Abstract: A method of fabricating a semiconductor device includes forming a gate structure, a first edge structure and a second edge structure on a semiconductor strip. The method further includes forming a first source/drain feature between the gate structure and the first edge structure. The method further includes forming a second source/drain feature between the gate structure and the second edge structure, wherein a distance between the gate structure and the first source/drain feature is different from a distance between the gate structure and the second source/drain feature. The method further includes implanting a buried channel in the semiconductor strip, wherein the buried channel is entirely below a top-most surface of the semiconductor strip, a maximum depth of the buried channel is less than a maximum depth of the first source/drain feature, and a dopant concentration of the buried channel is highest under the gate structure.

Abstract: A photomask structure including a first layout pattern and a second layout pattern is provided. The second layout pattern is located on one side of the first layout pattern. The first layout pattern and the second layout pattern are separated from each other. The first layout pattern has a first edge and a second edge opposite to each other. The second layout pattern has a third edge and a fourth edge opposite to each other. The third edge of the second layout pattern is adjacent to the first edge of the first layout pattern. The second layout pattern includes a first extension portion exceeding an end of the first layout pattern. The first extension portion includes a first protruding portion protruding from the third edge of the second layout pattern. The first protruding portion exceeds the first edge of the first layout pattern.

Abstract: An electronic switch device and an electronic switch system are provided, wherein the electronic switch system includes: an electronic switch device, which includes: a sensing module, which includes: a pressure sensing module for providing a pressure sensing signal; and a touch control sensing module disposed on the pressure sensing module for providing a touch control sensing signal; and a comparator circuit coupled to the sensing module for receiving the pressure sensing signal.

Abstract: Provided is a semiconductor device including a substrate having a lower portion and an upper portion on the lower portion; an isolation region disposed on the lower portion of the substrate and surrounding the upper portion of the substrate in a closed path; a gate structure disposed on and across the upper portion of the substrate; source and/or drain (S/D) regions disposed in the upper portion of the substrate at opposite sides of the gate structure; and a channel region disposed below the gate structure and abutting between the S/D regions, wherein the channel region and the S/D regions have different conductivity types, and the channel region and the substrate have the same conductivity type.

Abstract: A method of determining the reliability of a high-voltage PMOS (HVPMOS) device includes determining a bulk resistance of the HVPMOS device, and evaluating the reliability of the HVPMOS device based on the bulk resistance.

Abstract: An electronic device including an electronic unit and a redistribution layer is disclosed. The electronic unit has connection pads. The redistribution layer is electrically connected to the electronic unit and includes a first insulating layer, a first metal layer and a second insulating layer. The first insulating layer is disposed on the electronic unit and has first openings disposed corresponding to the connection pads. The first metal layer is disposed on the first insulating layer and electrically connected to the electronic unit through the connection pads. The second insulating layer is disposed on the first metal layer. The first insulating layer includes first filler particles, and the second insulating layer includes second filler particles. The first filler particles have a first maximum particle size, the second filler particles have a second maximum particle size, and the second maximum particle size is greater than the first maximum particle size.

Abstract: An acute kidney injury predicting system and a method thereof are proposed. A processor reads the data to be tested, the detection data, the machine learning algorithm and the risk probability comparison table from a main memory. The processor trains the detection data according to the machine learning algorithm to generate an acute kidney injury prediction model, and inputs the data to be tested into the acute kidney injury prediction model to generate an acute kidney injury characteristic risk probability and a data sequence table. The data sequence table lists the data to be tested in sequence according to a proportion of each of the data to be tested in the acute kidney injury characteristics. The processor selects one of the medical treatment data from the risk probability comparison table according to the acute kidney injury characteristic risk probability.

Abstract: A transistor includes a gate structure over a substrate, wherein the substrate includes a channel region. The transistor further includes a source/drain (S/D) in the substrate adjacent to the gate structure. The transistor further includes a lightly doped drain (LDD) region adjacent to the S/D, wherein a dopant concentration in the first LDD is less than a dopant concentration in the S/D. The transistor further includes a doping extension region adjacent the LDD region, wherein the doping extension region extends farther under the gate structure than the LDD region, and a maximum depth of the doping extension region is 10-times to 30-times greater than a maximum depth of the LDD.

Abstract: A semiconductor structure includes a first gate structure, a second gate structure coupled to the first gate structure, a source region, a first drain region, and a second drain region. The source region is surrounded by the first gate structure and the second gate structure. The first drain region is separated from the source region by the first gate structure. The second drain region is separated from the source region by the second gat structure. A shape of the first drain region and a shape of the second drain region are different from each other from a plan view.

Abstract: A method includes the steps: providing a pre-structure comprising a first pre-embedded member and a second pre-embedded member, wherein the first pre-embedded member has a first positioning segment, a connecting segment connected to the first positioning segment, a first piece, and a bridge; the second pre-embedded member has a second positioning segment, a hanging segment connected to the second positioning segment, and a second piece, wherein the bridge is connected to the connecting segment and the second piece; fixing the bridge onto the hanging segment; segmenting the connecting portion of the bridge and the connecting segment to form a first embedded member, which is defined by the first positioning segment, the connecting segment and the first piece, and a second embedded member, which is defined by the second positioning segment, the hanging segment, the second piece and the bridge; separating the second embedded member from the first embedded member.

Abstract: An adapter assembly includes a plurality of adapters arranged in one row. Each adapter has two electrical connection interfaces respectively arranged on two opposite sides thereof. Each adapter includes an insulating body and a plurality of conductive terminals. The insulating body includes an internal connecting portion and an external connecting portion respectively arranged on two opposite sides thereof. The conductive terminals are arranged in the internal connecting portion and the external connecting portion to respectively form the two electrical connection interfaces. One of the two electrical connection interfaces located at the internal connecting portion is electrically connected to the other electrical connection interface located at the external connecting portion.

Abstract: An adapter includes an insulating body, a circuit board, and a plurality of conductive modules. The circuit board is arranged in the insulating body and has two opposite surfaces. The conductive modules are arranged in the insulating body and are respectively disposed on two opposite ends of at least one of the two surfaces of the circuit board. Each of the conductive modules includes a plastic member and a plurality of conductive terminals arranged in one row. Each of the conductive terminals has an embedded segment embedded in the plastic member, a fixing segment extending from an end of the embedded segment and soldered on the circuit board by using a SMT manner, and a contacting segment extending from an opposite end of the embedded segment in a direction away from the circuit board.

Abstract: An adapter assembly includes a plurality of adapters arranged in one row. Each adapter has two electrical connection interfaces respectively arranged on two opposite sides thereof. Each adapter includes an insulating body and a plurality of conductive terminals. The insulating body includes an internal connecting portion and an external connecting portion respectively arranged on two opposite sides thereof. The conductive terminals are arranged in the internal connecting portion and the external connecting portion to respectively form the two electrical connection interfaces. One of the two electrical connection interfaces located at the internal connecting portion is electrically connected to the other electrical connection interface located at the external connecting portion.

Abstract: An adapter includes an insulating body, a circuit board, and a plurality of conductive modules. The circuit board is arranged in the insulating body and has two opposite surfaces. The conductive modules are arranged in the insulating body and are respectively disposed on two opposite ends of at least one of the two surfaces of the circuit board. Each of the conductive modules includes a plastic member and a plurality of conductive terminals arranged in one row. Each of the conductive terminals has an embedded segment embedded in the plastic member, a fixing segment extending from an end of the embedded segment and soldered on the circuit board by using a SMT manner, and a contacting segment extending from an opposite end of the embedded segment in a direction away from the circuit board.

Abstract: A wireless charging device capable of charging an electronic device is provided. The wireless charging device includes a supporting component, a stage and at least one electrical transmitter. The stage is used to carry the electronic device and is swingingly disposed on the platform through the supporting component. The electrical transmitter is movably disposed in the stage. When the electronic device is placed on an end of the stage which is relatively away from the supporting component, the stage swings in relative to the platform by using the supporting component as a fulcrum, and the stage is inclined to the platform. As a result, the electrical transmitter moves toward the electronic device due to gravitational pull, and thereby aligns with an electrical receiver in the electronic device so as to wirelessly charge the electronic device.

Abstract: A method includes the steps: providing a pre-structure comprising a first pre-embedded member and a second pre-embedded member, wherein the first pre-embedded member has a first positioning segment, a connecting segment connected to the first positioning segment, a first piece, and a bridge; the second pre-embedded member has a second positioning segment, a hanging segment connected to the second positioning segment, and a second piece, wherein the bridge is connected to the connecting segment and the second piece; fixing the bridge onto the hanging segment; segmenting the connecting portion of the bridge and the connecting segment to form a first embedded member, which is defined by the first positioning segment, the connecting segment and the first piece, and a second embedded member, which is defined by the second positioning segment, the hanging segment, the second piece and the bridge; separating the second embedded member from the first embedded member.

Abstract: A wireless charging device capable of charging an electronic device is provided. The wireless charging device includes a supporting component, a stage and at least one electrical transmitter. The stage is used to carry the electronic device and is swingingly disposed on the platform through the supporting component. The electrical transmitter is movably disposed in the stage. When the electronic device is placed on an end of the stage which is relatively away from the supporting component, the stage swings in relative to the platform by using the supporting component as a fulcrum, and the stage is inclined to the platform. As a result, the electrical transmitter moves toward the electronic device due to gravitational pull, and thereby aligns with an electrical receiver in the electronic device so as to wirelessly charge the electronic device.

Abstract: A heat pipe includes a conductive hollow case, a conductive capillary layer, a piezoelectric component, and a flexible component. The conductive hollow case has a first end and a second end. The first end is connected to a heat-generating component. The second end is a heat-dissipating end. The conductive capillary layer is formed on an inner wall of the conductive hollow case. A liquid stored in the conductive capillary layer can be heated to evaporate by the heat-generating component and then move toward the second end. The piezoelectric component is connected to the conductive capillary layer. The flexible component is disposed at a side of the piezoelectric component for being driven by the evaporated liquid so as to exert force upon the piezoelectric component. Thus, the piezoelectric component can generate electric energy, which can be transmitted from the conductive capillary layer to the conductive hollow case.