Abstract: An image processing circuit includes a receiving circuit, a transmitting circuit, a first asynchronous handshake circuit, a super resolution scale-up model and a second asynchronous handshake circuit. The receiving circuit is arranged to receive an input image with a first pixel clock frequency. The first asynchronous handshake circuit is arranged to receive the input image from the receiving circuit according to a receiving timing. The super resolution scale-up model is arranged to scale up the input image to generate an output image with a second pixel clock frequency. The second asynchronous handshake circuit is arranged to output the output image to the transmitting circuit according to a transmitting timing to transmit the output image, wherein the first asynchronous handshake circuit, the super resolution scale-up model, and the second asynchronous handshake circuit operate at a clock frequency independent of the first pixel clock frequency and the second pixel clock frequency.

Abstract: A sensor package structure and a manufacturing method thereof are provided. The sensor package structure includes a substrate, a fixing adhesive layer disposed on the substrate, a sensor chip adhered to the fixing adhesive layer, an annular adhering layer disposed on the sensor chip, a light-permeable sheet adhered to the annular adhering layer, and a plurality of metal wires that are electrically coupled to the substrate and the sensor chip. The size of the light-permeable sheet is smaller than that of the sensor chip.

Abstract: A sensor package structure includes a substrate, a sensor chip disposed on and electrically coupled to the substrate, a light-permeable layer, an adhesive layer having a ring-shape and sandwiched between the sensor chip and the light-permeable layer, and an encapsulant formed on the substrate. The adhesive layer has two adhering surfaces having a same area and a middle cross section located at a middle position between the two adhering surfaces. An area of the middle cross section is 115% to 200% of an area of any one of the two adhering surfaces. The adhesive layer can provide for light to travel therethrough, and enables the light therein to change direction and to attenuate. The sensor chip, the adhesive layer, and the light-permeable layer are embedded in the encapsulant, and an outer surface of the light-permeable layer is at least partially exposed from the encapsulant.

Abstract: A method for SCell BFR performed by a UE is provided. The method includes: receiving a first SCell BFR configuration corresponding to a first SCell, the first SCell BFR configuration including at least one of a resource list for BFD and a resource list for NBI; detecting a beam failure condition in the first SCell by measuring at least one BFD reference signal; determining a first new candidate beam index for the first SCell based on the first SCell BFR configuration; and transmitting a beam failure recovery request that includes a cell index of the first SCell in which beam failure occurs and the determined first new candidate beam index.

Abstract: A display device and a light detection module are provided. The display device includes a display panel and the light detection module. The light detection module is capable of detecting an optical feature of a display surface of the display panel, and includes a shaft portion, a rod portion, and a light detector. The shaft portion has a shaft extension direction. The rod portion has a rod extension direction, and takes the shaft portion as a rotation shaft. An included angle between the rod extension direction and the shaft extension direction is between 125 degrees and 145 degrees.

Abstract: A method performed by a user equipment for a beam operation is provided. The method includes: receiving an RRC configuration for configuring a set of joint TCI states; receiving, from the BS, a MAC CE for activating a subset of joint TCI states in the set of joint TCI states, the MAC CE is used to map the subset of joint TCI states to codepoints of a TCI field in DCI; receiving the DCI indicating a joint TCI state included in the subset of joint TCI states activated by the MAC CE; determining whether the DCI includes a DL assignment; transmitting, in response to reception of the DCI, first HARQ-ACK information in a case that the DCI does not include the DL assignment; and transmitting, in response to the reception of the DCI and reception of a PDSCH, second HARQ-ACK information in a case that the DCI includes the DL assignment.

Abstract: A wireless communication method and apparatus for handling radio resource collision are provided. The wireless communication method includes receiving a Radio Resource Control (RRC) configuration indicating a first Control Resource Set (CORESET) pool index associated with a Physical Uplink Control Channel (PUCCH) designated to carry Uplink Control Information (UCI); determining whether the PUCCH overlaps one or more Physical Uplink Shared Channels (PUSCHs) in time domain; after determining that the PUCCH overlaps at least one of the one or more PUSCHs in the time domain, multiplexing the UCI on a particular PUSCH of the one or more PUSCHs that is associated with the first CORESET pool index; and transmitting the UCI via the particular PUSCH.

Abstract: A backlight module including a back plate, a light guide plate, a light source, a plastic frame, and a light conversion layer is provided. The light guide plate is disposed on the back plate and has a light incident surface and a light exit surface, wherein a first edge of the light exit surface is adjacent to the light incident surface. The light source is disposed on the back plate and faces the light incident surface. The plastic frame is disposed on the back plate and covers the first edge. The light conversion layer is disposed on the light exit surface and extends to the first edge.

Abstract: An apparatus for measuring the optoelectronic characteristics of a light-emitting diode includes: a container including a light input port and a light output port; a measurement module connected to the light output port of the container; a sample holder under the container for holding a light-emitting diode under test, wherein a surface of the measurement module reflects more than 50% of the luminous flux generated by the light-emitting diode under test; and a light gathering unit between the container and the sample holder, wherein an interior wall of the light gathering unit reflects more than 50% of the luminous flux generated by the light-emitting diode under test.

Abstract: A backlight module including a back plate, a light guide plate, a light source, a plastic frame, and a light conversion layer is provided. The light guide plate is disposed on the back plate and has a light incident surface and a light exit surface, wherein a first edge of the light exit surface is adjacent to the light incident surface. The light source is disposed on the back plate and faces the light incident surface. The plastic frame is disposed on the back plate and covers the first edge. The light conversion layer is disposed on the light exit surface and extends to the first edge.

Abstract: An apparatus for measuring the optoelectronic characteristics of a light-emitting diode includes: a container including a light input port and a light output port; a measurement module connected to the light output port of the container; a sample holder under the container for holding a light-emitting diode under test, wherein a surface of the measurement module reflects more than 50% of the luminous flux generated by the light-emitting diode under test; and a light gathering unit between the container and the sample holder, wherein an interior wall of the light gathering unit reflects more than 50% of the luminous flux generated by the light-emitting diode under test.

Abstract: A light source module includes a light source, a light guide unit, an opaque reflective element, a reflective unit, and a patterned light-absorbing element. The light guide unit has first and second surfaces, a light incident surface, and third and fourth surfaces. A beam from the light source enters the light guide unit through the light incident surface and is transmitted to outside through the first surface. The opaque reflective element covers a portion of the first surface adjacent to the light incident surface. The patterned light-absorbing element is disposed on a surface of the reflective unit. A portion of the patterned light-absorbing element is between a portion of the third surface adjacent to the light incident surface and the reflective unit. Another portion of the patterned light-absorbing element is between a portion of the fourth surface adjacent to the light incident surface and the reflective unit.

Abstract: An optical touch apparatus includes at least one light source, at least one light guide unit, at least one optical detector, and a light reducing structure. The light source is disposed beside a display area of a display and capable of providing a light beam. The light guide unit is disposed beside the display area and in a transmission path of the light beam. The light guide unit has a first surface, a second surface, and a light incident surface. The light beam is capable of entering the light guide unit through the light incident surface and being transmitted to a sensing space in front of the display area through the first surface. The optical detector is disposed beside the display area. The light reducing structure covers a portion of the first surface adjacent to the light incident surface.