Patents by Inventor Chia-Chu Chen

Chia-Chu Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10468288
    Abstract: Methods and systems for vacuum mounting a warped, thin substrate onto a flat chuck are presented herein. A vacuum chuck includes three or more collapsible bellows that move above the chuck and into contact with a warped substrate. The bellows seal and vacuum clamp onto the backside surface of the substrate. In some embodiments, the bellows collapse by at least five hundred micrometers while clamping. An extensible sealing element is mounted in a recessed annular channel on the surface of the chuck body. As the substrate moves toward the chucking surface, the extensible sealing element extends at least five millimeters above the chuck body and into contact with the substrate. As the space between the chuck and the substrate is evacuated, the extensible sealing element collapse into the recessed annular channel, and the substrate is clamped onto the flat chucking surface of chuck body.
    Type: Grant
    Filed: December 19, 2016
    Date of Patent: November 5, 2019
    Assignee: KLA-Tencor Corporation
    Inventors: Aviv Balan, Luping Huang, Savita Chandan, Chia-Chu Chen, Teck Meriam
  • Publication number: 20180108559
    Abstract: Methods and systems for vacuum mounting a warped, thin substrate onto a flat chuck are presented herein. A vacuum chuck includes three or more collapsible bellows that move above the chuck and into contact with a warped substrate. The bellows seal and vacuum clamp onto the backside surface of the substrate. In some embodiments, the bellows collapse by at least five hundred micrometers while clamping. An extensible sealing element is mounted in a recessed annular channel on the surface of the chuck body. As the substrate moves toward the chucking surface, the extensible sealing element extends at least five millimeters above the chuck body and into contact with the substrate. As the space between the chuck and the substrate is evacuated, the extensible sealing element collapse into the recessed annular channel, and the substrate is clamped onto the flat chucking surface of chuck body.
    Type: Application
    Filed: December 19, 2016
    Publication date: April 19, 2018
    Inventors: Aviv Balan, Luping Huang, Savita Chandan, Chia-Chu Chen, Teck Meriam
  • Publication number: 20050130240
    Abstract: The present invention provides carbohydrate encapsulated nanoparticles. In particular, the present invention provides metallic nanoparticles (e.g. gold nanoparticles) that are encapsulated in biologically important carbohydrate molecules, such as sugars, sugar derivatives, P-blood group antigens and analogues thereof. The present invention also provides methods of employing these carbohydrate encapsulated nanoparticles in diagnostic and therapeutic applications.
    Type: Application
    Filed: February 19, 2004
    Publication date: June 16, 2005
    Applicants: Academia Sinica, National Taiwan University, National Taiwan Normal University
    Inventors: Chun-Cheng Lin, Chia-Chu Chen, Yi-Chun Wu
  • Patent number: D1023409
    Type: Grant
    Filed: July 27, 2022
    Date of Patent: April 16, 2024
    Inventors: Chia-Teh Chen, Meng-Chu Lee