Patents by Inventor Chia-Chang Lee

Chia-Chang Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11990269
    Abstract: An inductor device includes a first inductor, a second inductor, and at least one switch circuit. The second inductor is arranged to enclose the first inductor, and use a topmost layer metal to resist external interference for the first inductor. The at least one switch circuit is coupled to the second inductor, and is arranged to receive at least one control voltage, wherein the at least one control voltage is arranged to adjust conduction degree of the at least one switch circuit.
    Type: Grant
    Filed: November 21, 2021
    Date of Patent: May 21, 2024
    Assignee: Realtek Semiconductor Corp.
    Inventors: Yang Chang, Chia-Yi Lee, Chia-Jun Chang
  • Patent number: 11982936
    Abstract: A method of fabricating a photomask includes selectively exposing portions of a photomask blank to radiation to change an optical property of the portions of the photomask blank exposed to the radiation, thereby forming a pattern of exposed portions of the photomask blank and unexposed portions of the photomask blank. The pattern corresponds to a pattern of semiconductor device features.
    Type: Grant
    Filed: June 30, 2022
    Date of Patent: May 14, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hsin-Chang Lee, Ping-Hsun Lin, Yen-Cheng Ho, Chih-Cheng Lin, Chia-Jen Chen
  • Patent number: 11973040
    Abstract: A method is provided for forming an integrated circuit (IC) chip package structure. The method includes providing a substrate for an interposer, and forming a conductive interconnect structure in and on the substrate for connecting a group of selected IC dies. The method includes forming warpage-reducing trenches in non-routing regions of the interposer, wherein the warpage-reducing trenches are sized and positioned based on a warpage characteristic to reduce the warpage of the chip package structure. The method also includes depositing a warpage-relief material in the warpage-reducing trenches according to the warpage characteristic to reduce the warpage of the chip package structure, and bonding the group of selected IC dies to the interposer to form a chip package structure.
    Type: Grant
    Filed: December 9, 2021
    Date of Patent: April 30, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tsung-Yang Hsieh, Chien-Chang Lee, Chia-Ping Lai, Wen-Chung Lu, Cheng-Kang Huang, Mei-Shih Kuo, Alice Huang
  • Publication number: 20240134268
    Abstract: A mask for use in a semiconductor lithography process includes a substrate, a mask pattern disposed on the substrate, and a light absorbing border surrounding the mask pattern. The light absorbing border is inset from at least two edges of the substrate to define a peripheral region outside of the light absorbing border. In some designs, a first peripheral region extends from an outer perimeter of the light absorbing border to a first edge of the substrate, and a second peripheral region that extends from the outer perimeter of the light absorbing border to a second edge of the substrate, where the first edge of the substrate and the second edge of the substrate are on opposite sides of the mask pattern.
    Type: Application
    Filed: January 3, 2024
    Publication date: April 25, 2024
    Inventors: Chien-Cheng Chen, Huan-Ling Lee, Ta-Cheng Lien, Chia-Jen Chen, Hsin-Chang Lee
  • Publication number: 20240111118
    Abstract: A lens shift backlash elimination device includes a base, a transmission mechanism, and a lens. The transmission mechanism is disposed on the base and includes a first element, a second element, and an elastic element. The second element is mechanically connected to the first element. The elastic element is disposed between the first element and the second element, or abutted against the first element. The lens is mechanically connected to the transmission mechanism. The lens may be displaced relative to the base in a first direction.
    Type: Application
    Filed: November 3, 2022
    Publication date: April 4, 2024
    Applicant: Young Optics Inc.
    Inventors: Chia-Chang Lee, Chi-Yu Meng
  • Publication number: 20240094625
    Abstract: A method of making a semiconductor device includes forming at least one fiducial mark on a photomask. The method further includes defining a pattern including a plurality of sub-patterns on the photomask in a pattern region. The defining the pattern includes defining a first sub-pattern of the plurality of sub-patterns having a first spacing from a second sub-pattern of the plurality of sub-patterns, wherein the first spacing is different from a second spacing between the second sub-pattern and a third sub-pattern of the plurality of sub-patterns.
    Type: Application
    Filed: November 29, 2023
    Publication date: March 21, 2024
    Inventors: Hsin-Chang LEE, Ping-Hsun LIN, Chih-Cheng LIN, Chia-Jen CHEN
  • Patent number: 11935981
    Abstract: A photo-detecting device includes a first semiconductor layer with a first dopant, a light-absorbing layer, a second semiconductor layer, and a semiconductor contact layer. The second semiconductor layer is located on the first semiconductor layer and has a first region and a second region, the light absorbing layer is located between the first semiconductor layer and the second semiconductor layer and has a third region and a fourth region, the semiconductor contact layer contacts the first region. The first region includes a second dopant and a third dopant, the second region includes second dopant, and the third region includes third dopant. The semiconductor contact layer has a first thickness greater than 50 ? and smaller than 1000 ?.
    Type: Grant
    Filed: June 30, 2021
    Date of Patent: March 19, 2024
    Assignee: EPISTAR CORPORATION
    Inventors: Chu-Jih Su, Chia-Hsiang Chou, Wei-Chih Peng, Wen-Luh Liao, Chao-Shun Huang, Hsuan-Le Lin, Shih-Chang Lee, Mei Chun Liu, Chen Ou
  • Patent number: 11923433
    Abstract: A method for manufacturing a semiconductor device includes forming a first dielectric layer over a semiconductor fin. The method includes forming a second dielectric layer over the first dielectric layer. The method includes exposing a portion of the first dielectric layer. The method includes oxidizing a surface of the second dielectric layer while limiting oxidation on the exposed portion of the first dielectric layer.
    Type: Grant
    Filed: March 9, 2021
    Date of Patent: March 5, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Sheng-Liang Pan, Yungtzu Chen, Chung-Chieh Lee, Yung-Chang Hsu, Chia-Yang Hung, Po-Chuan Wang, Guan-Xuan Chen, Huan-Just Lin
  • Patent number: 11892704
    Abstract: A lens device including a lens barrel, a lens, a linear reciprocating motion mechanism, and a power machine is provided. The lens is disposed in the lens barrel. The linear reciprocating motion mechanism includes a first movable part and a second movable part. The first movable part is coupled to the lens barrel. The second movable part is coupled to the first movable part. The power machine is coupled to the second movable part to drive the second movable part to rotate, thereby driving the first movable part, and the first movable part drives the lens barrel to perform a linear reciprocating motion, wherein when the second movable part is rotated by N turns, the first movable part is rotated by one turn, and N is greater than or equal to 10.
    Type: Grant
    Filed: November 26, 2020
    Date of Patent: February 6, 2024
    Assignee: Young Optics Inc.
    Inventors: Yi-Feng Yen, Chia-Chang Lee
  • Patent number: 11808938
    Abstract: An optical measurement apparatus includes a thermal insulation housing, a first light-transmissive plate, a second light-transmissive plate, a heat-conductive layer, a cooling source and a photosensor. The thermal insulation housing, the first light-transmissive plate and the second light-transmissive plate define a chamber. The heat-conductive layer is disposed in the chamber, the cooling source is coupled to the heat-conductive layer, and the photosensor is disposed outside the chamber and on one side of the second light-transmissive plate facing away from the first light-transmissive plate.
    Type: Grant
    Filed: May 28, 2021
    Date of Patent: November 7, 2023
    Assignee: YOUNG OPTICS INC.
    Inventors: Wei-Ting Chiu, Chu-Tsung Chan, Sandeep Kumar Paral, Chia-Chang Lee
  • Publication number: 20230176149
    Abstract: A magnetoresistive sensor and a manufacturing method thereof are provided. The method includes: forming an initial reference layer in an annular shape, wherein the initial reference layer includes an anti-ferromagnetic layer and a ferromagnetic layer; performing a heat treatment on the initial reference layer, wherein the ferromagnetic layer is magnetized to have a magnetization direction oriented along a vortex path during a heating step of the heat treatment, and an exchange bias oriented along the vortex path is induced at an interface of the anti-ferromagnetic layer and the ferromagnetic layer during a cooling step of the heat treatment; patterning the initial reference layer to form separated reference layers, wherein the reference layers are respectively formed in a annular sector shape, and the reference layers are arranged along the vortex path; forming spacer layers and free layers to form magnetoresistive devices; routing the magnetoresistive devices to form the magnetoresistive sensor.
    Type: Application
    Filed: January 21, 2022
    Publication date: June 8, 2023
    Applicant: National Tsing Hua University
    Inventors: Chih-Huang Lai, Chia-Chang Lee, Yu-Shen Yen
  • Patent number: 11543267
    Abstract: A position sensing mechanism provided by the invention comprises an encoding element as a sensing signal source, a reading element for sensing signals of the signal source, and a processing unit for receiving and analyzing sensing signals output by the reading element, the position sensing mechanism has a main technical feature lying in a magneto-resistive unit in the reading element for sensing signals of the signal source being a tunneling magneto-resistor (TMR), and two layers of magnetic moments of a reference layer and a free layer of the tunneling magneto-resistor being perpendicular to each other, and in the reference layer and the free layer with the magnetic moments being perpendicular to each other, the magnetic moment of one of the layers is parallel to a film surface, and the magnetic moment of the other layer is perpendicular to the film surface.
    Type: Grant
    Filed: January 5, 2021
    Date of Patent: January 3, 2023
    Assignee: HIWIN MIKROSYSTEM CORP.
    Inventors: Chih-Huang Lai, Chia-Chang Lee, Zhi-Hao Xu, Heng-Sheng Hsiao
  • Patent number: 11515231
    Abstract: A coating method applied to perform coating with liquid metal thermal grease and a heat dissipation module are provided. The coating method includes: providing liquid metal thermal grease on a surface of an electronic element, and scraping the liquid metal thermal grease by a scraper, to coat the surface of the electronic element with the liquid metal thermal grease. A surface of the scraper is roughened. According to the coating method, the surface of the electronic element is evenly coated with the liquid metal thermal grease effectively.
    Type: Grant
    Filed: July 17, 2020
    Date of Patent: November 29, 2022
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Chia-Chang Lee, Chun-Chieh Wong, Cheng-Yu Wang, Tai-Min Hsu, Yao-Jen Chang
  • Publication number: 20220214192
    Abstract: A position sensing mechanism provided by the invention comprises an encoding element as a sensing signal source, a reading element for sensing signals of the signal source, and a processing unit for receiving and analyzing sensing signals output by the reading element, the position sensing mechanism has a main technical feature lying in a magneto-resistive unit in the reading element for sensing signals of the signal source being a tunneling magneto-resistor (TMR), and two layers of magnetic moments of a reference layer and a free layer of the tunneling magneto-resistor being perpendicular to each other, and in the reference layer and the free layer with the magnetic moments being perpendicular to each other, the magnetic moment of one of the layers is parallel to a film surface, and the magnetic moment of the other layer is perpendicular to the film surface.
    Type: Application
    Filed: January 5, 2021
    Publication date: July 7, 2022
    Inventors: Chih-Huang LAI, Chia-Chang LEE, Zhi-Hao XU, Heng-Sheng HSIAO
  • Patent number: 11378767
    Abstract: A lens adjusting mechanism includes a light-valve case, a lens case, one fastener, and a leaf spring assembly. The light-valve case has an emitting opening and a first opening edge, disposed on the peripheral portion of the emitting opening. The lens case has a light-path entrance and a light-path exit. The lens case also has a second opening edge. The second opening edge is disposed on the peripheral portion of the light-path entrance. The fastener is connected between the first opening edge and the second opening edge. The leaf spring assembly has at least one leaf contact. The leaf spring assembly is disposed between the first opening edge and the second opening edge. The leaf contact contacts the first opening edge or the second opening edge. The fastener is used to adjust the distance between the first opening edge and the second opening edge.
    Type: Grant
    Filed: December 2, 2020
    Date of Patent: July 5, 2022
    Assignee: Young Optics Inc.
    Inventors: Yu-Chen Chang, Chia-Chang Lee
  • Patent number: 11365860
    Abstract: An optical lens includes a first lens, a light guide and a second lens arranged in order in a direction of an optical axis of the optical lens. The light guide has a first end and a second end opposite the first end, and an inner surface of the light guide touches at least a part of an outer edge of the second lens.
    Type: Grant
    Filed: May 14, 2021
    Date of Patent: June 21, 2022
    Assignee: YOUNG OPTICS INC.
    Inventors: S-Wei Chen, Chen-An Chiang, Hung-Ying Lin, Chia-Chang Lee
  • Publication number: 20210382301
    Abstract: An optical measurement apparatus includes a thermal insulation housing, a first light-transmissive plate, a second light-transmissive plate, a heat-conductive layer, a cooling source and a photosensor. The thermal insulation housing, the first light-transmissive plate and the second light-transmissive plate define a chamber. The heat-conductive layer is disposed in the chamber, the cooling source is coupled to the heat-conductive layer, and the photosensor is disposed outside the chamber and on one side of the second light-transmissive plate facing away from the first light-transmissive plate.
    Type: Application
    Filed: May 28, 2021
    Publication date: December 9, 2021
    Inventors: Wei-Ting CHIU, Chu-Tsung CHAN, Sandeep Kumar PARAL, Chia-Chang LEE
  • Publication number: 20210356092
    Abstract: An optical lens includes a first lens, a light guide and a second lens arranged in order in a direction of an optical axis of the optical lens. The light guide has a first end and a second end opposite the first end, and an inner surface of the light guide touches at least a part of an outer edge of the second lens.
    Type: Application
    Filed: May 14, 2021
    Publication date: November 18, 2021
    Inventors: S-WEI CHEN, CHEN-AN CHIANG, HUNG-YING LIN, CHIA-CHANG LEE
  • Publication number: 20210080679
    Abstract: A lens adjusting mechanism includes a light-valve case, a lens case, one fastener, and a leaf spring assembly. The light-valve case has an emitting opening and a first opening edge, disposed on the peripheral portion of the emitting opening. The lens case has a light-path entrance and a light-path exit. The lens case also has a second opening edge. The second opening edge is disposed on the peripheral portion of the light-path entrance. The fastener is connected between the first opening edge and the second opening edge. The leaf spring assembly has at least one leaf contact. The leaf spring assembly is disposed between the first opening edge and the second opening edge. The leaf contact contacts the first opening edge or the second opening edge. The fastener is used to adjust the distance between the first opening edge and the second opening edge.
    Type: Application
    Filed: December 2, 2020
    Publication date: March 18, 2021
    Applicant: Young Optics Inc.
    Inventors: YU-CHEN CHANG, Chia-Chang Lee
  • Publication number: 20210080687
    Abstract: A lens device including a lens barrel, a lens, a linear reciprocating motion mechanism, and a power machine is provided. The lens is disposed in the lens barrel. The linear reciprocating motion mechanism includes a first movable part and a second movable part. The first movable part is coupled to the lens barrel. The second movable part is coupled to the first movable part. The power machine is coupled to the second movable part to drive the second movable part to rotate, thereby driving the first movable part, and the first movable part drives the lens barrel to perform a linear reciprocating motion, wherein when the second movable part is rotated by N turns, the first movable part is rotated by one turn, and N is greater than or equal to 10.
    Type: Application
    Filed: November 26, 2020
    Publication date: March 18, 2021
    Applicant: Young Optics Inc.
    Inventors: Yi-Feng Yen, Chia-Chang Lee