Patents by Inventor Chia-chen Wei

Chia-chen Wei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11991576
    Abstract: A method for handling a Random Access (RA) procedure in a Bandwidth Part (BWP) switching operation is provided. The method includes: receiving a configuration of a first BWP through Radio Resource Control (RRC) signaling from a Base Station (BS); initiating an RA procedure on the first BWP; receiving, during the RA procedure on the first BWP, Downlink Control Information (DCI) indicating a BWP switching from the first BWP to a second BWP; determining whether to switch to the second BWP in response to receiving the DCI; and in a case that the UE determines to switch to the second BWP: stopping the RA procedure that is ongoing on the first BWP; determining, after stopping the RA procedure, whether the second BWP is configured with an RA resource; and initiating, after determining that the second BWP is not configured with the RA resource, a new RA procedure on an initial BWP.
    Type: Grant
    Filed: September 30, 2022
    Date of Patent: May 21, 2024
    Assignee: FG Innovation Company Limited
    Inventors: Hung-Chen Chen, Chie-Ming Chou, Chia-Hung Wei, Yung-Lan Tseng
  • Publication number: 20240145533
    Abstract: A high voltage transistor may include a stepped dielectric layer between a field plate structure and a channel region of the high voltage transistor in a substrate. The stepped dielectric layer may increase the breakdown voltage of the high voltage transistor by reducing the electric field strength near the drain region of the high voltage transistor. In particular, a portion of the stepped dielectric layer near the drain region includes a thickness that is greater relative to a thickness of another portion of the stepped dielectric layer near the gate structure. The increased thickness near the drain region provides increased electric field suppression near the drain region (which operates at high voltages). In this way, the stepped dielectric layer enables the high voltage transistor described herein to achieve higher breakdown voltages without increasing the distance between the gate structure and the drain region of a high voltage transistor.
    Type: Application
    Filed: April 17, 2023
    Publication date: May 2, 2024
    Inventors: Kaochao CHEN, Chia-Cheng HO, Chia-Jui LEE, Chia-Yu WEI
  • Publication number: 20240090019
    Abstract: A method for LBT failure detection performed by a UE is provided. The method includes: receiving, by a MAC entity of the UE, an LBT failure indication from a lower layer for all UL transmissions; increasing an LBT failure counter when the MAC entity receives the LBT failure indication; determining an LBT failure event occurs when the LBT failure counter is greater than or equal to a threshold; and resetting the LBT failure counter after the MAC entity has not received the LBT failure indication for a time period.
    Type: Application
    Filed: September 21, 2023
    Publication date: March 14, 2024
    Inventors: Hung-Chen Chen, Chie-Ming Chou, Chia-Hung Wei, Mei-Ju Shih
  • Patent number: 11901657
    Abstract: A connector includes a housing, a first electrode and a second electrode. The housing further includes a first body, bending parts, foolproof key positions, a second buckle, a first opening and a second opening. The first body forms a first accommodating space and a second accommodating space. The first accommodating space is provided with the foolproof key positions, the first opening, the second opening and the second buckle. The second buckle can be arranged corresponding to a first buckle of the wire end connector to buckle the wire end connector in the first accommodating space and the second accommodating space. The first electrode includes a first end and a third end, and the third end forms first current divider pins. The second electrode includes a second end and a fourth end, and the fourth end forms second current divider pins.
    Type: Grant
    Filed: March 31, 2022
    Date of Patent: February 13, 2024
    Assignee: P-TWO INDUSTRIES INC.
    Inventor: Chia-Chen Wei
  • Publication number: 20230246376
    Abstract: A module connector comprising a first connecting component and a second connecting component. The first connecting component includes a first base, a plurality of first conductors and a plurality of first clamping parts. The first base includes a first body, a plurality of first cable grooves, a plurality of first through holes and a plurality of third cable grooves. The first body forms the first cable grooves and the third cable grooves to be able to accommodate the cables. The central axes of the first through holes are at a first angle with the first cable grooves and pass through the first body, and one ends of the first through holes communicate with the first cable grooves. The first conductors are disposed in the first cable grooves. The second connecting component can connect with the first connecting component through the cables, so that at least one of signals and power can be transmitted between the second connecting component and the circuit board.
    Type: Application
    Filed: January 20, 2023
    Publication date: August 3, 2023
    Inventors: HSIEN-CHANG LIN, CHUN-WEI CHANG, CHIA-CHEN WEI
  • Publication number: 20220352663
    Abstract: A connector includes a housing, a first electrode and a second electrode. The housing further includes a first body, bending parts, foolproof key positions, a second buckle, a first opening and a second opening. The first body forms a first accommodating space and a second accommodating space. The first accommodating space is provided with the foolproof key positions, the first opening, the second opening and the second buckle. The second buckle can be arranged corresponding to a first buckle of the wire end connector to buckle the wire end connector in the first accommodating space and the second accommodating space. The first electrode includes a first end and a third end, and the third end forms first current divider pins. The second electrode includes a second end and a fourth end, and the fourth end forms second current divider pins.
    Type: Application
    Filed: March 31, 2022
    Publication date: November 3, 2022
    Inventor: CHIA-CHEN WEI
  • Patent number: 9030697
    Abstract: The present invention discloses a printing device. The printing device of the present invention may include a communication element capable of communicating with an external host utilizing a plurality of telecommunication network technologies to receive a file sent from the external host to the device, a printing element electrically coupled to the communication element to output an image file, and an audio outputting element electrically coupled to the communication element to output an audio file, wherein the communication element identifies a file type of the file received from the external host and selectively sends the file to the printing element or the audio outputting element.
    Type: Grant
    Filed: July 2, 2013
    Date of Patent: May 12, 2015
    Assignee: HiTi Digital, Inc.
    Inventors: Chien-Hua Huang, Mei-Ju Ko, Jufen Huang, Chia-chen Wei, Hung-Chan Chien, Hong-Shun Chiou, Yu-Fan Fang, Chun-Chang Tu, Tsung-Yueh Chen, Chih-Chieh Lin, Yueh Cheng Lin, Shiu-Sheng Hsu, Chu-Ming Liu
  • Publication number: 20150009525
    Abstract: The present invention discloses a printing device. The printing device of the present invention may include a communication element capable of communicating with an external host utilizing a plurality of telecommunication network technologies to receive a file sent from the external host to the device, a printing element electrically coupled to the communication element to output an image file, and an audio outputting element electrically coupled to the communication element to output an audio file, wherein the communication element identifies a file type of the file received from the external host and selectively sends the file to the printing element or the audio outputting element.
    Type: Application
    Filed: July 2, 2013
    Publication date: January 8, 2015
    Inventors: Chien-Hua HUANG, Mei-Ju Ko, Jufen Huang, Chia-chen Wei, Hung-Chan Chien, Hong-Shun Chiou, Yu-Fan Fang, Chun-Chang Tu, Tsuing-Yueh Chen, Chih-Chieh Lin, Yueh Cheng Lin, Shiu-Sheng Hsu, Chu-Ming Liu