Patents by Inventor Chia-Geng Li

Chia-Geng Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4906953
    Abstract: A broadband interconnection between a microstrip and a coplanar waveguide is provided without use of via holes by using anisotropic etching to form a sloped surface between connection points. The sloped surface is then metallized to provide the interconnection.
    Type: Grant
    Filed: September 8, 1988
    Date of Patent: March 6, 1990
    Assignee: Varian Associates, Inc.
    Inventors: Chia-Geng Li, Steve G. Bandy, Majid Riaziat