Patents by Inventor Chia-He WU

Chia-He WU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer cassette
    Patent number: 11676838
    Abstract: A wafer cassette for receiving a wafer is provided. The wafer cassette includes a cassette housing, a first supporting rib and a second supporting rib. The first supporting rib is disposed in the cassette housing, wherein the first supporting rib includes a front supporting portion, a middle supporting portion and a rear supporting portion, the front supporting portion is connected to one end of the middle supporting portion, the rear supporting portion is connected to the other end of the middle supporting portion, and the front supporting portion has a front curved edge. The second supporting rib is disposed in the cassette housing. An edge portion of the wafer is supported by the first supporting rib and the second supporting rib, and the front supporting portion, the middle supporting portion and the rear supporting portion contact the wafer simultaneously.
    Type: Grant
    Filed: February 26, 2021
    Date of Patent: June 13, 2023
    Assignee: VISERA TECHNOLOGIES COMPANY LIMIIED
    Inventors: Chao-Chih Wang, Ya-Nan Wang, Chia-He Wu, Cheng-Han Chiang
  • WAFER CASSETTE
    Publication number: 20220277967
    Abstract: A wafer cassette for receiving a wafer is provided. The wafer cassette includes a cassette housing, a first supporting rib and a second supporting rib. The first supporting rib is disposed in the cassette housing, wherein the first supporting rib includes a front supporting portion, a middle supporting portion and a rear supporting portion, the front supporting portion is connected to one end of the middle supporting portion, the rear supporting portion is connected to the other end of the middle supporting portion, and the front supporting portion has a front curved edge. The second supporting rib is disposed in the cassette housing. An edge portion of the wafer is supported by the first supporting rib and the second supporting rib, and the front supporting portion, the middle supporting portion and the rear supporting portion contact the wafer simultaneously.
    Type: Application
    Filed: February 26, 2021
    Publication date: September 1, 2022
    Inventors: Chao-Chih WANG, Ya-Nan WANG, Chia-He WU, Cheng-Han CHIANG