Patents by Inventor Chia-Jen Hsu

Chia-Jen Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240108954
    Abstract: Lacrosse shafts are provided that include graphene. The graphene increases the durability of the lacrosse shafts. Also provided is equipment for other contact sports that include graphene to increase durability.
    Type: Application
    Filed: December 8, 2023
    Publication date: April 4, 2024
    Inventors: Hamilton Sean Michael WHITNEY, Gregory Lee KENNEALLY, Chia-Jen HSU, Bor Z. JANG, Aruna ZHAMU
  • Patent number: 11934027
    Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.
    Type: Grant
    Filed: June 21, 2022
    Date of Patent: March 19, 2024
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Chih-Wei Weng, Chia-Che Wu, Chien-Yu Kao, Hsiao-Hsin Hu, He-Ling Chang, Chao-Hsi Wang, Chen-Hsien Fan, Che-Wei Chang, Mao-Gen Jian, Sung-Mao Tsai, Wei-Jhe Shen, Yung-Ping Yang, Sin-Hong Lin, Tzu-Yu Chang, Sin-Jhong Song, Shang-Yu Hsu, Meng-Ting Lin, Shih-Wei Hung, Yu-Huai Liao, Mao-Kuo Hsu, Hsueh-Ju Lu, Ching-Chieh Huang, Chih-Wen Chiang, Yu-Chiao Lo, Ying-Jen Wang, Shu-Shan Chen, Che-Hsiang Chiu
  • Patent number: 11934035
    Abstract: An optical mechanism is provided, including a housing, a base, and a metal supporting member. The housing has a top cover and a sidewall connected to the top cover, wherein the top cover and the sidewall comprises plastic material. The base is connected to the housing, wherein an optical element is accommodated in a space between the housing and the base. At least a part of the metal supporting member is embedded in the housing.
    Type: Grant
    Filed: April 19, 2021
    Date of Patent: March 19, 2024
    Assignee: TDK TAIWAN CORP.
    Inventors: Chien-Lun Huang, Shou-Jen Liu, Chia-Pin Hsu, Sin-Jhong Song
  • Publication number: 20240087878
    Abstract: A semiconductor wafer cleaning apparatus is provided. The semiconductor wafer cleaning apparatus includes a spin base, a spindle extending through the spin base, and a clamping member covering the spin base. The spindle includes a mounting part and a supporting part disposed on the mounting part. The mounting part includes an inner projection, the supporting part includes a conical projection, and the conical projection is surrounded by the inner projection. The semiconductor wafer cleaning apparatus further includes a first sealing ring disposed between the spin base and the mounting part.
    Type: Application
    Filed: November 22, 2023
    Publication date: March 14, 2024
    Inventors: Chia-Lun CHEN, Po-Jen SHIH, Ming-Sung HUNG, Wen-Hung HSU
  • Patent number: 11865421
    Abstract: Lacrosse heads are provided that include a polymer and graphene. The graphene increases the durability of the lacrosse heads. Also provided is equipment for other contact sports that include graphene to increase durability.
    Type: Grant
    Filed: July 6, 2021
    Date of Patent: January 9, 2024
    Assignee: EAST COAST DYES, INC.
    Inventors: Hamilton Sean Michael Whitney, Gregory Lee Kenneally, Chia-Jen Hsu, Bor Z. Jang, Aruna Zhamu
  • Publication number: 20210331049
    Abstract: Lacrosse heads are provided that include a polymer and graphene. The graphene increases the durability of the lacrosse heads. Also provided is equipment for other contact sports that include graphene to increase durability.
    Type: Application
    Filed: July 6, 2021
    Publication date: October 28, 2021
    Inventors: Hamilton Sean Michael WHITNEY, Gregory Lee KENNEALLY, Chia-Jen HSU, Bor Z. JANG, Aruna ZHAMU
  • Patent number: 11090538
    Abstract: Lacrosse heads are provided that include a polymer and graphene. The graphene increases the durability of the lacrosse heads, while having limited impact on the stiffness and flexibility of the lacrosse heads. Also provided is equipment for other contact sports that include graphene to increase durability.
    Type: Grant
    Filed: December 3, 2019
    Date of Patent: August 17, 2021
    Assignee: EAST COAST DYES, INC.
    Inventors: Hamilton Sean Michael Whitney, Gregory Lee Kenneally, Chia-Jen Hsu, Bor Z. Jang, Aruna Zhamu
  • Publication number: 20200188749
    Abstract: Lacrosse heads are provided that include a polymer and graphene. The graphene increases the durability of the lacrosse heads, while having limited impact on the stiffness and flexibility of the lacrosse heads. Also provided is equipment for other contact sports that include graphene to increase durability.
    Type: Application
    Filed: December 3, 2019
    Publication date: June 18, 2020
    Inventors: Hamilton Sean Michael WHITNEY, Gregory Lee KENNEALLY, Chia-Jen HSU, Bor Z. JANG, Aruna ZHAMU
  • Patent number: 10498171
    Abstract: A wireless power receiver includes circuitry configured to receive a wirelessly induced voltage from a wireless power transmitter via a magnetically induced connection with the wireless power transmitter. It is determined that an overvoltage condition exists when the wirelessly induced voltage exceeds a threshold voltage, and the wirelessly induced voltage is reduced in response to determining that the overvoltage condition exists. The circuitry communicates the overvoltage condition to the wireless power transmitter via the magnetically induced connection while over-voltage protection is enabled.
    Type: Grant
    Filed: September 15, 2016
    Date of Patent: December 3, 2019
    Assignee: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
    Inventors: Russell E. Radke, Ryan Desrosiers, Chia-Jen Hsu, Desheng Ma
  • Publication number: 20180272565
    Abstract: Provided is a method of producing pellets of a graphene-polymer composite, the method comprising: (a) mixing multiple particles of a graphitic material and multiple particles of a solid polymer carrier material to form a mixture in an impacting chamber of an energy impacting apparatus; (b) operating the energy impacting apparatus with a frequency and an intensity for a length of time sufficient for peeling off graphene sheets from the graphitic material particles and transferring the graphene sheets to surfaces of the solid polymer carrier material particles to produce graphene-coated polymer particles inside the impacting chamber; and (c) feeding multiple graphene-coated polymer particles into an extruder to produce filaments of an extruded graphene-polymer composite and operating a cutter or pelletizer to cut the filaments into pellets of graphene-polymer composite. The process is fast (hours as opposed to days of conventional processes), environmentally benign, cost effective, and highly scalable.
    Type: Application
    Filed: May 29, 2018
    Publication date: September 27, 2018
    Applicant: Nanotek Instruments, Inc.
    Inventors: Aruna Zhamu, Chia-Jen Hsu, Bor Z. Jang
  • Patent number: 9836420
    Abstract: An integrated circuit is provided. The integrated circuit includes a mapping circuit configured to determine a state associated with a first universal series bus (USB) communication mode based on one or both of a signal level on a first data line and a signal level on a second data line. The integrated circuit also includes a line state converter circuit configured to generate a line state associated with a second USB communication mode based on the determined state and based on one or both of the signal level on the first data line and the signal level on the second data line.
    Type: Grant
    Filed: March 11, 2015
    Date of Patent: December 5, 2017
    Assignee: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
    Inventors: Dae Woon Kang, Desheng Ma, Derek Hing Sang Tam, Chia-Jen Hsu, Preeti Mulage
  • Patent number: 9727514
    Abstract: An integrated circuit is provided. The integrated circuit includes a communication-mode determination circuitry configured to detect a signal level at one or both of a first data line and a second data line and to determine whether a communication mode of the first data line and the second data line is a first universal series bus (USB) communication mode or a second USB communication mode. The integrated circuit also includes a first transceiver circuitry configured to operate in one of multiple modes, based on the communication mode determined. The integrated circuit also includes a second transceiver circuitry configured to operate in one of multiple modes, based on the communication mode determined. A maximum signal level of the first USB communication mode is greater than a maximum signal level of the second USB communication mode.
    Type: Grant
    Filed: January 6, 2015
    Date of Patent: August 8, 2017
    Assignee: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
    Inventors: Desheng Ma, Derek Hing Sang Tam, Chia-Jen Hsu, Preeti Mulage
  • Publication number: 20170202792
    Abstract: A method for treating a tau-associated disease is disclosed, which comprises the step of administering a pharmaceutical composition to a subject in need. Particularly, a method for treating Alzheimer's disease is disclosed, which comprises the step of administering a pharmaceutical composition to a subject in need.
    Type: Application
    Filed: August 16, 2016
    Publication date: July 20, 2017
    Inventors: Hsiu-Mei HSIEH, Ying-Chieh SUN, Guan-Chiun LEE, Guey-Jen LEE-CHEN, Ming-Tsan SU, Hui-Chen HUANG, Yu-Shao HSIEH, Chia-Jen HSU
  • Publication number: 20170104368
    Abstract: A wireless power receiver includes circuitry configured to receive a wirelessly induced voltage from a wireless power transmitter via a magnetically induced connection with the wireless power transmitter. It is determined that an overvoltage condition exists when the wirelessly induced voltage exceeds a threshold voltage, and the wirelessly induced voltage is reduced in response to determining that the overvoltage condition exists. The circuitry communicates the overvoltage condition to the wireless power transmitter via the magnetically induced connection while over-voltage protection is enabled.
    Type: Application
    Filed: September 15, 2016
    Publication date: April 13, 2017
    Applicant: BROADCOM CORPORATION
    Inventors: Russell E. RADKE, Ryan DESROSIERS, Chia-Jen HSU, Desheng MA
  • Publication number: 20160162430
    Abstract: An integrated circuit is provided. The integrated circuit includes a communication-mode determination circuitry configured to detect a signal level at one or both of a first data line and a second data line and to determine whether a communication mode of the first data line and the second data line is a first universal series bus (USB) communication mode or a second USB communication mode. The integrated circuit also includes a first transceiver circuitry configured to operate in one of multiple modes, based on the communication mode determined. The integrated circuit also includes a second transceiver circuitry configured to operate in one of multiple modes, based on the communication mode determined. A maximum signal level of the first USB communication mode is greater than a maximum signal level of the second USB communication mode.
    Type: Application
    Filed: January 6, 2015
    Publication date: June 9, 2016
    Inventors: Desheng MA, Derek Hing Sang Tam, Chia-Jen Hsu, Preeti Mulage
  • Publication number: 20160162427
    Abstract: An integrated circuit is provided. The integrated circuit includes a mapping circuit configured to determine a state associated with a first universal series bus (USB) communication mode based on one or both of a signal level on a first data line and a signal level on a second data line. The integrated circuit also includes a line state converter circuit configured to generate a line state associated with a second USB communication mode based on the determined state and based on one or both of the signal level on the first data line and the signal level on the second data line.
    Type: Application
    Filed: March 11, 2015
    Publication date: June 9, 2016
    Inventors: Dae Woon KANG, Desheng MA, Derek Hing Sang TAM, Chia-Jen HSU, Preeti MULAGE
  • Patent number: 9356616
    Abstract: A multi-bit per cycle successive approximation register (SAR) analog-to-digital converter (ADC) may sample an input signal, successively approximate the sampled signal with a shrinking sub-range containing the signal, and output coarse digital codes corresponding to the sub-range. A sub-ranging stage may continue quantization over the sub-range by sampling and interpolating between a pair of zero crossing signals that bound the sub-range. The zero crossing signals may be taken from the SAR preamp output. The sub-ranging process may be pipelined recursively in multiple stages to increase throughput and efficiency.
    Type: Grant
    Filed: August 3, 2015
    Date of Patent: May 31, 2016
    Assignee: Broadcom Corporation
    Inventors: Hui Pan, Xin Jin, Chia-Jen Hsu
  • Publication number: 20160093556
    Abstract: A quad-flat non-lead package structure includes a film layer, a conducting layer, a die, an encapsulant, and a plurality of metal bumps. The film layer has a plurality of through holes. A pad of the conducting layer and conducting wirings are disposed at the film layer but are not connected to each other. The conducting wirings are disposed at the through holes, respectively. The die is fixedly disposed at the pad and electrically connected to the conducting wirings. The encapsulant covers the conducting layer and the die. The metal bumps are disposed in the through holes, respectively, each have one end electrically connected to a corresponding one of the conducting wirings, and each have the other end protruding from a corresponding one of the through holes. Accordingly, the quad-flat non-lead package structure features reduced likelihood of pin disconnection and enhanced adhesiveness required for surface-mount technology.
    Type: Application
    Filed: November 7, 2014
    Publication date: March 31, 2016
    Inventors: Ming-Te TU, Ching-I LIN, Chia-Jen HSU, Sheng-Jen LIN
  • Patent number: 9252833
    Abstract: Disclosed are various embodiments for providing a power-efficient driver architecture supporting rail-to-rail operation in full duplex mode. A driver is configured to drive a duplex signal over a transmission medium. A hybrid is configured to recover a received signal from the duplex signal. The received signal is generated by a remote transceiver. The driver is configured to drive the duplex signal based at least in part on the received signal recovered by the hybrid.
    Type: Grant
    Filed: May 7, 2012
    Date of Patent: February 2, 2016
    Assignee: BROADCOM CORPORATION
    Inventors: Hui Pan, Yuan Yao, Joseph Aziz, Derek Tam, Xin Wang, Chia-Jen Hsu
  • Publication number: 20150279796
    Abstract: A method of manufacturing a quad-flat no-leads package (QFN) structure includes: forming a conducting layer on a surface of a thin-film layer; forming a plurality of conduction wirings from the conducting layer by a means of circuit layout; electrically connecting contact pads of a die to front ends of the conduction wirings, respectively; forming a plurality of through-holes in the thin-film layer by a means of drilling, such that terminal ends of the conduction wirings are exposed from the through-holes, respectively; and forming a plurality of metal bumps at the through-holes, respectively, such that signals from the die are sent to a bottom surface of the thin-film layer through the conduction wirings. Hence, the QFN structure and the method of manufacturing the same based on application of wafer-level chip-scale package (WLCSP) and extension of tape QFN to simplify the package manufacturing process, cut production costs, and enhance production yield.
    Type: Application
    Filed: June 17, 2014
    Publication date: October 1, 2015
    Inventors: Ming-Te TU, Ching-I LIN, Chia-Jen HSU, Sheng-Jen LIN