Abstract: A stacked package structure and a manufacturing method thereof are provided. The stacked package structure includes an upper redistribution layer, a first chip, and an upper molding layer. The first chip is disposed on the upper redistribution layer and is electrically connected to the upper redistribution layer. The upper molding layer is disposed on the first chip and the upper redistribution layer, and is configured to package the first chip. The upper molding layer includes a recess, the recess is recessed relative to a surface of the upper molding layer away from the upper redistribution layer, and the recess is circumferentially formed around a periphery of the upper molding layer.

Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.

Abstract: A method for predicting clinical severity of a neurological disorder includes steps of: a) identifying, according to a magnetic resonance imaging (MRI) image of a brain, brain image regions each of which contains a respective portion of diffusion index values of a diffusion index, which results from image processing performed on the MRI image; b) for one of the brain image regions, calculating a characteristic parameter based on the respective portion of the diffusion index values; and c) calculating a severity score that represents the clinical severity of the neurological disorder of the brain based on the characteristic parameter of the one of the brain image regions via a prediction model associated with the neurological disorder.

Abstract: Various embodiments of the present application are directed towards a control gate layout to improve an etch process window for word lines. In some embodiments, an integrated chip comprises a memory array, an erase gate, a word line, and a control gate. The memory array comprises a plurality of cells in a plurality of rows and a plurality of columns. The erase gate and the word line are elongated in parallel along a row of the memory array. The control gate is elongated along the row and is between and borders the erase gate and the word line. Further, the control gate has a pad region protruding towards the erase gate and the word line. Because the pad region protrudes towards the erase gate and the word line, a width of the pad region is spread between word-line and erase-gate sides of the control gate.

Abstract: A respiratory function testing system includes an air transforming device, a sound reception device and an operation device. The air transforming device is configured to collect exhaled and/or inhaled air for a predetermined period and generate a wide frequency range sound signal according to the collected respired air. The wide frequency range sound signal at least contains an ultrasonic signal. The sound reception device is configured to receive and record the wide frequency range sound signal as an audio file. The operation device is in communication with the sound reception device and is configured to receive and compute the audio file to generate a respiratory function parameter. Besides, the recorded wide frequency range sound signal may be converted into a spectrogram for further applications, and the computation of the audio file can be replaced by analyzing the spectrogram. A respiratory function testing method corresponding to the respiratory function testing system is also provided.

Abstract: A display panel includes a first substrate, pixel structures, a first common pad, a second substrate, a second common electrode, a display medium and a conductive particle. The pixel structures are disposed on an active area of the first substrate. The first common pad is disposed on a peripheral area of the first substrate, and is electrically connected to first common electrodes of the pixel structures. The second common electrode is disposed on the second substrate. The conductive particle is disposed on the first common pad, and is electrically connected to the first common pad and the second common electrode. The conductive particle includes a core and a conductive film disposed on a surface of the core, where the conductive film has a main portion and raised portions, and a film thickness of each of the raised portions is greater than a film thickness of the main portion.

Abstract: Devices and methods for forming a chip package structure including a package substrate, a first adhesive layer attached to a top surface of the package substrate, and a beveled stiffener structure attached to the package substrate. The beveled stiffener structure may include a bottom portion including a tapered top surface, in which a bottom surface of the bottom portion is in contact with the first adhesive layer, a second adhesive layer attached to the tapered top surface, and a top portion including a tapered bottom surface, in which the tapered bottom surface is in contact with the second adhesive layer. The tapered top surface and the tapered bottom surface have a taper angle between 5 degrees and 60 degrees with respect to a top surface of the package substrate.

Abstract: A method of detecting the relations between the pins of a circuit and a computer program product thereof are provided. The method includes: retrieving a circuit description file describing a circuit; retrieving at least one data pin and at least one clock pin of the circuit; converting the circuit to a cell level; and tracing the circuit in the cell level to identify multiple flip-flops coupled to the clock pin; tracing the circuit in the cell level to identify a target flip-flop coupled to the data pin; and determining whether the data pin is related to the clock pin according to the data signal and the clock signal of the target flip-flop.

Abstract: A method of detecting the relations between the pins of a circuit and a computer program product thereof are provided. The method includes: retrieving a circuit description file describing a circuit; retrieving at least one data pin and at least one clock pin of the circuit; converting the circuit to a cell level; and tracing the circuit in the cell level to identify multiple flip-flops coupled to the clock pin; tracing the circuit in the cell level to identify a target flip-flop coupled to the data pin; and determining whether the data pin is related to the clock pin according to the data signal and the clock signal of the target flip-flop.

Abstract: An image synthesizing method and system include capturing a first image using a first aperture, which corresponds to a first depth of field (DOF); capturing a second image using a second aperture, which corresponds to a second DOF and is different from the first aperture; and receiving the first image and the second image, on which an image processing is performed to obtain a synthesized image, which has a DOF being between the first DOF and the second DOF.

Abstract: A manufacturing device includes a feeder, a first pressing roller, a second pressing roller, a third pressing roller, a transmission assembly, and a driving assembly. The first pressing roller and the second pressing roller cooperatively press a hot melt adhesive from the feeder to obtain a preprocessed light guide plate. A temperature of the second pressing roller is lower than a temperature of the hot melt adhesive. The third pressing roller separates the preprocessed light guide plate from the second pressing roller to obtain a light guide plate. The transmission assembly connects the second pressing roller and the third pressing roller. The driving element is connected to the transmission assembly, and drives the transmission assembly to rotate the third pressing roller around the second pressing roller, and thus adjusting a contact area and a contact time between the light guide plate and the second pressing roller.

Abstract: A light-emitting device includes an insulating carrier; a light-emitting array formed on the insulating carrier including a first light-emitting circuit having a first light-emitting unit, wherein the first light-emitting circuit is a one-way circuit, a second light-emitting circuit having a second light-emitting unit, wherein the second light-emitting circuit is a one-way circuit, a first conductive layer, a second conductive layer, and a third conductive layer, wherein the first light-emitting circuit is formed between the first conductive layer and the second conductive layer and connects with them electrically, the second light-emitting circuit is formed between the second conductive layer and the third conductive layer and connects with them electrically, wherein an area of the second conductive layer is greater or equal to 1.9×103 ?m2.

Abstract: A method for manufacturing a molding core includes: providing a cylindrical roller having a circumference surface coated with a first film layer; coating a second film layer on the first film layer; coating a preprocessed molding film on the second film layer; engraving a number of molding patterns on the preprocessed molding film to obtain a molding film; separating the molding film from the roller and spreading out the molding film to be a flat plate; and manufacturing the molding core using the molding film by electroforming method.

Abstract: A method of manufacturing an optical film includes: providing a template; coating an aluminum film on one surface of the template; electrolyzing the aluminum film and generating a plurality of regular microstructures on the aluminum film; providing a substrate; transferring the microstructures of the template to the substrate to form a plurality of microstructures on the substrate; and modifying the surfaces of the microstructures of the substrate to obtain a layer containing hydrophobic functional groups on the surfaces of the microstructures of the substrate.

Abstract: A surface acoustic wave touch panel includes a flexible substrate, an acoustic wave transmitting layer, an adhering layer, a piezoelectricity layer, and an electrode layer. The acoustic wave transmitting layer is made of nano-diamond and formed on the flexible substrate. The adhering layer is formed on the acoustic wave transmitting layer. The piezoelectricity layer is formed on the acoustic wave transmitting layer in an interdigitated electrode pattern. The electrode layer is formed on the piezoelectricity layer. A method of manufacturing the surface acoustic wave touch panel is also provided.

Abstract: A manufacturing device includes a feeder, a first pressing roller, a second pressing roller, a third pressing roller, a transmission assembly, and a driving assembly. The first pressing roller and the second pressing roller cooperatively press a hot melt adhesive from the feeder to obtain a preprocessed light guide plate. A temperature of the second pressing roller is lower than a temperature of the hot melt adhesive. The third pressing roller separates the preprocessed light guide plate from the second pressing roller to obtain a light guide plate. The transmission assembly connects the second pressing roller and the third pressing roller. The driving element is connected to the transmission assembly, and drives the transmission assembly to rotate the third pressing roller around the second pressing roller, and thus adjusting a contact area and a contact time between the light guide plate and the second pressing roller.

Abstract: A glue spraying system includes a transmission device, a spurting device, a pressing device, a detection device, and a control module. The transmission device includes a front and a rear transmission wheels, a thin film is transmission from the front transmission wheel to the rear transmission wheel by the transmission device. The spurting device is positioned above the thin film, and is for spurting glue on the thin film. The pressing device is positioned at a side of the spurting device, and is for pressing the glue on a spraying area of the thin film. The detection device is configured for detecting whether or not the glue is sprayed on the blank area. The control module is connected to the transmission device and the detection device. When the first sensor detects the glue, the control module controls the transmission device to slow down a transmission speed.

Abstract: A roll-to-roll press device includes an unreeling shaft, a pressing unit, a reeling shaft, and a tension controller. The unreeling shaft unreels substrate film reeled thereon. The pressing unit presses the substrate film to print microstructures on the substrate film. The reeling shaft reels the pressed substrate film thereon. The tension controller adjusts a tension of the substrate film according to a thickness of a coil of the substrate film on the reeling shaft.

Abstract: Manufacture of a roller die configured for molding microstructures onto an optical film, includes an uncoated roller and a number of micro-structures formed on an outer surface of the roller, and a layer of diamond-like carbon film being formed on the surfaces of the micro-structures.

Abstract: A roller for producing optical films is disclosed. The roller includes a cylindrical main body and a micro-structured layer surrounding a circumferential surface of the main body. The microstructure layer includes a number of microstructures on its surface away from the main body. The microstructure layer is made from ethylene tetrafluoroethylene.