Patents by Inventor Chia-Hsiu Yeh

Chia-Hsiu Yeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210386303
    Abstract: A radial artery signal measuring device includes a flexible signal sensor, a signal processor, and a flexible cable. The flexible signal sensor is fixed on a skin surface over a radial artery by a patch during use. The flexible signal sensor includes a flexible substrate, at least one infrared light source, and a light detector. The at least one infrared light source is used to emit an infrared light to the radial artery, wherein the wavelength of the light source is infrared light greater than 1000 nm. The light detector is used to receive the infrared light reflected by the radial artery and generate a radial artery signal. The signal processor includes a housing for fitting the wrist of a user, a circuit board, a microprocessor, and a battery. The flexible cable is used to transmit the radial artery signal to the microprocessor.
    Type: Application
    Filed: June 9, 2021
    Publication date: December 16, 2021
    Applicant: National Yang Ming Chiao Tung University
    Inventors: Paul C.P. CHAO, Chia-Hsiu YEH
  • Publication number: 20130078453
    Abstract: A drilling entry board for a printed circuit board (PCB) includes a metal substrate and a lubricating copolymer. The lubricating copolymer is bonded on the metal substrate surface and comprises a water-soluble structure and a water insoluble structure.
    Type: Application
    Filed: February 14, 2012
    Publication date: March 28, 2013
    Inventors: Chung-Hao Chang, Jia-Wei Cao, Han-Shiang Huag, Chia-Hsiu Yeh
  • Publication number: 20120129414
    Abstract: A thermosetting resin composition and a prepreg or laminate using the same are provided. The thermosetting resin composition includes an epoxy resin and a curing agent, in which the curing agent is a dual-curing agent system formed with a multi-functional aromatic polyester curing agent in combination with a phenolphthalein benzoxazine phenol aldehyde or a poly(styrene-co-maleic anhydride). An organic or inorganic fiber reinforced material is impregnated with the thermosetting resin composition to form a prepreg, and the prepreg is bonded to a substrate with a metal foil disposed thereon, to form a laminate.
    Type: Application
    Filed: November 24, 2010
    Publication date: May 24, 2012
    Inventors: Chung-Hao CHANG, Hsiu-Lien Wu, Han-Shiang Huag, Chia-Hsiu Yeh
  • Publication number: 20120095132
    Abstract: A halogen- and phosphorus-free thermosetting resin composition is provided, which is mainly a varnish resin formed by mixing a mixture of two curing agents, an epoxy resin mixture, and an inorganic additive. The mixture of two curing agents is formed by mixing a phenolphthalein modified benzoxazine phenol aldehyde curing agent and an amino triazine novolak, and the epoxy resin mixture is formed by mixing an epoxy resin having an oxazolidone ring or a polyamide-imide-modified epoxy resin and a Bisphenol F epoxy resin.
    Type: Application
    Filed: October 19, 2010
    Publication date: April 19, 2012
    Inventors: Chung-Hao CHANG, Chia-Hsiu Yeh, Hui-Min Lin
  • Patent number: D836201
    Type: Grant
    Filed: April 5, 2017
    Date of Patent: December 18, 2018
    Assignee: MAISENSE INC.
    Inventors: Yung-Pin Lee, Min-Hao Lee, Chia-Hsiu Yeh