Patents by Inventor Chi-Kuei Lee
Chi-Kuei Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20180082937Abstract: A microchip includes a passivation layer formed over underlying circuitry, a redistribution layer formed over the passivation layer, and a cap layer formed over the redistribution conductors of the redistribution layer and in contact with the passivation layer. The passivation layer and the cap layer have one or more compatibilities that provide sufficient adhesion between those two layers to prevent metal migration from the conductors of the redistribution layer between the interfaces of the passivation and cap layers. In one embodiment, the passivation and cap layers are each formed from an inorganic oxide (e.g., SiO2) using a process (e.g., PECVD) that provides substantially-uniform step coverage by the cap layer in trench and via regions of underlying circuitry. The invention increases the reliability of the microchip, because it eliminates metal migration, and the electrical shorting caused therefrom, in the redistribution layer.Type: ApplicationFiled: September 16, 2016Publication date: March 22, 2018Applicant: OmniVision Technologies, Inc.Inventors: Chi-Kuei Lee, Ying Chung, Ying-Chih Kuo, Wei-Feng Lin
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Patent number: 9922922Abstract: A microchip includes a passivation layer formed over underlying circuitry, a redistribution layer formed over the passivation layer, and a cap layer formed over the redistribution conductors of the redistribution layer and in contact with the passivation layer. The passivation layer and the cap layer have one or more compatibilities that provide sufficient adhesion between those two layers to prevent metal migration from the conductors of the redistribution layer between the interfaces of the passivation and cap layers. In one embodiment, the passivation and cap layers are each formed from an inorganic oxide (e.g., SiO2) using a process (e.g., PECVD) that provides substantially-uniform step coverage by the cap layer in trench and via regions of underlying circuitry. The invention increases the reliability of the microchip, because it eliminates metal migration, and the electrical shorting caused therefrom, in the redistribution layer.Type: GrantFiled: September 16, 2016Date of Patent: March 20, 2018Assignee: OmniVision Technologies, Inc.Inventors: Chi-Kuei Lee, Ying Chung, Ying-Chih Kuo, Wei-Feng Lin
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Publication number: 20160268324Abstract: An imaging package includes an image sensor package formed with a semiconductor substrate. A removable transparent cover is bonded over the image sensor package to cover a first side the image sensor package. A lateral dimension of the removable transparent cover along a first direction is larger than a lateral dimension of the image sensor package along the first direction. An overhang portion of the removable transparent cover is defined by an exposed portion of the removable transparent cover that extends beyond a lateral side of the image sensor package along the first direction.Type: ApplicationFiled: March 9, 2015Publication date: September 15, 2016Inventors: Wei-Feng Lin, Chi-Kuei Lee
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Patent number: 9443894Abstract: An imaging package includes an image sensor package formed with a semiconductor substrate. A removable transparent cover is bonded over the image sensor package to cover a first side the image sensor package. A lateral dimension of the removable transparent cover along a first direction is larger than a lateral dimension of the image sensor package along the first direction. An overhang portion of the removable transparent cover is defined by an exposed portion of the removable transparent cover that extends beyond a lateral side of the image sensor package along the first direction.Type: GrantFiled: March 9, 2015Date of Patent: September 13, 2016Assignee: OmniVision Technologies, Inc.Inventors: Wei-Feng Lin, Chi-Kuei Lee
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Patent number: 8665364Abstract: An example reinforcement structure for protecting a wafer-level camera module includes a top sheet element and a side sheet element. The top sheet element is to be disposed over a top surface of the camera module and includes a first opening for allowing light to pass through to the camera module. The side sheet element is coupled to the top sheet element for securing the reinforcement structure to a printed circuit board (PCB). A second opening in the side sheet element is included to allow an adhesive to be dispensed through the second opening to adhere the reinforcement structure to the camera module.Type: GrantFiled: May 3, 2011Date of Patent: March 4, 2014Assignee: OmniVision Technologies, Inc.Inventors: Wei-Feng Lin, Wen-Jen Ho, Chi-Kuei Lee, Chen-Wei Tsai
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Publication number: 20140035080Abstract: The present invention provides a wafer level camera module structure comprising a chip with a sensing area. A TSV structure is formed by passing through from the top surface to the bottom surface of the chip. A transparent material is disposed on the chip, with at least one conductive via structure formed therein and a trace form thereon. A lens holder is disposed on the transparent material, and a lens is located on the top of the lens holder. The lens is substantially aligning to the transparent material and the sensing area.Type: ApplicationFiled: August 2, 2012Publication date: February 6, 2014Applicant: LARVIEW TECHNOLOGIES CORPORATIONInventor: Chi-Kuei Lee
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Publication number: 20110317065Abstract: An example reinforcement structure for protecting a wafer-level camera module includes a top sheet element and a side sheet element. The top sheet element is to be disposed over a top surface of the camera module and includes a first opening for allowing light to pass through to the camera module. The side sheet element is coupled to the top sheet element for securing the reinforcement structure to a printed circuit board (PCB). A second opening in the side sheet element is included to allow an adhesive to be dispensed through the second opening to adhere the reinforcement structure to the camera module.Type: ApplicationFiled: May 3, 2011Publication date: December 29, 2011Applicant: OMNIVISION TECHNOLOGIES, INC.Inventors: Wei-Feng Lin, Wen-Jen Ho, Chi-Kuei Lee, Chen-Wei Tsai
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Patent number: 7929033Abstract: An image sensor package includes a first substrate, an image sensor chip, a processing chip and a plurality of passive elements. The first substrate has a supporting surface and a bottom surface opposite to the supporting surface. The image sensor chip is disposed on the supporting surface and electrically connected to the first substrate. The image sensor chip package further includes a second substrate. The processing chip and the passive elements are mounted on the second substrate and electrically connected to the second substrate. The bottom surface of the first substrate defines a cavity for receiving the second substrate, the processing chip and the passive elements therein.Type: GrantFiled: July 14, 2008Date of Patent: April 19, 2011Assignee: Hon Hai Precision Industry Co., Ltd.Inventors: Chi-Kuei Lee, Ying-Cheng Wu
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Patent number: 7696465Abstract: An exemplary image sensor package includes a substrate, an imaging area, a circuit layer and two passive components. The substrate has a first surface and a second surface, which are opposite to each other. An image sensing area is formed on the first surface of the substrate and a circuit layer is formed on the second surface of the substrate. The passive components opposite to the image sensing area are soldered to the circuit layer of the second surface.Type: GrantFiled: August 14, 2008Date of Patent: April 13, 2010Assignee: Hon Hai Precision Industry Co., Ltd.Inventors: Ying-Cheng Wu, Chi-Kuei Lee, Shih-Min Wang
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Publication number: 20090283662Abstract: An exemplary image sensor package includes a substrate, an imaging area, a circuit layer and two passive components. The substrate has a first surface and a second surface, which are opposite to each other. An image sensing area is formed on the first surface of the substrate and a circuit layer is formed on the second surface of the substrate. The passive components opposite to the image sensing area are soldered to the circuit layer of the second surface.Type: ApplicationFiled: August 14, 2008Publication date: November 19, 2009Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: YING-CHENG WU, CHI-KUEI LEE, SHIH-MIN WANG
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Publication number: 20090262226Abstract: An image sensor package includes a first substrate, an image sensor chip, a processing chip and a plurality of passive elements. The first substrate has a supporting surface and a bottom surface opposite to the supporting surface. The image sensor chip is disposed on the supporting surface and electrically connected to the first substrate. The image sensor chip package further includes a second substrate. The processing chip and the passive elements are mounted on the second substrate and electrically connected to the second substrate. The bottom surface of the first substrate defines a cavity for receiving the second substrate, the processing chip and the passive elements therein.Type: ApplicationFiled: July 14, 2008Publication date: October 22, 2009Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: CHI-KUEI LEE, YING-CHENG WU