Abstract: The present disclosure provides a wafer. The wafer includes a die, a scribe line adjacent to the die, and a test circuit adjacent to the scribe line. The test circuit includes a first switch, a second switch, and a third switch. The first switch has a first node coupled to a first device-under-test and a second node coupled to a first signal supply node. The second switch has a first node coupled to the second DUT and a second node coupled to the first signal supply node. The third switch has a first node directly coupled to the first DUT and the second DUT. The third switch has a second node coupled to a second signal supply node. The third switch selectively couples both of the first DUT and the second DUT to the second signal supply node.

Abstract: An addition system of a reducing agent in a semiconductor manufacturing process includes pre-treatment and post-treatment gas concentration detection devices, a process exhaust gas treatment device, a reducing agent supply device, and an addition system control device. The process exhaust gas treatment device purifies exhaust gas of a semiconductor manufacturing process and emits a post-treatment gas. The reducing agent supply device supplies a reducing agent gas into the process exhaust gas treatment device. The post-treatment gas concentration detection device detects a residual concentration of the reducing agent gas in the post-treatment gas. The addition system control device calculates destruction and removal efficiency (DRE) for process gases according to pre-treatment and post-treatment gas concentrations, and, according to the DRE and the residual concentration, sends a signal to the reducing agent supply device to control the amount of the reducing agent gas added.

Abstract: A method includes etching a gate stack in a wafer to form a trench, depositing a silicon nitride liner extending into the trench, and depositing a silicon oxide layer. The process of depositing the silicon oxide layer includes performing a treatment process on the wafer using a process gas including nitrogen and hydrogen, and performing a soaking process on the wafer using a silicon precursor.

Abstract: An electronic device includes a substrate, a plurality of flexible circuit boards, a plurality of ICs and an insulator. The flexible circuit boards are disposed on the substrate. In a top view of the electronic device, the flexible circuit boards are overlapped with an edge of the substrate. The ICs are disposed on the substrate. The insulator is disposed on the flexible circuit boards and contacted the ICs, wherein the insulator has a first side and a second side opposite to the first side and the first side is closer to the edge than the second side. Along a first direction perpendicular to an extension direction of the edge, a first minimum distance between the second side and one of the ICs is less than a second minimum distance between the second side and one of the flexible circuit boards.

Abstract: A power detection circuit is provided. The power detection circuit includes a comparator circuit operative to generate an output signal in response to an input signal. The output signal is configured to change from a first value to a second value in response to the input signal attaining a first threshold value. The output signal is configured to change from the second value to the first value in response to the input signal subsequently attaining a second threshold value. A current limiting circuit is connected to the comparator circuit and operative to limit a leakage current of the comparator circuit.

Abstract: An automated material handling system for combining over-head conveyer with a material control system is disclosed. First and second virtual stocker codes are respectively assigned to first and second virtual stocker of an over-head conveyer (OHC) using a material control system. A front opening unified pod (FOUP) is moved to and loaded in the first virtual stocker using a transport system controller. The FOUP is loaded in a track of the OHC and assigned a virtual vehicle code. The FOUP is moved, along the track, to the second virtual stocker and loaded in the second virtual stocker, while the virtual vehicle code is being removed, and is removed therefrom using the transport system controller.

Abstract: A non-uniform image defect inspection method includes steps of inputting an original two-dimensional image; separating a non-uniform background image from the original two-dimensional image by Discrete Cosine Transform (DCT) to obtain a residual image without the non-uniform background image; binarization segmenting the residual image to extract defects from the residual image, wherein the segmented defects are the inspection results.

Abstract: An automated material handling system for combining over-head conveyer with a material control system is disclosed. First and second virtual stocker codes are respectively assigned to first and second virtual stocker of an over-head conveyer (OHC) using a material control system. A front opening unified pod (FOUP) is moved to and loaded in the first virtual stocker using a transport system controller. The FOUP is loaded in a track of the OHC and assigned a virtual vehicle code. The FOUP is moved, along the track, to the second virtual stocker and loaded in the second virtual stocker, while the virtual vehicle code is being removed, and is removed therefrom using the transport system controller.

Abstract: A non-uniform image defect inspection method includes steps of inputting an original two-dimensional image; separating a non-uniform background image from the original two-dimensional image by Discrete Cosine Transform (DCT) to obtain a residual image without the non-uniform background image; binarization segmenting the residual image to extract defects from the residual image, wherein the segmented defects are the inspection results.