Patents by Inventor Chi-Ming Liu
Chi-Ming Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12002684Abstract: A method for CMP includes following operations. A metal stack is received. The metal layer stack includes at least a first metal layer and a second metal layer, and a top surface of the first metal layer and a top surface of the second metal layer are exposed. A protecting layer is formed over the second metal layer. A portion of the first metal layer is etched. The protecting layer protects the second metal layer during the etching of the portion of the first metal layer. A top surface of the etched first metal layer is lower than a top surface of the protecting layer. The protecting layer is removed from the second metal layer.Type: GrantFiled: November 21, 2022Date of Patent: June 4, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Ji Cui, Fu-Ming Huang, Ting-Kui Chang, Tang-Kuei Chang, Chun-Chieh Lin, Wei-Wei Liang, Liang-Guang Chen, Kei-Wei Chen, Hung Yen, Ting-Hsun Chang, Chi-Hsiang Shen, Li-Chieh Wu, Chi-Jen Liu
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Publication number: 20240170326Abstract: A manufacturing method of a semiconductor device includes at least the following steps. A sacrificial substrate is provided. An etch stop layer is formed on the sacrificial substrate. A portion of the etch stop layer is oxidized to form an oxide layer between the sacrificial substrate and the remaining etch stop layer. A capping layer is formed on the remaining etch stop layer. A device layer is formed on the capping layer. A first etching process is performed to remove the sacrificial substrate. A second etching process is performed to remove the oxide layer. A third etching process is performed to remove the remaining etch stop layer. A power rail is formed on the capping layer opposite to the device layer.Type: ApplicationFiled: January 25, 2024Publication date: May 23, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chi-Ming Chen, Kuei-Ming Chen, Po-Chun Liu, Chung-Yi Yu, Chia-Shiung Tsai
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Publication number: 20240113607Abstract: A resonant vibration actuator is provided, comprising: a casing, a mover, a plurality of electromagnet sets, two elastic suspensions, and a connecting circuit; the casing is provided with connection terminals for connection on the outside; the mover comprising: a mover frame, a plurality of permanent magnet units, two magnetic backs, the permanent magnet units and the magnetic backs being arranged in the mover frame; the electromagnet sets being arranged between two permanent magnet units of the mover; the elastic suspensions being connected to the casing and the mover respectively through two connection portions at both ends; the connecting circuit being used to connect the electromagnet set and the connection terminals outside the casing; wherein, by energizing the electromagnet set, the electromagnet acts on the permanent magnet unit to make the mover move relatively in the casing to generate vibration.Type: ApplicationFiled: November 16, 2022Publication date: April 4, 2024Inventors: Chin-Sung Liu, Hsiao-Ming Chien, Chi-Ling Chang, Shin-Ter Tsai
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Patent number: 11923237Abstract: A manufacturing method of a semiconductor device includes at least the following steps. A sacrificial substrate is provided. An epitaxial layer is formed on the sacrificial substrate. An etch stop layer is formed on the epitaxial layer. Carbon atoms are implanted into the etch stop layer. A capping layer and a device layer are formed on the etch stop layer. A handle substrate is bonded to the device layer. The sacrificial substrate, the epitaxial layer, and the etch stop layer having the carbon atoms are removed from the handle substrate.Type: GrantFiled: August 30, 2021Date of Patent: March 5, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chi-Ming Chen, Kuei-Ming Chen, Po-Chun Liu, Chung-Yi Yu, Chia-Shiung Tsai
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Patent number: 11921430Abstract: A lithography method to pattern a first semiconductor wafer is disclosed. An optical mask is positioned over the first semiconductor wafer. A first region of the first semiconductor wafer is patterned by directing light from a light source through transparent regions of the optical mask. A second region of the first semiconductor wafer is patterned by directing energy from an energy source to the second region, wherein the patterning of the second region comprises direct-beam writing.Type: GrantFiled: July 25, 2022Date of Patent: March 5, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITEDInventors: Tsiao-Chen Wu, Chi-Ming Yang, Hsu-Shui Liu
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Patent number: 11921001Abstract: A method and system for inspecting deviation in dynamic characteristics of a feeding system are provided, and the method includes: exciting the feeding system and detecting vibrations of a subcomponent of a component to be inspected of the feeding system to generate a monitoring excitation signal in a monitoring mode; calculating, by a modal analysis method, monitoring eigenvalues and monitoring eigenvectors of the monitoring excitation signal; determining, by a modal verification method, similarity between the monitoring eigenvalues and standard eigenvalues of a digital twin model and similarity between the monitoring eigenvectors and standard eigenvectors of the digital twin model; determining that the dynamic characteristics of the subcomponent are deviated, when the monitoring eigenvalues and monitoring eigenvectors are not similar to the standard eigenvalues and standard eigenvectors. Therefore, the subcomponent whose dynamic characteristics are deviated can be sensed remotely and precisely.Type: GrantFiled: March 11, 2022Date of Patent: March 5, 2024Assignee: Hiwin Technologies Corp.Inventors: Hsien-Yu Chen, Yu-Sheng Chiu, Chih-Chun Cheng, Wen-Nan Cheng, Chi-Ming Liu
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Publication number: 20230320041Abstract: A server device includes a chassis, plural fan modules and a controller. The fan modules are adapted to be installed in the chassis in a hot-swappable manner. The controller is configured to reduce a fan speed of each fan module in the chassis from a target speed to a temporary speed in response to a fan module insertion event, and then to increase the fan speed of each fan module to the target speed after a predetermined time elapses.Type: ApplicationFiled: February 2, 2023Publication date: October 5, 2023Inventor: Chi Ming LIU
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Publication number: 20230288290Abstract: A method and system for inspecting deviation in dynamic characteristics of a feeding system are provided, and the method includes: exciting the feeding system and detecting vibrations of a subcomponent of a component to be inspected of the feeding system to generate a monitoring excitation signal in a monitoring mode; calculating, by a modal analysis method, monitoring eigenvalues and monitoring eigenvectors of the monitoring excitation signal; determining, by a modal verification method, similarity between the monitoring eigenvalues and standard eigenvalues of a digital twin model and similarity between the monitoring eigenvectors and standard eigenvectors of the digital twin model; determining that the dynamic characteristics of the subcomponent are deviated, when the monitoring eigenvalues and monitoring eigenvectors are not similar to the standard eigenvalues and standard eigenvectors. Therefore, the subcomponent whose dynamic characteristics are deviated can be sensed remotely and precisely.Type: ApplicationFiled: March 11, 2022Publication date: September 14, 2023Inventors: Hsien-Yu CHEN, Yu-Sheng CHIU, Chih-Chun CHENG, Wen-Nan CHENG, Chi-Ming LIU
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Patent number: 9448474Abstract: A positive photosensitive resin composition, a pattern forming method, a thin film transistor array substrate, and a liquid crystal display device are provided. The positive photosensitive resin includes a novolac resin (A), an alkali-soluble resin (B), an ester (C) of an o-naphthoquinone diazide sulfonic acid, and a solvent (D). The alkali-soluble resin (B) includes a first alkali-soluble resin (B-1) produced by polymerizing a mixture. The mixture includes an epoxy compound (i) and a compound (ii), wherein the epoxy compound (i) has at least two epoxy groups, and the compound (ii) has at least one carboxylic acid group and at least one ethylenically unsaturated group.Type: GrantFiled: November 27, 2014Date of Patent: September 20, 2016Assignee: Chi Mei CorporationInventors: Chi-Ming Liu, Chun-An Shih
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Patent number: 9422748Abstract: The present invention discloses a lock and the application thereof. The lock is applied on a base having an inner surface and an outer surface. The lock comprises a locking plate and a motion module. The motion module has a curved surface facing the locking plate. The curved surface has a first surface and a second surface. A main feature of the present invention is that the lock has a close status and a far status. The locking plate contacts with the first surface and has a first distance from the base in the close status, and contacts with the second surface of the base and has a second distance, which is greater than the first distance, from the base in the far status. The invention has the advantages of low cost and simplicity, and solves the long lasting problem of the prior arts.Type: GrantFiled: May 2, 2013Date of Patent: August 23, 2016Assignee: CELESTICA TECHNOLOGY CONSULTANCY (SHANGHAI) CO., LTD.Inventor: Chi-Ming Liu
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Patent number: 9395627Abstract: The present invention relates to a positive photosensitive resin composition and a method for forming a pattern by using the same. The positive photosensitive resin composition includes a novolac resin (A), a polysiloxane (B), an ortho-naphthoquinone diazide sulfonic acid ester (C) and a solvent (D). The novolac resin (A) includes a xylenol-type novolac resin (A-1). The xylenol-type novolac resin (A-1) is synthesized by polycondensing an aldehyde compound with a xylenol compound.Type: GrantFiled: September 3, 2014Date of Patent: July 19, 2016Assignee: CHI MEI CORPORATIONInventors: Chi-Ming Liu, Chun-An Shih
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Publication number: 20150160554Abstract: A positive-type photosensitive resin composition, a pattern forming method, a thin film transistor array substrate, and a liquid crystal display device are provided. The positive-type photosensitive resin includes a novolac resin (A), an alkali-soluble resin (B), an ester (C) of an o-naphthoquinone diazide sulfonic acid, and a solvent (D). The alkali-soluble resin (B) includes a first alkali-soluble resin (B-1) produced by polymerizing a mixture. The mixture includes an epoxy compound (i) and a compound (ii), wherein the epoxy compound (i) has at least two epoxy groups, and the compound (ii) has at least one carboxylic acid group and at least one ethylenically unsaturated group.Type: ApplicationFiled: November 27, 2014Publication date: June 11, 2015Inventors: Chi-Ming Liu, Chun-An Shih
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Publication number: 20150072275Abstract: The present invention relates to a positive photosensitive resin composition and a method for forming a pattern by using the same. The positive photosensitive resin composition includes a novolac resin (A), a polysiloxane (B), an ortho-naphthoquinone diazide sulfonic acid ester (C) and a solvent (D). The novolac resin (A) includes a xylenol-type novolac resin (A-1). The xylenol-type novolac resin (A-1) is synthesized by polycondensing an aldehyde compound with a xylenol compound.Type: ApplicationFiled: September 3, 2014Publication date: March 12, 2015Inventors: Chi-Ming LIU, Chun-An SHIH
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Publication number: 20140242504Abstract: The present invention relates to a positive photosensitive resin composition and a method for forming patterns by using the same. The positive photosensitive resin composition includes a novolac resin (A), an ortho-naphthoquinone diazide sulfonic acid ester (B), a hydroxycompound (C) and a solvent (D). The novolac resin (A) further includes a hydroxy-type novolac resin (A-1) and a xylenol-type novolac resin (A-2). The hydroxy-type novolac resin (A-1) is synthesized by condensing hydroxyl benzaldehyde compound with aromatic hydroxyl compound. The xylenol-type novolac resin (A-2) is synthesized by condensing aldehyde compound with xylenol compound. The postbaked positive photosensitive resin composition can be beneficially formed to patterns with high film thickness and well cross-sectional profile.Type: ApplicationFiled: February 19, 2014Publication date: August 28, 2014Applicant: CHI MEI CORPORATIONInventors: Chi-Ming LIU, Chun-An SHIH
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Publication number: 20130130869Abstract: A platform for supporting a conveyor belt of a treadmill includes a wooden plate, a reinforcement plate above the wooden plate, and a shock-absorbing plate sandwiched between the wooden plate and the reinforcement plate. The shock-absorbing plate has a surface facing the wooden plate base, and a plurality of cushions protruding from the surface and stopping against the wooden plate for providing good elastic support force and cushion effect.Type: ApplicationFiled: November 22, 2011Publication date: May 23, 2013Inventors: Kuang-Hua Hou, Hung Yang, Chi-ming Liu, Terry Chen, Ren Chiu, Fong-chiao Chung
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Publication number: 20130130868Abstract: A hardness adjustable platform for supporting a conveyor belt of a treadmill includes a platform body having internal spaces, and a plurality of elastic fillers moveably and respectively disposed in the internal spaces of the platform body for providing a cushion effect. The fillers are moveable relative to the platform body by an external force and divide the platform body into first and second regions having different hardness. As a result, the runner who uses the treadmill equipped with the aforesaid platform may adjust the positions of the fillers according to his/her physical condition and running speed to change the hardness distribution of the platform so as to enhance his/her running efficiency and reduce the risk of exercise injury.Type: ApplicationFiled: November 22, 2011Publication date: May 23, 2013Inventors: Kuang-Hua HOU, Hung Yang, Chi-ming Liu, Terry Chen, Ren Chiu, Fong-chiao Chung
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Publication number: 20120328799Abstract: A photosensitive resin composition and a method for forming patterns by using the same are disclosed. The photosensitive resin composition comprises a novolac resin (A), an ortho-naphthoquinone diazide sulfonic acid ester (B) and a ketol solvent (C). The novolac resin (A) includes a high-ortho novolac resin (A-1) that has ortho-ortho methylene bonding to all methylene bonding in a ratio of 18% to 25%, and a weight ratio (A-1)/(C) of the high-ortho novolac resin (A-1) to the ketol solvent (C) is 0.1 to 2.0, thereby exhibiting excellent temporal stability and further forming patterns with superior film to thickness uniformity and high resolution.Type: ApplicationFiled: June 8, 2012Publication date: December 27, 2012Applicant: CHI MEI CORPORATIONInventors: Chi-Ming LIU, Chun-An SHIH
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Publication number: 20120287393Abstract: A positive photosensitive resin composition and a method for forming patterns by using the same are disclosed. The photosensitive resin composition comprises a novolac resin (A), an ortho-naphthoquinone diazide sulfonic acid ester (B), a dye (C) and a solvent (D). The novolac resin (A) includes a high-ortho novolac resin (A-1) that has ortho-ortho methylene bonding to all methylene bonding in a ratio of 18% to 25%, thereby exhibiting excellent temporal stability and forming patterns with high resolution.Type: ApplicationFiled: April 26, 2012Publication date: November 15, 2012Applicant: CHI MEI COOPERATIONInventors: Chi-Ming LIU, Chun-An SHIH
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Patent number: 6747471Abstract: A method and apparatus for estimating burn-in time for integrated circuit die on a wafer employs a reliability testing structure placed in a scribe line area of a wafer to permit improved estimation of burn-in time for integrated circuit on a wafer. Each reliability testing structure has a plurality of evaluation device structures formed on the substrate. Groups of the evaluation device structures are stacked on the surface of the substrate. The device structures are created to permit evaluation of one of a plurality of failure mechanisms of the integrated circuit. A forcing input pad and a sensing output pad are connected through a selection circuit to at least one of the evaluation devices. The selection circuit selects which of the evaluation devices are to receive a stimulus and to transmit a response. The stimulus is activated and the substrate is then stressed.Type: GrantFiled: January 10, 2002Date of Patent: June 8, 2004Assignee: Taiwan Semiconductor Manufacturing CompanyInventors: Kuo-Tso Chen, Chi-Ming Liu