Patents by Inventor Chia-Jen Wang

Chia-Jen Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240130040
    Abstract: Disclosed are a conductive film and a test component. A conductive film includes a supporting layer, a circuit layer and a protective layer. The supporting layer has a first surface and a second surface opposite to the first surface. The supporting layer supports the circuit layer. The circuit layer includes a first protruding part, a second protruding part and a connecting part. The first protruding part is disposed on the first surface. The second protruding part is disposed on the second surface. The connecting part is disposed between the first protruding part and the second protruding part. The first protruding part is connected to the second protruding part through the connecting part. The protective layer covers the first protruding part. The conductive film and the test component of the disclosed embodiments may have a buffering effect or increase the service life.
    Type: Application
    Filed: September 7, 2023
    Publication date: April 18, 2024
    Applicant: Innolux Corporation
    Inventors: Ker-Yih Kao, Kuang-Ming Fan, Chia-Lin Yang, Jui-Jen Yueh, Ju-Li Wang
  • Patent number: 11934027
    Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.
    Type: Grant
    Filed: June 21, 2022
    Date of Patent: March 19, 2024
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Chih-Wei Weng, Chia-Che Wu, Chien-Yu Kao, Hsiao-Hsin Hu, He-Ling Chang, Chao-Hsi Wang, Chen-Hsien Fan, Che-Wei Chang, Mao-Gen Jian, Sung-Mao Tsai, Wei-Jhe Shen, Yung-Ping Yang, Sin-Hong Lin, Tzu-Yu Chang, Sin-Jhong Song, Shang-Yu Hsu, Meng-Ting Lin, Shih-Wei Hung, Yu-Huai Liao, Mao-Kuo Hsu, Hsueh-Ju Lu, Ching-Chieh Huang, Chih-Wen Chiang, Yu-Chiao Lo, Ying-Jen Wang, Shu-Shan Chen, Che-Hsiang Chiu
  • Patent number: 8487644
    Abstract: A method for optimizing an inspection recipe of a defect inspection tool is described. A substrate having thereon intentional defects and locating patterns beside the intentional defects is provided. The defect inspection tool is used to detect the intentional defects with an inspection recipe and obtain the distribution of undetected or partially detected intentional defects. The locating patterns are utilized to locate the undetected or partially detected intentional defects and thereby determine the type(s) of the undetected or partially detected intentional defects. The inspection recipe is modified according to the type(s) of the undetected or partially detected intentional defects in a manner such that there is a minimal number of undetected or partially detected intentional defects under the inspection of the defect inspection tool.
    Type: Grant
    Filed: July 21, 2010
    Date of Patent: July 16, 2013
    Assignee: United Microelectronics Corp.
    Inventors: Pong-Wey Huang, Hsi-Hua Liu, Chia-Jen Wang, Shuen-Cheng Lei, Huai-Te Huang, Jen-Po Huang
  • Publication number: 20120019279
    Abstract: A method for optimizing an inspection recipe of a defect inspection tool is described. A substrate having thereon intentional defects and locating patterns beside the intentional defects is provided. The defect inspection tool is used to detect the intentional defects with an inspection recipe and obtain the distribution of undetected or partially detected intentional defects. The locating patterns are utilized to locate the undetected or partially detected intentional defects and thereby determine the type(s) of the undetected or partially detected intentional defects. The inspection recipe is modified according to the type(s) of the undetected or partially detected intentional defects in a manner such that there is a minimal number of undetected or partially detected intentional defects under the inspection of the defect inspection tool.
    Type: Application
    Filed: July 21, 2010
    Publication date: January 26, 2012
    Applicant: United Microelectronics Corp.
    Inventors: Pong-Wey Huang, Hsi-Hua Liu, Chia-Jen Wang, Shuen-Cheng Lei, Huai-Te Huang, Jen-Po Huang
  • Publication number: 20100072106
    Abstract: A transmission cable coiler device is disclosed. The device has an internal module which has more than one cavity. The two lateral sides of the cavity are provided with a protruded edge and the center of the cavity is a resilient gap and the transmission cable connector is provided at the cavity. A winding body passes through the through hole at the top section of the external housing, it is tied to the upper section of the internal module. The external housing is mounted at the external of the internal module and the protruded urges the inner side of the external housing. The resilient gap is reduced to generate a reaction force such that the external housing and the internal module are closely matched in securing.
    Type: Application
    Filed: August 28, 2009
    Publication date: March 25, 2010
    Inventor: CHIA-JEN WANG
  • Patent number: 7336483
    Abstract: An external casing includes a housing housed with a data storage device and formed with an opening. An interface module is disposed in the housing, and is connected electrically to the data storage device disposed in the housing. An external electrical connector is connected electrically to the interface module. A foldable cover member includes a fixing portion secured to a first housing part of the housing, an engaging portion opposite to the fixing portion, and an intermediate covering portion interconnecting the fixing portion and the engaging portion and covering over the external electrical connector. A lock unit is provided on a second housing part of the housing and the engaging portion of the cover member for selectively anchoring the engaging portion of the cover member to the second housing part of the housing.
    Type: Grant
    Filed: April 27, 2006
    Date of Patent: February 26, 2008
    Assignee: Datastor Technology Co., Ltd.
    Inventor: Chia-Jen Wang
  • Publication number: 20070195498
    Abstract: An external casing includes a housing housed with a data storage device and formed with an opening. An interface module is disposed in the housing, and is connected electrically to the data storage device disposed in the housing. An external electrical connector is connected electrically to the interface module. A foldable cover member includes a fixing portion secured to a first housing part of the housing, an engaging portion opposite to the fixing portion, and an intermediate covering portion interconnecting the fixing portion and the engaging portion and covering over the external electrical connector. A lock unit is provided on a second housing part of the housing and the engaging portion of the cover member for selectively anchoring the engaging portion of the cover member to the second housing part of the housing.
    Type: Application
    Filed: April 27, 2006
    Publication date: August 23, 2007
    Inventor: Chia-Jen Wang
  • Patent number: D568314
    Type: Grant
    Filed: May 11, 2007
    Date of Patent: May 6, 2008
    Assignee: Datastor Technology Co., Ltd.
    Inventor: Chia-Jen Wang
  • Patent number: D581156
    Type: Grant
    Filed: January 3, 2008
    Date of Patent: November 25, 2008
    Assignee: Datastore Technology Corp.
    Inventor: Chia-Jen Wang
  • Patent number: D586808
    Type: Grant
    Filed: December 11, 2007
    Date of Patent: February 17, 2009
    Assignee: Datastore Technology Corp.
    Inventor: Chia-Jen Wang
  • Patent number: D587267
    Type: Grant
    Filed: January 31, 2008
    Date of Patent: February 24, 2009
    Assignee: Datastore Technology Corp.
    Inventor: Chia-Jen Wang
  • Patent number: D590392
    Type: Grant
    Filed: December 11, 2007
    Date of Patent: April 14, 2009
    Assignee: Datastore Technology Corp.
    Inventor: Chia-Jen Wang
  • Patent number: D592660
    Type: Grant
    Filed: May 23, 2008
    Date of Patent: May 19, 2009
    Assignee: Datastore Technology Corp.
    Inventor: Chia-Jen Wang
  • Patent number: D597824
    Type: Grant
    Filed: February 3, 2009
    Date of Patent: August 11, 2009
    Assignee: Datastore Technology Corp.
    Inventor: Chia-Jen Wang
  • Patent number: D602492
    Type: Grant
    Filed: August 20, 2008
    Date of Patent: October 20, 2009
    Assignee: Datastore Technology Corp.
    Inventor: Chia-Jen Wang
  • Patent number: D618237
    Type: Grant
    Filed: May 12, 2009
    Date of Patent: June 22, 2010
    Assignee: Datastore Technology Corp.
    Inventor: Chia-Jen Wang
  • Patent number: D628571
    Type: Grant
    Filed: January 28, 2010
    Date of Patent: December 7, 2010
    Assignee: Datastore Technology Corp.
    Inventor: Chia-Jen Wang
  • Patent number: D628572
    Type: Grant
    Filed: February 2, 2010
    Date of Patent: December 7, 2010
    Assignee: Datastore Technology Corp.
    Inventor: Chia-Jen Wang
  • Patent number: D628573
    Type: Grant
    Filed: May 4, 2010
    Date of Patent: December 7, 2010
    Assignee: Datastore Technology Corp.
    Inventor: Chia-Jen Wang
  • Patent number: D691984
    Type: Grant
    Filed: October 1, 2012
    Date of Patent: October 22, 2013
    Assignee: Datastore Technology Corp.
    Inventor: Chia-Jen Wang