Patents by Inventor Chia Kung

Chia Kung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of protecting a bond pad structure, of a color image sensor cell, during a color filter fabrication process
    Patent number: 6344369
    Abstract: A process for forming a color image sensor cell, in which a bonding pad structure is protected from exposure to alkaline developer solution, used for definition of color filter elements, and also used to open a contact hole to the bonding pad structure, has been developed. The process features the use of a passivation layer, comprised of an overlying silicon nitride layer, and an underlying silicon oxide layer, located on the top surface of the bonding pad structure. The passivation layer protects the underlying bond pad structure from alkaline developer solutions used to define overlying color filter elements, of the color image sensor cell. After definition of the color filter elements the contact hole opening to the bond pad is finalized using a dry etching procedure, applied to the passivation layer.
    Type: Grant
    Filed: July 3, 2000
    Date of Patent: February 5, 2002
    Assignee: Taiwan Semiconductor Manufacturing Company
    Inventors: Chia-Mei Huang, Chao-Yi Lan, Hsiao-Ping Chang, Chia-Kung Chang