Patents by Inventor Chi-Xiang Tseng
Chi-Xiang Tseng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20140231836Abstract: The present disclosure provides a light emitting diode (LED) apparatus. The LED apparatus includes an LED emitter having a top surface; and a phosphor feature disposed on the LED emitter. The phosphor feature includes a first phosphor film disposed on the top surface of the LED emitter and having a first dimension defined in a direction parallel to the top surface of the LED emitter; a second phosphor film disposed on the first phosphor film and having a second dimension defined in the direction; and the second dimension is substantially less than the first dimension.Type: ApplicationFiled: April 25, 2014Publication date: August 21, 2014Applicant: TSMC Solid State Lighting Ltd.Inventors: Chi Xiang Tseng, Hsiao-Wen Lee, Tien-Ming Lin, Min-Sheng Wu
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Patent number: 8765500Abstract: The present disclosure involves a method of packaging a light-emitting diode (LED). According to the method, a group of metal pads and a group of LEDs are provided. The group of LEDs is attached to the group of metal pads, for example through a bonding process. After the LEDs are attached to the metal pads, each LED is spaced apart from adjacent LEDs. Also according to the method, a phosphor film is coated around the group of LEDs collectively. The phosphor film is coated on top and side surfaces of each LED and between adjacent LEDs. A dicing process is then performed to slice through portions of the phosphor film located between adjacent LEDs. The dicing process divides the group of LEDs into a plurality of individual phosphor-coated LEDs.Type: GrantFiled: August 24, 2012Date of Patent: July 1, 2014Assignee: TSMC Solid State Lighting Ltd.Inventors: Chi-Xiang Tseng, Hsiao-Wen Lee, Min-Sheng Wu, Tien-Ming Lin
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Patent number: 8757845Abstract: The present disclosure provides one embodiment of an illumination structure. The illumination structure includes a light-emitting diode (LED) device on a substrate; a lens secured on the substrate and over the LED device; and a diffuser cap secured on the substrate and covering the lens, wherein the lens and diffuser cap are designed and configured to redistribute emitting light from the LED device for wide angle illumination.Type: GrantFiled: July 29, 2011Date of Patent: June 24, 2014Assignee: TSMC Solid State Lighting, Ltd.Inventors: Chi Xiang Tseng, Hsiao-Wen Lee, Sheng-Shin Guo, Pei-Wen Ko, Chih-Hsuan Sun, Wei-Yu Yeh
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Publication number: 20140151725Abstract: The present disclosure involves a method of packaging a light-emitting diode (LED). According to the method, a group of metal pads and a group of LEDs are provided. The group of LEDs is attached to the group of metal pads, for example through a bonding process. After the LEDs are attached to the metal pads, each LED is spaced apart from adjacent LEDs. Also according to the method, a phosphor film is coated around the group of LEDs collectively. The phosphor film is coated on top and side surfaces of each LED and between adjacent LEDs. A dicing process is then performed to slice through portions of the phosphor film located between adjacent LEDs. The dicing process divides the group of LEDs into a plurality of individual phosphor-coated LEDs.Type: ApplicationFiled: February 7, 2014Publication date: June 5, 2014Applicant: TSMC Solid State Lighting Ltd.Inventors: Chi-Xiang Tseng, Hsiao-Wen Lee, Min-Sheng Wu, Tien-Min Lin
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Publication number: 20140151740Abstract: An optical emitter includes micro-structure phosphor coating on a light-emitting diode die mounted on a package substrate. The micro-structures are transferred onto a micro-structure phosphor coating precursor by patterning and curing the precursor or by curing the precursor through a mold. The micro-structures are half spheroids, three-sided pyramids, or six-sided pyramids.Type: ApplicationFiled: February 7, 2014Publication date: June 5, 2014Applicant: TSMC Solid State Lighting Ltd.Inventors: Chi Xiang Tseng, Hsiao-Wen Lee
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Publication number: 20140103372Abstract: The present disclosure involves a method of packaging light-emitting diodes (LEDs). According to the method, a plurality of LEDs is provided over an adhesive tape. The adhesive tape is disposed on a substrate. In some embodiments, the substrate may be a glass substrate, a silicon substrate, a ceramic substrate, and a gallium nitride substrate. A phosphor layer is coated over the plurality of LEDs. The phosphor layer is then cured. The tape and the substrate are removed after the curing of the phosphor layer. A replacement tape is then attached to the plurality of LEDs. A dicing process is then performed to the plurality of LEDs after the substrate has been removed. The removed substrate may then be reused for a future LED packaging process.Type: ApplicationFiled: December 26, 2013Publication date: April 17, 2014Applicant: TSMC Solid State Lighting Ltd.Inventors: Chi-Xiang Tseng, Hsiao-Wen Lee, Min-Sheng Wu, Tien-Min Lin
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Publication number: 20140106488Abstract: The present disclosure provides a light emitting diode (LED) apparatus. The LED apparatus includes an LED emitter having a top surface; and a phosphor feature disposed on the LED emitter. The phosphor feature includes a first phosphor film disposed on the top surface of the LED emitter and having a first dimension defined in a direction parallel to the top surface of the LED emitter; a second phosphor film disposed on the first phosphor film and having a second dimension defined in the direction; and the second dimension is substantially less than the first dimension.Type: ApplicationFiled: December 26, 2013Publication date: April 17, 2014Inventors: Chi Xiang Tseng, Hsiao-Wen Lee, Tien-Ming Lin, Min-Sheng Wu
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Publication number: 20140091329Abstract: The present disclosure involves a lighting instrument. The lighting instrument includes a board or substrate, for example, a printed circuit board substrate. The lighting instrument includes a plurality of light-emitting diode (LED) dies disposed on the substrate. The LED dies are spaced apart from one another. Each LED die is covered with a respective individual phosphor coating that is coated around the LED die conformally. Due at least in part to the individual phosphor coatings, the LED dies and the lighting instrument may assume a substantially white appearance in an off state. The lighting instrument also includes an encapsulation structure disposed over the substrate. The encapsulation structure may be a diffuser cap that encapsulates the light-emitting dies within. A diffuser gel fills the space between the encapsulation structure and the LED dies.Type: ApplicationFiled: September 28, 2012Publication date: April 3, 2014Applicant: TSMC Solid State Lighting Ltd.Inventors: Hsiao-Wen Lee, Chi-Xiang Tseng, Yu-Sheng Tang, Jung-Tang Chu
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Publication number: 20140054616Abstract: The present disclosure involves a method of packaging a light-emitting diode (LED). According to the method, a group of metal pads and a group of LEDs are provided. The group of LEDs is attached to the group of metal pads, for example through a bonding process. After the LEDs are attached to the metal pads, each LED is spaced apart from adjacent LEDs. Also according to the method, a phosphor film is coated around the group of LEDs collectively. The phosphor film is coated on top and side surfaces of each LED and between adjacent LEDs. A dicing process is then performed to slice through portions of the phosphor film located between adjacent LEDs. The dicing process divides the group of LEDs into a plurality of individual phosphor-coated LEDs.Type: ApplicationFiled: August 24, 2012Publication date: February 27, 2014Applicant: TSMC Solid State Lighting Ltd.Inventors: Chi-Xiang Tseng, Hsiao-Wen Lee, Min-Sheng Wu, Tien-Ming Lin
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Publication number: 20140054619Abstract: The present disclosure involves a method of packaging light-emitting diodes (LEDs). According to the method, a plurality of LEDs is provided over an adhesive tape. The adhesive tape is disposed on a substrate. In some embodiments, the substrate may be a glass substrate, a silicon substrate, a ceramic substrate, and a gallium nitride substrate. A phosphor layer is coated over the plurality of LEDs. The phosphor layer is then cured. The tape and the substrate are removed after the curing of the phosphor layer. A replacement tape is then attached to the plurality of LEDs. A dicing process is then performed to the plurality of LEDs after the substrate has been removed. The removed substrate may then be reused for a future LED packaging process.Type: ApplicationFiled: March 7, 2013Publication date: February 27, 2014Inventors: Chi-Xiang Tseng, Hsiao-Wen Lee, Min-Sheng Wu, Tien-Min Lin
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Patent number: 8647900Abstract: An optical emitter includes micro-structure phosphor coating on a light-emitting diode die mounted on a package substrate. The micro-structures are transferred onto a micro-structure phosphor coating precursor by patterning and curing the precursor or by curing the precursor through a mold. The micro-structures are half spheroids, three-sided pyramids, or six-sided pyramids.Type: GrantFiled: September 20, 2010Date of Patent: February 11, 2014Assignee: TSMC Solid State Lighting Ltd.Inventors: Chi Xiang Tseng, Hsiao-Wen Lee
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Publication number: 20130299855Abstract: An optical emitter is fabricated by bonding a Light-Emitting Diode (LED) die to a package wafer, electrically connecting the LED die and the package wafer, forming a phosphor coating over the LED die on the package wafer, molding a lens over the LED die on the package wafer, molding a reflector on the package wafer, and dicing the wafer into at least one optical emitter.Type: ApplicationFiled: July 15, 2013Publication date: November 14, 2013Inventors: Hao-Wei Ku, Chung Yu Wang, Yu-Sheng Tang, Hain-Hung Chen, Hao-Yu Yang, Ching-Yi Chen, Hsiao-Wen Lee, Chi Xiang Tseng, Sheng-Shin Guo, Tien-Ming Lin, Shang-Yu Tsai
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Patent number: 8486724Abstract: An optical emitter is fabricated by bonding a Light-Emitting Diode (LED) die to a package wafer, electrically connecting the LED die and the package wafer, forming a phosphor coating over the LED die on the package wafer, molding a lens over the LED die on the package wafer, molding a reflector on the package wafer, and dicing the wafer into at least one optical emitter.Type: GrantFiled: October 22, 2010Date of Patent: July 16, 2013Assignee: TSMC Solid State Lighting Ltd.Inventors: Hao-Wei Ku, Chung Yu Wang, Yu-Sheng Tang, Hsin-Hung Chen, Hao-Yu Yang, Ching-Yi Chen, Hsiao-Wen Lee, Chi Xiang Tseng, Sheng-Shin Guo, Tien-Ming Lin, Shang-Yu Tsai
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Publication number: 20130140591Abstract: The present disclosure provides a light emitting diode (LED) apparatus. The LED apparatus includes an LED emitter having a top surface; and a phosphor feature disposed on the LED emitter. The phosphor feature includes a first phosphor film disposed on the top surface of the LED emitter and having a first dimension defined in a direction parallel to the top surface of the LED emitter; a second phosphor film disposed on the first phosphor film and having a second dimension defined in the direction; and the second dimension is substantially less than the first dimension.Type: ApplicationFiled: December 1, 2011Publication date: June 6, 2013Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chi Xiang Tseng, Hsiao-Wen Lee, Tien-Ming Lin, Min-Sheng Wu
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Publication number: 20130027946Abstract: The present disclosure provides one embodiment of an illumination structure. The illumination structure includes a light-emitting diode (LED) device on a substrate; a lens secured on the substrate and over the LED device; and a diffuser cap secured on the substrate and covering the lens, wherein the lens and diffuser cap are designed and configured to redistribute emitting light from the LED device for wide angle illumination.Type: ApplicationFiled: July 29, 2011Publication date: January 31, 2013Applicant: TAIWAN SEMICONDUCTOR MANUFACTRURING COMPANY, LTD.Inventors: Chi Xiang Tseng, Hsiao-Wen Lee, Sheng-Shin Guo, Pei-Wen Ko, Chih-Hsuan Sun, Wei-Yu Yeh
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Patent number: 8227736Abstract: An image sensor device is disclosed. The image sensor device includes a semiconductor substrate having a first pixel region and a second pixel region. A first photo-conversion device is disposed within the first pixel region of the semiconductor substrate to receive a first light source. A second photo-conversion device is disposed within the second pixel region of the semiconductor substrate to receive a second light source different from the first light source. The surface of the semiconductor substrate corresponding to the first photo-conversion device and the second photo-conversion device has a first microstructure and a second microstructure, respectively, permitting a reflectivity of the first pixel region with respect to the first light source to be lower than a reflectivity of the second pixel region with respect to the first light source. The invention also discloses a fabrication method of the image sensor device.Type: GrantFiled: July 2, 2009Date of Patent: July 24, 2012Assignee: VisEra Technologies Company LimitedInventors: Chi-Xiang Tseng, I-Hsiu Chen, Chen-Wei Lu, Chun-Hung Lai
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Publication number: 20120113621Abstract: A batwing beam is produced from an LED package having a primary LED lens by molding the LED lens directly over an LED on a package substrate. The LED lens includes a cavity over a center of the LED. The cavity surface reflects light from the LED through total internal reflection (TIR) or through a reflectivity gel coating. The cavity may be a cone or a pyramid.Type: ApplicationFiled: October 14, 2011Publication date: May 10, 2012Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Hsiao-Wen LEE, Chi Xiang TSENG
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Publication number: 20120097986Abstract: An optical emitter is fabricated by bonding a Light-Emitting Diode (LED) die to a package wafer, electrically connecting the LED die and the package wafer, forming a phosphor coating over the LED die on the package wafer, molding a lens over the LED die on the package wafer, molding a reflector on the package wafer, and dicing the wafer into at least one optical emitter.Type: ApplicationFiled: October 22, 2010Publication date: April 26, 2012Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Hao-Wei KU, Chung Yu WANG, Yu-Sheng Tang, Hsin-Hung Chen, Hao-Yu Yang, Ching-Yi Chen, Hsiao-Wen Lee, Chi Xiang Tseng, Sheng-Shin Guo, Tien-Ming Lin, Shang-Yu Tsai
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Patent number: 8164042Abstract: Color filter arrays (CFA) and image sensors using same are provided. A color filter array includes a plurality of first color filter patterns respectively interlaced with a plurality of second color filter patterns, wherein the first and second color filter patterns comprise a plurality of color filters of at least three different colors of red (R), green (G) and blue (B) filters, and the first and second color filter patterns are not mirror symmetrical, and a blue (B) filter in one of the first color filter patterns is adjoined by a red (R) filter in one of the second color filter patterns adjacent thereto and/or a red (R) filter in one of the first color filter patterns is adjoined by a blue filter in one of the color filter patterns adjacent thereto.Type: GrantFiled: November 6, 2008Date of Patent: April 24, 2012Assignee: VisEra Technologies Company LimitedInventors: Chi-Xiang Tseng, Chin-Poh Pang, Cheng-Lin Yang, Wu-Chieh Liu
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Publication number: 20120068208Abstract: An optical emitter includes micro-structure phosphor coating on a light-emitting diode die mounted on a package substrate. The micro-structures are transferred onto a micro-structure phosphor coating precursor by patterning and curing the precursor or by curing the precursor through a mold. The micro-structures are half spheroids, three-sided pyramids, or six-sided pyramids.Type: ApplicationFiled: September 20, 2010Publication date: March 22, 2012Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chi Xiang TSENG, Hsiao-Wen LEE