Patents by Inventor Chia-Jung HSIEH

Chia-Jung HSIEH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Isolation Regions For Isolating Transistors and the Methods Forming the Same
    Publication number: 20240120236
    Abstract: A method includes etching a gate stack in a wafer to form a trench, depositing a silicon nitride liner extending into the trench, and depositing a silicon oxide layer. The process of depositing the silicon oxide layer includes performing a treatment process on the wafer using a process gas including nitrogen and hydrogen, and performing a soaking process on the wafer using a silicon precursor.
    Type: Application
    Filed: April 25, 2023
    Publication date: April 11, 2024
    Inventors: Tai-Jung Kuo, Po-Cheng Shih, Wan Chen Hsieh, Zhen-Cheng Wu, Chia-Hui Lin, Tze-Liang Lee
  • Testing device
    Patent number: 10352965
    Abstract: A testing device includes a circuit board, a carrier, a probe pin, a main body, a shaft, a pressing portion and a resilient spiral spring. The carrier is used to hold a device under test (DUT). The probe pin is electrically connected to the circuit board and the DUT. The shaft is movably connected to the main body with a screwing rotation method. The pressing portion is connected to one end surface of the shaft. The resilient spiral spring is retractably coiled on the shaft, and one end of the resilient spiral spring being far away from the shaft extends in a transverse direction intersecting an axial direction of the shaft.
    Type: Grant
    Filed: June 11, 2017
    Date of Patent: July 16, 2019
    Assignees: GLOBAL UNICHIP CORPORATION, TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yu-Ting Shih, Chia-Jung Hsieh, Chia-Jen Kao
  • TESTING DEVICE
    Publication number: 20180196085
    Abstract: A testing device includes a circuit board, a carrier, a probe pin, a main body, a shaft, a pressing portion and a resilient spiral spring. The carrier is used to hold a device under test (DUT). The probe pin is electrically connected to the circuit board and the DUT. The shaft is movably connected to the main body with a screwing rotation method. The pressing portion is connected to one end surface of the shaft. The resilient spiral spring is retractably coiled on the shaft, and one end of the resilient spiral spring being far away from the shaft extends in a transverse direction intersecting an axial direction of the shaft.
    Type: Application
    Filed: June 11, 2017
    Publication date: July 12, 2018
    Inventors: Yu-Ting SHIH, Chia-Jung HSIEH, Chia-Jen KAO