and a resilient member. The resilient member surrounds the guide rod. A first end of the resilient member abuts the blocking member, and a second end opposite to the first end is configured to abut a printer. The resilient member drives the guide rod to rotate the gear assembly.
    Type: Application
    Filed: March 21, 2013
    Publication date: December 26, 2013
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: Chi-Jung TSAI
  • Patent number: 7484714
    Abstract: A chargeable electric winch for driving a to-be-controlled object to rotate. The electric winch includes a housing, a driving device, a driven shaft, a first switch and a battery. The driving device is disposed in the housing. The driven shaft penetrates through the housing and is driven by the driving device to rotate. The first switch is disposed on the housing and has a controller. The controller has an opposite connector and is electrically connected to the driving device. The battery has an inner battery body and an outer connector electrically connected to the inner battery body. The battery for providing power is electrically connected to the opposite connector of the first switch through the outer connector of the battery, and the battery is separatably assembled with the housing.
    Type: Grant
    Filed: October 26, 2007
    Date of Patent: February 3, 2009
    Assignee: Chizong Machine Co., Ltd.
    Inventor: Chi-Jung Tsai
  • Publication number: 20060148405
    Abstract: The present invention discloses a Bluetooth audio relay, which comprises: a printed circuit board (PCB); a Bluetooth chip mounted on the PCB for processing the Bluetooth signals and transforming the Bluetooth signals into digital audio signals; an antenna coupled to the Bluetooth chip for receiving and transmitting the Bluetooth signals, and transferring the Bluetooth signals to the Bluetooth chip; memory mounted on the PCB and coupled to the Bluetooth chip for storing digital data; a power supply coupled to the Bluetooth ship for providing power; a codec chip mounted on the PCB and coupled to the Bluetooth chip for transforming the digital audio signals into analog audio signals; and a plurality of audio jacks mounted on the PCB and coupled the codec chip for outputting the analog audio signals
    Type: Application
    Filed: April 20, 2005
    Publication date: July 6, 2006
    Inventors: I-Tung Wu, Jian-Hua Chen, Chi-Jung Tsai, Bor-Kuan Lu, Chung-Chun Wu
  • Patent number: D764139
    Type: Grant
    Filed: January 30, 2015
    Date of Patent: August 16, 2016
    Assignee: Chizong Machine Co., Ltd.
    Inventor: Chi-Jung Tsai