Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above- mentioned memory device is also provided.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.

Abstract: A flexible circuit board includes a substrate and a circuit unit formed on the substrate. The substrate has two carrying segments and a connecting segment, and the two carrying segments are connected by the connecting segment. The circuit unit has a plurality of conductive lines and at least one connecting line, and each conductive line and the connecting line are separated from each other. The conductive lines are respectively formed on the two carrying segments, and the connecting line is formed on the connecting segment and the two carrying segments. Two opposite ends of each carrying segment are configured to connect with each other to form a tubular structure, and two opposite ends of the connecting line are configured to connect to two adjacent conductive lines respectively formed on the two tubular structures, thereby the circuit unit is formed as a coil.

Abstract: A beacon device includes an antenna, a low-power RF (Radio Frequency) device, a light sensor, a microprocessor, and a battery. The low-power RF device generates an RF signal, and the antenna transmits the RF signal outwardly. The light sensor detects intensity of light nearby, and generates a detection signal. The microprocessor controls an operation mode of the low-power RF device according to the detection signal. The battery supplies electric power to the low-power RF device, the light sensor, and the microprocessor.

Abstract: A printed circuit board precursor includes a substrate, a catalytic layer, a conductive layer, and a metal layer. The substrate has a top surface, a bottom surface, and a wall defining a channel, and the channel completely penetrates through the substrate from the top surface to the bottom surface. The catalytic layer is formed on the top surface, the bottom surface, and the wall of the substrate. The conductive layer is attached to and covers the catalytic layer. The metal layer is disposed on the conductive layers and filled in the channel.

Abstract: A method of manufacturing a printed circuit board precursor includes the steps of providing a substrate. Then the surface of the substrate is catalyzed to form a catalytic layer by a catalyst. Subsequently, a conductive layer is formed and attached to the surface of the catalytic layer. Finally, a metal layer is electroplated on the conductive layer. A printed circuit board precursor includes a substrate having a surface. Specifically, the surface is catalytically treated to form a catalytic layer. The precursor also includes a conductive layer which is attached to and covers the catalytic layer and a metal layer which is disposed on the conductive layer.

Abstract: A flexible circuit board comprises a substrate which has a polyimide layer recessed to define at least a compartment. The compartment includes an inner wall surface having a side wall and a bottom wall. The compartment is for containing a multilayer unit, wherein the multilayer unit includes an adhesion enhancing layer formed on the wall of the compartment, a first electrically conducting layer disposed on the adhesion enhancing layer, and a second electrically conducting layer formed on the first electrically conducting layer. The adhesion enhancing layer is palladium. The first electrically conducting layer is nickel. The substrate is composed of polyimide (PI).

Abstract: A beacon device includes an antenna, a low-power RF (Radio Frequency) device, a light sensor, a microprocessor, and a battery. The low-power RF device generates an RF signal, and the antenna transmits the RF signal outwardly. The light sensor detects intensity of light nearby, and generates a detection signal. The microprocessor controls an operation mode of the low-power RF device according to the detection signal. The battery supplies electric power to the low-power RF device, the light sensor, and the microprocessor.

Abstract: A multi-function Radio-Frequency device integrated into a computer system is disclosed and includes a substrate including a first surface and a second surface opposite to each other, a touchpad area disposed on the first surface of the substrate for generating a touch signal according to a touch situation, an antenna disposed on the first surface and/or the second surface of the substrate for receiving and transmitting a Radio-Frequency signal, and a control module disposed on the second surface of the substrate and coupled to the touchpad area and the antenna for generating a touch control signal according to the touch signal and generating an identification signal according to the Radio-Frequency signal to the computer system.

Abstract: A method of manufacturing a printed circuit board precursor includes the steps of providing a substrate. Then the surface of the substrate is catalyzed to form a catalytic layer by a catalyst. Subsequently, a conductive layer is formed and attached to the surface of the catalytic layer. Finally, a metal layer is electroplated on the conductive layer. A printed circuit board precursor includes a substrate having a surface. Specifically, the surface is catalytically treated to form a catalytic layer. The precursor also includes a conductive layer which is attached to and covers the catalytic layer and a metal layer which is disposed on the conductive layer.

Abstract: The present invention provides a multi-layer flexible circuit board, comprising at least an electric circuit disposed on a vertical interval layer, wherein at least two sides of the electric circuit are covered by neighboring interval layer and another vertical interval composed layer of electric insulating material. The disclosure provides a non-pressing way to stack the multi-layer flexible circuit board, preventing fault crevice derived from a prior-known pressing way.

Abstract: The present invention provides a flexible circuit board, comprising at least a multilayer unit disposed on a substrate, wherein the multilayer unit includes: an adhesion enhancing layer formed within the surface of the substrate, a first electrical conducting unit disposed on the adhesion enhancing layer, and a second electrical conducting layer formed on the first electrical conducting layer, wherein the adhesion enhancing layer is Palladium, the first electrical conducting layer is Nickel, and the substrate is composed of polyimide(PI).

Abstract: A flexible circuit board comprises a substrate which has a polyimide layer recessed to define at least a compartment. The compartment includes an inner wall surface having a side wall and a bottom wall. The compartment is for containing a multilayer unit, wherein the multilayer unit includes an adhesion enhancing layer formed on the wall of the compartment, a first electrically conducting layer disposed on the adhesion enhancing layer, and a second electrically conducting layer formed on the first electrically conducting layer. The adhesion enhancing layer is palladium. The first electrically conducting layer is nickel. The substrate is composed of polyimide (PI).

Abstract: A multi-function Radio-Frequency device integrated into a computer system is disclosed and includes a substrate including a first surface and a second surface opposite to each other, a touchpad area disposed on the first surface of the substrate for generating a touch signal according to a touch situation, an antenna disposed on the first surface and/or the second surface of the substrate for receiving and transmitting a Radio-Frequency signal, and a control module disposed on the second surface of the substrate and coupled to the touchpad area and the antenna for generating a touch control signal according to the touch signal and generating an identification signal according to the Radio-Frequency signal to the computer system.