Patents by Inventor Chia-Jang Chen

Chia-Jang Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240178224
    Abstract: A method for forming a FinFET device structure is provided. The FinFET device structure includes a first fin structure extending above a substrate, and a first liner layer formed on a first sidewall surface of the first fin structure. The FinFET device structure includes a gate dielectric layer formed over the first fin structure and the first liner layer, wherein a sidewall surface of the gate dielectric layer is aligned with a sidewall surface of the first liner layer.
    Type: Application
    Filed: January 31, 2024
    Publication date: May 30, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chung-Shu WU, Shu-Uei JANG, Wei-Yeh TANG, Ryan Chia-Jen CHEN, An-Chyi WEI
  • Patent number: 11990341
    Abstract: A method of forming a semiconductor device includes etching a gate stack to form a trench extending into the gate stack, forming a dielectric layer on a sidewall of the gate stack, with the sidewall exposed to the trench, and etching the dielectric layer to remove a first portion of the dielectric layer at a bottom of the trench. A second portion of the dielectric layer on the sidewall of the gate stack remains after the dielectric layer is etched. After the first portion of the dielectric layer is removed, the second portion of the dielectric layer is removed to reveal the sidewall of the gate stack. The trench is filled with a dielectric region, which contacts the sidewall of the gate stack.
    Type: Grant
    Filed: August 9, 2022
    Date of Patent: May 21, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Shu-Uei Jang, Ya-Yi Tsai, Ryan Chia-Jen Chen, An Chyi Wei, Shu-Yuan Ku
  • Publication number: 20240155768
    Abstract: An electronic device includes a device casing, a display panel module disposed on the device casing and having a panel rear side, and a function module disposed between the device casing and the display panel module and comprising a function unit and a fixed bracket, the fixed bracket has a panel attaching surface and an installation surface, the fixed bracket is attached to the panel rear side via the panel attaching surface, the function unit is slidably disposed on the installation surface of the fixed bracket, and the installation surface and the panel attaching surface respectively face different directions.
    Type: Application
    Filed: February 10, 2023
    Publication date: May 9, 2024
    Inventors: Minglang Guo, Dun Liu, YuanChang He, Chia-Jang Chen
  • Patent number: 11923359
    Abstract: A method for forming a FinFET device structure is provided. The method includes forming a first fin structure and a second fin structure over a substrate and forming a liner layer over the first fin structure and the second fin structure. The method also includes forming an isolation layer over the liner layer and removing a portion of the liner layer and a portion of the isolation layer, such that the liner layer includes a first liner layer on an outer sidewall surface of the first fin structure and a second liner layer on an inner sidewall surface of the first fin structure, and a top surface of the second liner layer is higher than a top surface of the first liner layer.
    Type: Grant
    Filed: July 12, 2021
    Date of Patent: March 5, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chung-Shu Wu, Shu-Uei Jang, Wei-Yeh Tang, Ryan Chia-Jen Chen, An-Chyi Wei
  • Publication number: 20240053790
    Abstract: A monitor includes a casing assembly, a light-emitting module and a display panel. The casing assembly includes a casing and a support frame. The support frame is disposed in the casing. The support frame includes an accommodation portion and at least one support portion, the accommodation portion is connected to the casing, the support portion is connected to the accommodation portion and protrudes from the accommodation portion. The light-emitting module is disposed in the accommodation portion. The display panel is supported by the at least one support portion.
    Type: Application
    Filed: December 21, 2022
    Publication date: February 15, 2024
    Inventors: CHUNLEI ZHAO, Liang Yang, YAO-CHEN YANG, chia-jang Chen, chih chou Chou
  • Patent number: 11868183
    Abstract: A retractable assembly includes a fixed frame, a movable frame and a plurality of first balls. The fixed frame has an accommodation portion and a plurality of guiding portions. The guiding portions are connected to the accommodation portion. The movable frame is at least partially located in the accommodation portion. The first balls are movably located in the guiding portions, and the movable frame is connected to the fixed frame via the first balls.
    Type: Grant
    Filed: February 7, 2022
    Date of Patent: January 9, 2024
    Assignee: WISTRON CORP.
    Inventors: Zijie Iin, Yao-Chen Yang, Chia-Jang Chen, Chih Chou Chou
  • Publication number: 20230136093
    Abstract: A retractable assembly includes a fixed frame, a movable frame and a plurality of first balls. The fixed frame has an accommodation portion and a plurality of guiding portions. The guiding portions are connected to the accommodation portion. The movable frame is at least partially located in the accommodation portion. The first balls are movably located in the guiding portions, and the movable frame is connected to the fixed frame via the first balls.
    Type: Application
    Filed: February 7, 2022
    Publication date: May 4, 2023
    Inventors: Zijie Lin, YAO-CHEN YANG, Chia-Jang Chen, Chih Chou Chou
  • Publication number: 20230131796
    Abstract: A liquid crystal display includes a casing and a displaying module disposed in the casing. The displaying module includes a backlight module and a liquid crystal panel stacked on the backlight module. The backlight module includes a back chassis and a light-guiding plate. The back chassis has a bottom plate portion and a side portion bent from the bottom plate portion and forms an accommodating space therebetween. The back chassis has a constraining portion in the accommodating space. The light-guiding plate is accommodated in the accommodating space. At least a portion of the light-guiding plate is located between the constraining portion and the bottom plate portion.
    Type: Application
    Filed: January 11, 2022
    Publication date: April 27, 2023
    Applicant: Wistron Corporation
    Inventors: CHUNLEI ZHAO, Yao-Chen Yang, Chia-Jang Chen, Chih-Chou Chou