Patents by Inventor Chi-Shi Chen
Chi-Shi Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240170230Abstract: A method for prelithiating a soft carbon negative electrode includes the steps of: disposing the soft carbon negative electrode and a lithium metal piece spaced apart from each other with a lithium-containing electrolyte present therebetween; prelithiating the soft carbon negative electrode at a first constant C-rate until a voltage thereof is reduced to a first predetermined voltage not greater than 0.3 V vs. Li/Li+, the first constant C-rate being not greater than 5 C; prelithiating the soft carbon negative electrode at a second constant C-rate until the voltage thereof is reduced to a second predetermined voltage lower than the first predetermined voltage, the second constant C-rate being not greater than 0.2 C and being less than the first constant C-rate; and prelithiating the soft carbon negative electrode at a prelithiation constant voltage which is not greater than the second predetermined voltage, thereby completing prelithiation of the soft carbon negative electrode.Type: ApplicationFiled: January 13, 2023Publication date: May 23, 2024Inventors: Yan-Shi CHEN, Guo-Hsu LU, Chi-Chang HU, Chih-Yu KU, Tien-Yu YI
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Patent number: 8399303Abstract: The present invention provides a method for manufacturing a modularized integrated circuit (IC). The method includes the following steps: providing a base; and coupling an input/output module with the base. The base includes a lead-frame and a first package. The first package covers the lead-frame but exposes first contact points. The input/output module includes a first substrate, a plurality of first conducting columns, and a plurality of third contact points. A portion of each of the third contact points is electrically connected to a corresponding one of the first contact points. The method enhances the flexibility of IC design, and reduces the time and costs of developing new process techniques.Type: GrantFiled: December 1, 2011Date of Patent: March 19, 2013Assignee: National Chip Implementation Center National Applied Research LaboratoriesInventors: Chun-Ming Huang, Chi-Sheng Lin, Chi-Shi Chen, Chien-Ming Wu
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Patent number: 8274794Abstract: A three-dimensional SoC structure formed by stacking multiple chip modules is provided. The three-dimensional SoC structure includes at least two vertical SoC modules and at least one connector module, wherein each connector module electrically connects two vertical SoC modules. Each vertical SoC module is constructed by stacking at least two chip modules vertically. Each chip module includes a module circuit board and at least one preset element. A recess is formed in each module circuit board and provided with a first connecting interface for electrically connecting with the corresponding at least one preset element. The at least two vertical SoC modules are connected by the connector module to form a three-dimensional SoC structure with multiple functions. Besides, the recesses formed in the module circuit boards provide effective heat dissipation paths for the preset elements.Type: GrantFiled: April 1, 2010Date of Patent: September 25, 2012Assignee: National Chip Implementation Center National Applied Research LaboratoriesInventors: Chun-Ming Huang, Chin-Long Wey, Chien-Ming Wu, Chih-Chyau Yang, Shih-Lun Chen, Chi-Shi Chen, Chi-Sheng Lin
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Patent number: 8199510Abstract: A multi-layer system-on-chip (SoC) module structure is provided. The multi-layer SoC module structure includes at least two circuit board module layers and at least one connector module layer. Each connector module layer is sandwiched between and thus electrically connects two circuit board module layers such that the SoC module structure is formed by stacking. Each circuit board module layer is composed of at least one circuit board module while each connector module layer is composed of at least one connector module. Hence, the SoC module structure can be manufactured as a three-dimensional structure, thus allowing highly flexible connections within the SoC module structure.Type: GrantFiled: January 12, 2010Date of Patent: June 12, 2012Assignees: National Chip Implementation Center, National Applied Research LaboratoriesInventors: Chun-Ming Huang, Chien-Ming Wu, Chih-Chyau Yang, Shih-Lun Chen, Chin-Long Wey, Chi-Shi Chen, Chi-Sheng Lin
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Publication number: 20110188210Abstract: A three-dimensional SoC structure formed by stacking multiple chip modules is provided. The three-dimensional SoC structure includes at least two vertical SoC modules and at least one connector module, wherein each connector module electrically connects two vertical SoC modules. Each vertical SoC module is constructed by stacking at least two chip modules vertically. Each chip module includes a module circuit board and at least one preset element. A recess is formed in each module circuit board and provided with a first connecting interface for electrically connecting with the corresponding at least one preset element. The at least two vertical SoC modules are connected by the connector module to form a three-dimensional SoC structure with multiple functions. Besides, the recesses formed in the module circuit boards provide effective heat dissipation paths for the preset elements.Type: ApplicationFiled: April 1, 2010Publication date: August 4, 2011Applicant: National Chip Implementation Center National Applied Research LaboratoriesInventors: Chun-Ming Huang, Chin-Long Wey, Chien-Ming Wu, Chih-Chyau Yang, Shih-Lun Chen, Chi-Shi Chen, Chi-Sheng Lin
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Publication number: 20110096506Abstract: A multi-layer system-on-chip (SoC) module structure is provided. The multi-layer SoC module structure includes at least two circuit board module layers and at least one connector module layer. Each connector module layer is sandwiched between and thus electrically connects two circuit board module layers such that the SoC module structure is formed by stacking. Each circuit board module layer is composed of at least one circuit board module while each connector module layer is composed of at least one connector module. Hence, the SoC module structure can be manufactured as a three-dimensional structure, thus allowing highly flexible connections within the SoC module structure.Type: ApplicationFiled: January 12, 2010Publication date: April 28, 2011Applicant: National Chip Implementation Center National Applied Research LaboratoriesInventors: Chun-Ming Huang, Chien-Ming Wu, Chih-Chyau Yang, Shih-Lun Chen, Chin-Long Wey, Chi-Shi Chen, Chi-Sheng Lin
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Publication number: 20100330741Abstract: A fabrication method for a system-on-chip (SoC) module is provided. The fabrication method includes the steps of providing at least two SoC sub-modules and connecting the SoC sub-modules. The SoC sub-modules are electrically connected with each other by connection interfaces of the SoC sub-modules so as to form the SoC module. As the SoC sub-modules have been verified in advance, the time required for verifying the resulting SoC module can be significantly reduced. As for application-specific SoC modules, they are fabricated by connecting with application-specific SoC sub-modules via the appropriate connection interfaces. Thus, the time and costs for developing SoC modules can both be minimized.Type: ApplicationFiled: September 30, 2009Publication date: December 30, 2010Applicant: National Chip Implementation Center National Applied Research Laboratories.Inventors: Chun-Ming Huang, Chien-Ming Wu, Chih-Chyau Yang, Shih-Lun Chen, Chin-Long Wey, Chi-Shi Chen, Chi-Sheng Lin