Patents by Inventor Chia-Jen Ting

Chia-Jen Ting has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240090163
    Abstract: A display includes an outer frame, a supporting frame, a display module, and a covering member. The supporting frame is accommodated in the outer frame. The display module is disposed on a supporting member of the supporting frame. The supporting member extends toward a display region of the display module from the supporting frame. On a first surface of the display module, a projection area of the supporting member and a projection area of an first optical film of the display module are partially overlapped with each other. A third surface of the covering member is closely attached to a second optical film of the display module. The covering member has an extension portion. The extension portion extends from a fourth surface opposite to the third surface toward a direction away from the third surface, and the extension portion is coplanar with the outer side surface of the outer frame.
    Type: Application
    Filed: November 20, 2023
    Publication date: March 14, 2024
    Inventors: Chia-Hung Chen, Chung-Kuan Ting, Hong-Ming Chen, Yung-Jen Chen
  • Publication number: 20190385826
    Abstract: A plasma processing device includes an upper electrode assembly and a lower electrode assembly. The upper electrode assembly has a plurality of post electrodes, made of a conductive material, protruding individually out of one surface of the upper electrode assembly, and connected to a plasma source. A plasma deficiency area having no post electrode is disposed in a center portion of the upper electrode assembly. The plurality of post electrodes are disposed in a ringlike electrode distribution area surrounding concentrically the plasma deficiency area. The lower electrode assembly is rotatable, made of a conducting material, and covered by a dielectric material.
    Type: Application
    Filed: November 5, 2018
    Publication date: December 19, 2019
    Inventors: CHIH-CHIANG WENG, CHEN-DER TSAI, CHIA-JEN TING, JUI-MEI HSU, YO-SUNG LEE, CHIH-HUNG LIU
  • Publication number: 20180130679
    Abstract: The present invention relates to a plasma processing device, comprising: an upper electrode has a plurality of protruding posts which made by conducting material and protruded out of one surface of the upper electrode and connected to a plasma producing source and formed a plurality of circles that around a center, each circle has at least one protruding post, the surface of the upper electrode that has protruding posts is covered with dielectric material, a plurality of gas holes disposed between protruding posts and connected to working gas source; a rotatable lower electrode is made of conducting material and covered with dielectric material which has a carry surface facing the surface of the upper electrode that has protruding posts for carrying workpiece.
    Type: Application
    Filed: December 28, 2016
    Publication date: May 10, 2018
    Inventors: CHIH-CHIANG WENG, CHEN-DER TSAI, CHIA-JEN TING, YING-FANG CHANG
  • Patent number: 9649740
    Abstract: A vibration assistant polishing module which comprises a polishing disk, a workpiece carrier tray, a linear guide way mechanism, a linkage, a motor and an adjustable eccentricity mechanism. The linear guide way mechanism includes a slide, a guide seat and a guide rod. The slide is pivot jointed with workpiece carrier tray and engaged in guide seat. The adjustable eccentricity mechanism comprises a base which is connected with a power shaft of the motor, and a pivot shaft of base and linkage is eccentric to the power shaft. The power shaft drives the base rotating and the linkage swinging eccentrically, and the slide moves linearly according to the limitation from guide seat, and a horizontal radial vibration and low frequency vibration is generated on the workpiece carrier tray, so the low frequency vibration is generated on the surface of the workpiece which is touched with the polishing disk.
    Type: Grant
    Filed: December 21, 2015
    Date of Patent: May 16, 2017
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chia-Jen Ting, Tsung-Hsin Lin, Ta-Hsin Chou, Chun-Fa Lan
  • Publication number: 20170120415
    Abstract: A vibration assistant polishing module which comprises a polishing disk, a workpiece carrier tray, a linear guide way mechanism, a linkage, a motor and an adjustable eccentricity mechanism. The linear guide way mechanism includes a slide, a guide seat and a guide rod. The slide is pivot jointed with workpiece carrier tray and engaged in guide seat. The adjustable eccentricity mechanism comprises a base which is connected with a power shaft of the motor, and a pivot shaft of base and linkage is eccentric to the power shaft. The power shaft drives the base rotating and the linkage swinging eccentrically, and the slide moves linearly according to the limitation from guide seat, and a horizontal radial vibration and low frequency vibration is generated on the workpiece carrier tray, so the low frequency vibration is generated on the surface of the workpiece which is touched with the polishing disk.
    Type: Application
    Filed: December 21, 2015
    Publication date: May 4, 2017
    Inventors: CHIA-JEN TING, TSUNG-HSIN LIN, TA-HSIN CHOU, CHUN-FA LAN
  • Publication number: 20130170203
    Abstract: A light-emitting diode (LED) array light source includes a substrate, a meshed light-shielding layer, LED chips, and a micro-lens array. The meshed light-shielding layer includes bar-shaped light-shielding patterns intersected with one another to define openings. Each bar-shaped light-shielding pattern has a bottom surface, a top surface, and two side surfaces. A width of the top surface is smaller than that of the bottom surface. A thickness of the meshed light-shielding layer is T1. Each LED chip is exclusively located in one of the openings. The micro-lens array covers the substrate, the meshed light-shielding layer, and the LED chips and includes micro-lenses arranged in array. Each micro-lens includes a base portion and a lens portion, and is disposed corresponding to one of the openings, respectively. A vertical distance from a top portion of each micro-lens to the bottom surface is T2, and 0.278?T1/T2?0.833.
    Type: Application
    Filed: September 4, 2012
    Publication date: July 4, 2013
    Applicant: Industrial Technology Research Institute
    Inventors: Kuei-Yuan Cheng, Chia-Jen Ting, Meng-Chi Huang, Hui-Hsiung Lin, Ta-Hsin Chou
  • Patent number: 8183519
    Abstract: A light concentrating module includes an optical film having a light incident surface and a light outgoing surface facing the light incident surface, an optical wedge element having a first surface, a second surface facing the first surface and having an angle with respect to the first surface and a third surface adjacent to the first and second surfaces, and at least one photoelectric chip disposed near the third surface. Light from a light source penetrates the optical film, and the light enters the first surface of the optical wedge element by an appropriate incident angle and has total reflection between the first and second surfaces, whereby the light propagates in the optical wedge element, and the light leaves the optical wedge element from the third surface and is received by the photoelectric chip.
    Type: Grant
    Filed: March 20, 2009
    Date of Patent: May 22, 2012
    Assignee: Industrial Technology Research Institute
    Inventors: Hui-Hsiung Lin, Wen-Hsun Yang, Yu-Nan Pao, Chia-Jen Ting
  • Publication number: 20110141765
    Abstract: A planar light source module including a light guide plate (LGP), a light source, an optical film, and a reflector is provided. The light source for emitting a light beam is disposed adjacent to the side light-incident surface, wherein the light beam enters the LGP from a side light-incident surface and leaves the LGP from a light-emergence surface in an emergence angle ?1, ?1?70 degrees. The optical film is disposed above the LGP to collimate the light beam from the LGP. The optical film includes a prism layer module and a bonding layer module stacked alternately. The prism layer module comprises prism layers and each prism layer includes micro-prisms. The bonding layer module comprises at least one bonding layer bonded with two prism layers adjacent thereto. The refraction index of the prism layers is greater than that of the bonding layer. The reflector is disposed under the bottom surface.
    Type: Application
    Filed: December 2, 2010
    Publication date: June 16, 2011
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yem-Yeu Chang, Chia-Jen Ting
  • Publication number: 20100133422
    Abstract: A light concentrating module includes an optical film having a light incident surface and a light outgoing surface facing the light incident surface, an optical wedge plate having a first surface, a second surface facing the first surface and having an angle with respect to the first surface and a third surface adjacent to the first and second surfaces, and at least one photoelectric chip disposed near the third surface. Light from a light source penetrates the optical film, and the light enters the first surface of the optical wedge by an appropriate incident angle and has total reflection between the first and second surfaces, whereby the light propagates in the optical wedge, and the light leaves the optical wedge from the third surface and is received by the photoelectric chip.
    Type: Application
    Filed: March 20, 2009
    Publication date: June 3, 2010
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Hui-Hsiung Lin, Wen-Hsun Yang, Yu-Nan Pao, Chia-Jen Ting
  • Publication number: 20080152901
    Abstract: A nano-structure optical insulating membrane includes a substrate, a nano-structure layer formed on the substrate, and a metal layer formed on the nano-structure layer is disclosed. Upon exposure to light, the nano-structure layer increases visible light transmission but reduces internal reflection, and the metal layer blocks infrared light and thereby provides thermal insulation. The nano-structure optical insulating membrane of the present invention enhances illumination, spares lighting equipment, saves energy, and enables users to see farther.
    Type: Application
    Filed: September 13, 2007
    Publication date: June 26, 2008
    Inventors: Chia-Jen Ting, Chin-Ju Hsu, Ya-Yu Nieh, Chang-Pin Chou
  • Patent number: 7329364
    Abstract: A method for manufacturing a bonded wafer with ultra-thin single crystal ferroelectric film is provided, comprising the following steps: providing a single crystal ferroelectric wafer and a carrier wafer while activating the surfaces of the single crystal ferroelectric wafer and the carrier wafer; bonding the activated surface of the single crystal ferroelectric wafer to the activated surface of the carrier wafer; and thinning the single crystal ferroelectric wafer for forming an ultra-thin single crystal ferroelectric film. Wherein, the thinning process in the aforesaid preferred embodiment is the method of polishing, grinding, chemical mechanical polishing, or etching. And the bonding force generated in the bonding process is strong enough to resist the shearing force.
    Type: Grant
    Filed: November 2, 2004
    Date of Patent: February 12, 2008
    Assignee: Industrial Technology Research Institute
    Inventors: Shih-Shian Ho, Hung-Yin Tsai, Chia-Jen Ting, Chun-Fa Lan, Chii-Chang Chen
  • Publication number: 20060090691
    Abstract: A method for manufacturing a bonded wafer with ultra-thin single crystal ferroelectric film is provided, comprising the following steps: providing a single crystal ferroelectric wafer and a carrier wafer while activating the surfaces of the single crystal ferroelectric wafer and the carrier wafer; bonding the activated surface of the single crystal ferroelectric wafer to the activated surface of the carrier wafer; and thinning the single crystal ferroelectric wafer for forming an ultra-thin single crystal ferroelectric film. Wherein, the thinning process in the aforesaid preferred embodiment is the method of polishing, grinding, chemical mechanical polishing, or etching. And the bonding force generated in the bonding process is strong enough to resist the shearing force.
    Type: Application
    Filed: November 2, 2004
    Publication date: May 4, 2006
    Inventors: Shih-Shian Ho, Hung-Yin Tsai, Chia-Jen Ting, Chun-Fa Lan, Chij-Chang Chen
  • Patent number: 5726812
    Abstract: A locking mechanism of zoom lens which is primarily applied on zoom lens to prevent the lens group of the zoom lens to prevent the lens group of the zoom lens structure from entering into the non-zooming zone of the curvilinear slots through its zooming zone. The said locking mechanism of zoom lens mainly consists of a reverse rotation stopping block, a spring-loaded restoring slider, a stopping piece and a cap.
    Type: Grant
    Filed: April 23, 1996
    Date of Patent: March 10, 1998
    Assignee: Industrial Technology Research Institute
    Inventors: Hsieh Min-Lang, Chia-Jen Ting