Patents by Inventor Chi Wei Liu

Chi Wei Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240178091
    Abstract: In an embodiment, a device includes: an integrated circuit die; an encapsulant at least partially surrounding the integrated circuit die, the encapsulant including fillers having an average diameter; a through via extending through the encapsulant, the through via having a lower portion of a constant width and an upper portion of a continuously decreasing width, a thickness of the upper portion being greater than the average diameter of the fillers; and a redistribution structure including: a dielectric layer on the through via, the encapsulant, and the integrated circuit die; and a metallization pattern having a via portion extending through the dielectric layer and a line portion extending along the dielectric layer, the metallization pattern being electrically coupled to the through via and the integrated circuit die.
    Type: Application
    Filed: February 7, 2024
    Publication date: May 30, 2024
    Inventors: Tzu-Sung Huang, Ming Hung Tseng, Yen-Liang Lin, Hao-Yi Tsai, Chi-Ming Tsai, Chung-Shi Liu, Chih-Wei Lin, Ming-Che Ho
  • Publication number: 20240118135
    Abstract: An information handling system includes a display panel having an active area that generates visual images and an inactive area disposed outside the active area. The inactive area having an alignment mark that is invisible to a naked eye.
    Type: Application
    Filed: October 7, 2022
    Publication date: April 11, 2024
    Inventors: Hong-Ji Huang, Yu-Chen Liu, Kuo-Wei Tseng, Chun-Wei Huang, Chi-Fong Lee
  • Patent number: 11935804
    Abstract: In an embodiment, a device includes: an integrated circuit die; an encapsulant at least partially surrounding the integrated circuit die, the encapsulant including fillers having an average diameter; a through via extending through the encapsulant, the through via having a lower portion of a constant width and an upper portion of a continuously decreasing width, a thickness of the upper portion being greater than the average diameter of the fillers; and a redistribution structure including: a dielectric layer on the through via, the encapsulant, and the integrated circuit die; and a metallization pattern having a via portion extending through the dielectric layer and a line portion extending along the dielectric layer, the metallization pattern being electrically coupled to the through via and the integrated circuit die.
    Type: Grant
    Filed: April 10, 2023
    Date of Patent: March 19, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tzu-Sung Huang, Ming Hung Tseng, Yen-Liang Lin, Hao-Yi Tsai, Chi-Ming Tsai, Chung-Shi Liu, Chih-Wei Lin, Ming-Che Ho
  • Publication number: 20240086272
    Abstract: The present disclosure relates to a system, a method and a computer-readable medium for anomaly detection. The method includes obtaining latency data of a first endpoint, obtaining latency data of a second endpoint, generating, by a representation learning model, reconstruction error distribution data of the latency data of the first endpoint according to the latency data of the first endpoint and the latency data of the second endpoint, obtaining new latency data of the first endpoint, obtaining new latency data of the second endpoint, generating, by the representation learning model, a reconstruction error of the new latency data of the first endpoint according to the new latency data of the first endpoint and the new latency data of the second endpoint, and generating an anomaly score for the first endpoint according to a dispersion characteristic of the reconstruction error distribution data and the reconstruction error.
    Type: Application
    Filed: June 21, 2023
    Publication date: March 14, 2024
    Inventors: Chi-Wei LIN, Chin-Wei LIU
  • Patent number: 11357145
    Abstract: A picking apparatus is configured to pick up a plurality of micro elements. The picking apparatus includes a main body and a plurality of picking portions. The picking portions connect with and protrude from the main body. Each of the picking portions has a first surface. The first surfaces are away from the main body and configured to pick up the micro elements. The main body has a second surface at least partially located between the picking portions. Each of the first surfaces has a first viscosity. The second surface has a second viscosity. The second viscosity is less than the first viscosity.
    Type: Grant
    Filed: November 25, 2019
    Date of Patent: June 7, 2022
    Assignee: Lextar Electronics Corporation
    Inventors: Chi-Wei Liu, Fu-Hsin Chen, Yu-Chun Lee
  • Publication number: 20210120711
    Abstract: A picking apparatus is configured to pick up a plurality of micro elements. The picking apparatus includes a main body and a plurality of picking portions. The picking portions connect with and protrude from the main body. Each of the picking portions has a first surface. The first surfaces are away from the main body and configured to pick up the micro elements. The main body has a second surface at least partially located between the picking portions. Each of the first surfaces has a first viscosity. The second surface has a second viscosity. The second viscosity is less than the first viscosity.
    Type: Application
    Filed: November 25, 2019
    Publication date: April 22, 2021
    Inventors: Chi-Wei LIU, Fu-Hsin CHEN, Yu-Chun LEE
  • Patent number: 10902767
    Abstract: A driving circuit of display apparatus includes an operational amplifier (OP), comprising a plurality of input terminals; a digital-to-analog converter (DAC); a multiplexer, coupled to the OP and the DAC, comprising a plurality of switches; and a boosting module, configured to decrease an equivalent time constant between the DAC and the OP to increase an output slew rate of the OP in a boosting period; wherein the boosting period is enabled before a steady state of the OP.
    Type: Grant
    Filed: December 26, 2019
    Date of Patent: January 26, 2021
    Assignee: NOVATEK Microelectronics Corp.
    Inventors: Tsung-Hau Chang, Chi-Wei Liu, Ping Chen
  • Patent number: 9385260
    Abstract: A method for forming thin film solar cell materials introducing a first inert gas mixture that includes hydrogen selenide into a chamber at a first pressure value until the chamber reaches a second pressure value and at a first temperature value, wherein the second pressure value is a predefined percentage of the first pressure value. The temperature in the chamber is increased to a second temperature value for a selenization process so that the pressure in the chamber increases to a third pressure value. Residual gas that is generated during the selenization process can be removed from the chamber. A second inert gas mixture that includes hydrogen sulfide is added into the chamber until the chamber reaches a fourth pressure value. The temperature in the chamber is increased to a third temperature value for a sulfurization process. The chamber is cooled after the sulfurization process.
    Type: Grant
    Filed: July 10, 2013
    Date of Patent: July 5, 2016
    Assignee: TSMC Solar Ltd.
    Inventors: Kwang-Ming Lin, Chi-Wei Liu, Wen-Cheng Kuo
  • Publication number: 20150017757
    Abstract: A method for forming thin film solar cell materials introducing a first inert gas mixture that includes hydrogen selenide into a chamber at a first pressure value until the chamber reaches a second pressure value and at a first temperature value, wherein the second pressure value is a predefined percentage of the first pressure value. The temperature in the chamber is increased to a second temperature value for a selenization process so that the pressure in the chamber increases to a third pressure value. Residual gas that is generated during the selenization process can be removed from the chamber. A second inert gas mixture that includes hydrogen sulfide is added into the chamber until the chamber reaches a fourth pressure value. The temperature in the chamber is increased to a third temperature value for a sulfurization process. The chamber is cooled after the sulfurization process.
    Type: Application
    Filed: July 10, 2013
    Publication date: January 15, 2015
    Inventors: Kwang-Ming LIN, Chi-Wei LIU, Wen-Cheng KUO
  • Patent number: 7539792
    Abstract: A stream data buffer device suitable for a client program comprises a buffer having N numbered sub-buffers, a buffer agent having a sub-buffer table recording a state of a corresponding sub-buffer, wherein the state comprising a first state and a second state, and a FIFO queue to record numbers of the sub-buffers having the fist state. When client program receives and stores stream data to stream data buffer, client program requests for a first sub-buffer having second state to store, and after storage, buffer agent changes the state of first sub-buffer to first state and transmits the number of the first sub-buffer to the FIFO queue. When a number of a second sub-buffer having the first state is available, the client program pops the number of second sub-buffer out of FIFO queue and accesses the data thereof, and the buffer agent changes the state of second sub-buffer to second state.
    Type: Grant
    Filed: March 27, 2006
    Date of Patent: May 26, 2009
    Assignee: Lite-On Technology Corporation
    Inventor: Chi Wei Liu
  • Publication number: 20060288135
    Abstract: A stream data buffer device suitable for a client program comprises a buffer having N numbered sub- buffers, a buffer agent having a sub-buffer table recording a state of a corresponding sub-buffer, wherein the state comprising a first state and a second state, and a FIFO queue to record numbers of the sub-buffers having the fist state. When client program receives and stores stream data to stream data buffer, client program requests for a first sub-buffer having second state to store, and after storage, buffer agent changes the state of first sub-buffer to first state and transmits the number of the first sub-buffer to the FIFO queue. When a number of a second sub-buffer having the first state is available, the client program pops the number of second sub-buffer out of FIFO queue and accesses the data thereof, and the buffer agent changes the state of second sub-buffer to second state.
    Type: Application
    Filed: March 27, 2006
    Publication date: December 21, 2006
    Applicant: LITE-ON TECHNOLOGY CORPORATION
    Inventor: Chi Wei Liu