Abstract: A semiconductor structure is provided, and the semiconductor structure includes a substrate, and an active area is defined thereon, a gate structure spanning the active area, wherein the overlapping range of the gate structure and the active area is defined as an overlapping region, and the overlapping region includes four corners, and at least one salicide block covering the four corners of the overlapping region.

Abstract: A semiconductor device includes a substrate, a first isolation structure, a second isolation structure and a dummy pattern. The substrate includes a first part surrounding a second part at a top view. The first isolation structure is disposed between the first part and the second part, to isolate the first part from the second part. The second isolation structure is disposed at at least one corner of the first part. The dummy pattern is disposed on the second isolation structure. The present invention also provides a method of forming said semiconductor device.

Abstract: The present disclosure describes a semiconductor device that includes a first die bonded to a second die with interconnect structures in the first die. The first die includes a photodiode having first and second electrodes on a first side of a first dielectric layer, and first, second, and third interconnect structures in the first dielectric layer. The first and second interconnect structures are connected to the first and second electrodes, respectively. The second electrode has a polarity opposite to the first electrode. The second and third interconnect structures extend to a second side opposite to the first side of the first dielectric layer. The second die includes a second dielectric layer and a fourth interconnect structure in the second dielectric layer. The second dielectric layer is bonded to the second side of the first dielectric layer. The fourth interconnect structure connects the second and third interconnect structures.

Abstract: Various embodiments of the present disclosure are directed towards a method for forming a semiconductor device, the method including forming a plurality of photodetectors in a substrate. A device isolation structure is formed within the substrate. The device isolation structure laterally wraps around the plurality of photodetectors. An outer isolation structure is formed within the substrate. The device isolation structure is spaced between sidewalls of the outer isolation structure. The device isolation structure and the outer isolation structure comprise a dielectric material.

Abstract: Various embodiments of the present disclosure are directed towards an image sensor, and a method for forming the image sensor, in which an inter-pixel trench isolation structure is defined by a low-transmission layer. In some embodiments, the image sensor comprises an array of pixels and the inter-pixel trench isolation structure. The array of pixels is on a substrate, and the pixels of the array comprise individual photodetectors in the substrate. The inter-pixel trench isolation structure is in the substrate. Further, the inter-pixel trench isolation structure extends along boundaries of the pixels, and individually surrounds the photodetectors, to separate the photodetectors from each other. The inter-pixel trench isolation structure is defined by a low-transmission layer with low transmission for incident radiation, such that the inter-pixel trench isolation structure has low transmission for incident radiation.

Abstract: Various embodiments of the present disclosure are directed towards a semiconductor structure including a crack-stop structure disposed within a semiconductor substrate. The semiconductor substrate has a back-side surface and a front-side surface opposite the back-side surface. Photodetectors are disposed within the semiconductor substrate and are laterally spaced within a device region. An interconnect structure is disposed along the front-side surface. The interconnect structure includes a seal ring structure. A crack-stop structure is disposed within the semiconductor substrate and overlies the seal ring structure. The crack-stop structure continuously extends around the device region.

Abstract: A display driver circuit, configured to drive a display panel, includes a time recording circuit, a storage circuit, and an output control circuit. The time recording circuit calculates a first time interval between a first vertical synchronous pulse and a second vertical synchronous pulse subsequent to the first vertical synchronous pulse. The storage circuit stores a display data corresponding to the first vertical synchronous pulse when the first vertical synchronous pulse is received by the display driver circuit. The output control circuit is coupled with the time recording circuit and the storage circuit. When the display driver circuit receives the second vertical synchronous pulse, the output control circuit outputs data pieces, generated by dividing the display data, to the display panel. The data pieces are outputted at second time intervals, and each of the second time intervals is positively correlated with the first time interval.

Abstract: An exhaust device for a grease gun includes: a grease output valve, a normally closed unit, an exhaust valve and an adjusting member. The integral design of the exhaust valve and the adjusting member provided on the grease output valve enables the adjusting member to be adjusted to the exhaust position during the exhaust operation, so that the blocking portion of the adjusting member does not block the exhaust hole from the exhaust passage but allows the exhaust hole to communicate with the exhaust passage. At this time, the air in the grease output passage of the grease output valve can be exhausted through the exhaust passage and the exhaust hole, so that the grease gun can smoothly pump out grease.

Abstract: A receiving device is provided. The receiving device is adapted to receive a plurality of objects, wherein each object includes an RFID. The receiving device includes a device housing, a plurality of spacing shelves and a plurality of reading antenna modules. The spacing shelves are disposed in the device housing, wherein the spacing shelves define a plurality of receiving spaces in the device housing, and at least some of the receiving spaces overlap each other. The reading antenna modules are respectively disposed in the receiving spaces, and are adapted to read the RFIDs of the objects. The device housing includes an inner wall and an opening. The inner wall includes a first wall, a second wall and a third wall. The first wall faces the third wall. The second wall faces the opening. The reading antenna modules are disposed on the inner wall.

Abstract: An image device and an image processing integrated circuit (IC) of the image device are provided. The image device includes a camera module, a display panel, a central processing IC, and an image processing IC. Based on a control of the central processing IC, the image processing IC decides whether to pre-process an output of the camera module and provide a pre-processed result to the central processing IC, or provide the output of the camera module directly to the central processing IC. Based on the control of the central processing IC, the image processing IC decides whether to post-process an output of the central processing IC and provide a post-processed result to the display panel, or provide the output of the central processing IC directly to the display panel.

Abstract: A semiconductor device includes a substrate, a first isolation structure, a second isolation structure and a dummy pattern. The substrate includes a first part surrounding a second part at a top view. The first isolation structure is disposed between the first part and the second part, to isolate the first part from the second part. The second isolation structure is disposed at at least one corner of the first part. The dummy pattern is disposed on the second isolation structure. The present invention also provides a method of forming said semiconductor device.

Abstract: The present disclosure relates to a semiconductor device including a semiconductor substrate. A grid structure extends from a first side of the semiconductor substrate to within the semiconductor substrate. An image sensing element is disposed within the semiconductor substrate and is laterally surrounded by the grid structure. A plurality of protrusions are arranged along the first side of the semiconductor substrate. The plurality of protrusions are disposed over the image sensing element and are laterally surrounded by the grid structure. The plurality of protrusions are substantially identical to one another and have a characteristic dimension. An inner surface of the grid structure facing the image sensing element is spaced apart from a point of one of the plurality of protrusions by a predetermined reflective length that is based on the characteristic dimension of the plurality of protrusions.

Abstract: An image device and an image processing integrated circuit (IC) of the image device are provided. The image device includes a camera module, a display panel, a central processing IC, and an image processing IC. Based on a control of the central processing IC, the image processing IC decides whether to pre-process an output of the camera module and provide a pre-processed result to the central processing IC, or provide the output of the camera module directly to the central processing IC. Based on the control of the central processing IC, the image processing IC decides whether to post-process an output of the central processing IC and provide a post-processed result to the display panel, or provide the output of the central processing IC directly to the display panel.

Abstract: A semiconductor device includes a substrate, a first isolation structure, a second isolation structure and a dummy pattern. The substrate includes a first part surrounding a second part at a top view. The first isolation structure is disposed between the first part and the second part, to isolate the first part from the second part. The second isolation structure is disposed at at least one corner of the first part. The dummy pattern is disposed on the second isolation structure. The present invention also provides a method of forming said semiconductor device.

Abstract: A display driver circuit, configured to drive a display panel, includes a time recording circuit, a storage circuit, and an output control circuit. The time recording circuit calculates a first time interval between a first vertical synchronous pulse and a second vertical synchronous pulse subsequent to the first vertical synchronous pulse. The storage circuit stores a display data corresponding to the first vertical synchronous pulse when the first vertical synchronous pulse is received by the display driver circuit. The output control circuit is coupled with the time recording circuit and the storage circuit. When the display driver circuit receives the second vertical synchronous pulse, the output control circuit outputs data pieces, generated by dividing the display data, to the display panel. The data pieces are outputted at second time intervals, and each of the second time intervals is positively correlated with the first time interval.

Abstract: A grease gun with an adjustable operating angle includes: a grease barrel having a first annular assembling portion and a first annular pivot portion; a gun body having a second annular assembling portion facing the first annular assembling portion and a second annular pivot portion to be pivotally disposed on the first annular pivot portion; a positioning ring fixed to the second annular assembling portion and having annularly arranged positioning cavities and facing the first annular assembling portion; and a positioning unit having a positioning member movable between a locked position and a release position, and the positioning member having a positioning portion to be inserted into or disengaged from the positioning cavities. The grease barrel and the gun body can be rotated and fixed relative to each other after rotation to adjust the angle between the two, which consequently reduces the space limitation on the grease feeding operation.

Abstract: The present disclosure relates to a semiconductor device having a lateral resonance structure to coherently reflect light toward the image sensor. The semiconductor device includes an image sensing element arranged within a substrate. A radiation absorption region is arranged within the substrate and above the image sensor, and contains an array of protrusions having a characteristic dimension and an outer border. A resonant structure containing a plurality of deep trench isolation (DTI) structures is disposed on opposing sides of the image sensing element. The (DTI) structures surround the outer border of the array of protrusions. An inner surface of the DTI structure is laterally spaced apart from the outer border of the array of protrusions by a reflective length based on the characteristic dimension of the array of protrusions, thus affecting coherent reflection of light back toward the image sensor.

Abstract: A semiconductor device includes a substrate, a first isolation structure, a second isolation structure and a dummy pattern. The substrate includes a first part surrounding a second part at a top view. The first isolation structure is disposed between the first part and the second part, to isolate the first part from the second part. The second isolation structure is disposed at at least one corner of the first part. The dummy pattern is disposed on the second isolation structure. The present invention also provides a method of forming said semiconductor device.

Abstract: A grease gun with an adjustable operating angle includes: a grease barrel having a first annular assembling portion and a first annular pivot portion; a gun body having a second annular assembling portion facing the first annular assembling portion and a second annular pivot portion to be pivotally disposed on the first annular pivot portion; a positioning ring fixed to the second annular assembling portion and having annularly arranged positioning cavities and facing the first annular assembling portion; and a positioning unit having a positioning member movable between a locked position and a release position, and the positioning member having a positioning portion to be inserted into or disengaged from the positioning cavities. The grease barrel and the gun body can be rotated and fixed relative to each other after rotation to adjust the angle between the two, which consequently reduces the space limitation on the grease feeding operation.

Abstract: Various embodiments of the present disclosure are directed towards a semiconductor structure including a crack-stop structure disposed within a semiconductor substrate. The semiconductor substrate has a back-side surface and a front-side surface opposite the back-side surface. Photodetectors are disposed within the semiconductor substrate and are laterally spaced within a device region. An interconnect structure is disposed along the front-side surface. The interconnect structure includes a seal ring structure. A crack-stop structure is disposed within the semiconductor substrate and overlies the seal ring structure. The crack-stop structure continuously extends around the device region.