Abstract: The present disclosure relates to an integrated chip. The integrated chip includes a substrate having one or more interior surfaces forming a recess within an upper surface of the substrate. Source/drain regions are disposed within the substrate on opposing sides of the recess. A first gate dielectric is arranged along the one or more interior surfaces forming the recess, and a second gate dielectric is arranged on the first gate dielectric and within the recess. A gate electrode is disposed on the second gate dielectric. The second gate dielectric includes one or more protrusions that extend outward from a recessed upper surface of the second gate dielectric and that are arranged along opposing sides of the second gate dielectric.

Abstract: A radio frequency (RF) front-end system and a method for reducing interference are provided. The RF front-end system includes a processing circuit, a first transceiver, an RF front-end circuit, and a first antenna. The RF front-end circuit includes a first switch circuit, a first filter circuit, and a second switch circuit. The first switch circuit and the second switch circuit respectively include first signal paths and second signal paths. The first filter circuit includes an all-pass circuit corresponding to a first frequency band and a first channel filter corresponding to a first frequency channel. The processing circuit executes an anti-interference process, including: switching to the all-pass circuit; executing a channel sounding process to determine usage statuses of a plurality of channels; executing an automatic channel selection process to select a target channel; and switching to the target channel, and controlling the first transceiver to perform signal transmission.

Abstract: An electronic device includes a substrate, at least one electronic element and a heat dissipating electromagnetic shielding structure. The heat dissipating electromagnetic shielding structure is disposed on the substrate and covers the at least one electronic element, wherein the heat dissipating electromagnetic shielding structure includes a shielding frame and a heatsink. The shielding frame includes a plurality of spring members. The spring members are bent toward the substrate and partially abut against the heatsink. When the heatsink and the shielding frame are correspondingly arranged, a shielding space is defined, the electronic element is disposed in the shielding space, and a heat generated by the at least one electronic element is conducted out of the shielding space via the heatsink.

Abstract: An electronic device includes a substrate, at least one electronic element and a heat dissipating electromagnetic shielding structure. The heat dissipating electromagnetic shielding structure is disposed on the substrate and covers the at least one electronic element, wherein the heat dissipating electromagnetic shielding structure includes a shielding frame and a heatsink. The shielding frame includes a plurality of spring members. The spring members are bent toward the substrate and partially abut against the heatsink. When the heatsink and the shielding frame are correspondingly arranged, a shielding space is defined, the electronic element is disposed in the shielding space, and a heat generated by the at least one electronic element is conducted out of the shielding space via the heatsink.

Abstract: A plug-and-play device is provided. The plug-and-play device includes a device housing, a circuit board, a joint and an electromagnetic shielding frame. The circuit board is disposed in the device housing, including a substrate and a plurality of transmission pins, wherein the transmission pins are formed on the substrate. The transmission pins are connected to the joint. The electromagnetic shielding frame covers the transmission pins.

Abstract: A touch structure is provided. The touch structure includes a first sensing electrode, a second sensing electrode, a first dummy pattern and a second dummy pattern. The first sensing electrode and the second sensing electrode are arranged in a staggered manner and electrically insulated from each other. The first dummy pattern is adjacent to the first sensing electrode and has a first pattern acute angle. The second dummy pattern is adjacent to the second sensing electrode and has a second pattern acute angle. The first dummy pattern and the second dummy pattern are separated from each other. The first pattern acute angle and the second pattern acute angle are faced toward the same overlapped portion between the first sensing electrode and the second sensing electrode substantially.

Abstract: A plug and play unit is provided. The plug and play unit includes a unit housing, a joint, a substrate and a heat conductive member. The joint is connected to the unit housing. The substrate is disposed in the unit housing and the joint, wherein the substrate includes a heat conductive layer and a USB connection port. The heat conductive member thermally connects the joint to the heat conductive layer to transmit heat from the heat conductive layer to the joint.

Abstract: An optical touch module and a data loading method thereof are provided. The optical touch module includes a first system-on-chip (SoC), a second SoC and a storage element. The first and the second SoCs are electrically connected to each other and disposed around a touch region of a substrate. The first and the second SoCs each include an image sensor for sensing an image of the touch region. The storage element is electrically connected to the first SoC. The first SoC reads first data and second data stored in the storage element and transmits the second data to the second SoC. The first and the second SoCs respectively process the image of the touch region according to the first data and the second data.