Patents by Inventor Chia-En Fan

Chia-En Fan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11234328
    Abstract: A circuit board disclosed in the present invention includes a substrate and a circuit layer. The circuit layer is formed on a surface of the substrate and includes at least one test circuit line. The test circuit line includes a main segment and a branch segment connected with each other. The branch segment is provided to be contacted with a test equipment for electrical test so as to protect the main segment from breaking during electrical test.
    Type: Grant
    Filed: September 25, 2020
    Date of Patent: January 25, 2022
    Assignee: CHIPBOND TECHNOLOGY CORPORATION
    Inventors: Chia-En Fan, Hui-Yu Huang, Chih-Ming Peng, Chun-Te Lee
  • Publication number: 20210267047
    Abstract: A circuit board disclosed in the present invention includes a substrate and a circuit layer. The circuit layer is formed on a surface of the substrate and includes at least one test circuit line. The test circuit line includes a main segment and a branch segment connected with each other. The branch segment is provided to be contacted with a test equipment for electrical test so as to protect the main segment from breaking during electrical test.
    Type: Application
    Filed: September 25, 2020
    Publication date: August 26, 2021
    Inventors: Chia-En Fan, Hui-Yu Huang, Chih-Ming Peng, Chun-Te Lee