Patents by Inventor Chia-Li Wu

Chia-Li Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240088307
    Abstract: A semiconductor package is provided. The semiconductor package includes a heat dissipation substrate including a first conductive through-via embedded therein; a sensor die disposed on the heat dissipation substrate; an insulating encapsulant laterally encapsulating the sensor die; a second conductive through-via penetrating through the insulating encapsulant; and a first redistribution structure and a second redistribution structure disposed on opposite sides of the heat dissipation substrate. The second conductive through-via is in contact with the first conductive through-via. The sensor die is located between the second redistribution structure and the heat dissipation substrate. The second redistribution structure has a window allowing a sensing region of the sensor die receiving light. The first redistribution structure is electrically connected to the sensor die through the first conductive through-via, the second conductive through-via and the second redistribution structure.
    Type: Application
    Filed: November 20, 2023
    Publication date: March 14, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Hsuan Tai, Hao-Yi Tsai, Yu-Chih Huang, Chih-Hao Chang, Chia-Hung Liu, Ban-Li Wu, Ying-Cheng Tseng, Po-Chun Lin
  • Patent number: 11929318
    Abstract: A package structure includes a thermal dissipation structure, a first encapsulant, a die, a through integrated fan-out via (TIV), a second encapsulant, and a redistribution layer (RDL) structure. The thermal dissipation structure includes a substrate and a first conductive pad disposed over the substrate. The first encapsulant laterally encapsulates the thermal dissipation structure. The die is disposed on the thermal dissipation structure. The TIV lands on the first conductive pad of the thermal dissipation structure and is laterally aside the die. The second encapsulant laterally encapsulates the die and the TIV. The RDL structure is disposed on the die and the second encapsulant.
    Type: Grant
    Filed: May 10, 2021
    Date of Patent: March 12, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Hsuan Tai, Hao-Yi Tsai, Tsung-Hsien Chiang, Yu-Chih Huang, Chia-Hung Liu, Ban-Li Wu, Ying-Cheng Tseng, Po-Chun Lin
  • Patent number: 9458421
    Abstract: The invention discloses a culture method for Antrodia cinnamomea to elevate the amounts and types of the bioactive components in Antrodia cinnamomea through controlling the wavelength and intensity of the light. Furthermore, the modification of the environmental factors such as water content, composition and relative amount of the culture medium, and the culture temperature are capable of increasing the amounts and types of the bioactive components in Antrodia cinnamomea.
    Type: Grant
    Filed: January 6, 2014
    Date of Patent: October 4, 2016
    Assignees: TUNGHAI UNIVERSITY, GREENYN BIOTECHNOLOGY CO., LTD.
    Inventors: Fan-Chiang Yang, Chia-Li Wu, Ya-Chen Chi
  • Publication number: 20150051272
    Abstract: The invention discloses the uses of hydroxyl polymethoxylflavones and derivative thereof that are relative to inhibit adipogenesis and lower lipid accumulation, wherein the hydroxyl polymethoxylflavones is obtained from the peels of Citrus genus plants. Therefore, the hydroxyl polymethoxylflavones that of a therapeutically effective amount not only can be a medical compound for treatment obesity or fatty liver, but also can be a food element.
    Type: Application
    Filed: January 28, 2014
    Publication date: February 19, 2015
    Applicants: Greenyn Biotechnology Co., Ltd
    Inventors: Min-Hsiung PAN, Chia-Li WU
  • Publication number: 20150052639
    Abstract: The invention discloses a culture method for Antrodia cinnamomea to elevate the amounts and types of the bioactive components in Antrodia cinnamomea through controlling the wavelength and intensity of the light. Furthermore, the modification of the environmental factors such as water content, composition and relative amount of the culture medium, and the culture temperature are capable of increasing the amounts and types of the bioactive components in Antrodia cinnamomea.
    Type: Application
    Filed: January 6, 2014
    Publication date: February 19, 2015
    Applicants: Greenyn Biotechnology Co., Ltd., Tunghai University
    Inventors: Fan-Chiang YANG, Chia-Li WU, Ya-Chen CHI
  • Patent number: 8946288
    Abstract: The invention discloses the uses of hydroxyl polymethoxylflavones and derivative thereof that are relative to inhibit adipogenesis and lower lipid accumulation, wherein the hydroxyl polymethoxylflavones is obtained from the peels of Citrus genus plants. Therefore, the hydroxyl polymethoxylflavones that of a therapeutically effective amount not only can be a medical compound for treatment obesity or fatty liver, but also can be a food element.
    Type: Grant
    Filed: January 28, 2014
    Date of Patent: February 3, 2015
    Assignees: Greenyn Biotechnology Co., Ltd.
    Inventors: Min-Hsiung Pan, Chia-Li Wu