Patents by Inventor Chia-Pao Shu
Chia-Pao Shu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9365416Abstract: The present disclosure provides one embodiment of a motion sensor structure. The motion sensor structure includes a first substrate having an integrated circuit formed thereon; a second substrate bonded to the first substrate from a first surface, wherein the second substrate includes a motion sensor formed thereon; and a third substrate bonded to a second surface of the second substrate, wherein the third substrate includes a recessed region aligned with the motion sensor.Type: GrantFiled: March 29, 2012Date of Patent: June 14, 2016Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chia-Pao Shu, Wen-Chuan Tai, Chia-Ming Hung, Hsiang-Fu Chen
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Patent number: 9355896Abstract: A package system includes a first substrate; and a second substrate electrically coupled with the first substrate. The package system further includes a semiconductor material between the first substrate and the second substrate. The semiconductor material includes a pad, and at least one guard ring surrounding the pad and spaced from the pad. The package system further includes a metallic material bonded to the semiconductor material, wherein the metallic material at least partially fills at least one opening in at least one of the first substrate or the second substrate.Type: GrantFiled: July 31, 2015Date of Patent: May 31, 2016Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chia-Pao Shu, Chun-wen Cheng, Kuei-Sung Chang, Hsin-Ting Huang, Shang-Ying Tsai, Jung-Huei Peng
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Patent number: 9266714Abstract: A device includes a first substrate bonded with a second substrate structure. The second substrate structure includes an outgasing prevention structure. At least one micro-electro mechanical system (MEMS) device is disposed over the outgasing prevention structure.Type: GrantFiled: April 15, 2014Date of Patent: February 23, 2016Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chia-Pao Shu, Chia-Ming Hung, Wen-Chuan Tai, Hung-Sen Wang, Hsiang-Fu Chen, Alex Kalnitsky
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Publication number: 20150340341Abstract: A package system includes a first substrate; and a second substrate electrically coupled with the first substrate. The package system further includes a semiconductor material between the first substrate and the second substrate. The semiconductor material includes a pad, and at least one guard ring surrounding the pad and spaced from the pad. The package system further includes a metallic material bonded to the semiconductor material, wherein the metallic material at least partially fills at least one opening in at least one of the first substrate or the second substrate.Type: ApplicationFiled: July 31, 2015Publication date: November 26, 2015Inventors: Chia-Pao SHU, Chun-wen CHENG, Kuei-Sung CHANG, Hsin-Ting HUANG, Shang-Ying TSAI, Jung-Huei PENG
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Patent number: 9112001Abstract: A method of forming a package system includes providing a first substrate having a metallic pad and at least one metallic guard ring. The method further includes bonding the metallic pad of the first substrate with a semiconductor pad of a second substrate, wherein the at least one metallic guard ring is configured to at least partially interact with the semiconductor pad to form at least a first portion of an electrical bonding material between the first and second substrates.Type: GrantFiled: February 5, 2014Date of Patent: August 18, 2015Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chia-Pao Shu, Chun-wen Cheng, Kuei-Sung Chang, Hsin-Ting Huang, Shang-Ying Tsai, Jung-Huei Peng
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Patent number: 9000578Abstract: A package system includes a first substrate and a second substrate. The second substrate is electrically coupled with the first substrate. The second substrate includes at least one first opening. At least one electrical bonding material is disposed between the first substrate and the second substrate. A first portion of the at least one electrical bonding material is at least partially filled in the at least one first opening.Type: GrantFiled: October 8, 2010Date of Patent: April 7, 2015Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chia-Pao Shu, Chun-wen Cheng, Kuei-Sung Chang
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Patent number: 8921145Abstract: A micro-electro-mechanical systems (MEMS) device and method for forming a MEMS device is provided. A proof mass is suspended a distance above a surface of a substrate by a fulcrum. A pair of sensing plates are positioned on the substrate on opposing sides of the fulcrum. Metal bumps are associated with each sensing plate and positioned near a respective distal end of the proof mass. Each metal bump extends from the surface of the substrate and generally inhibits charge-induced stiction associated with the proof mass. Oxide bumps are associated with each of the pair of sensing plates and positioned between the respective sensing plate and the fulcrum. Each oxide bump extends from the first surface of the substrate a greater distance than the metal bumps and acts as a shock absorber by preventing the distal ends of the proof mass from contacting the metal bumps during shock loading.Type: GrantFiled: March 7, 2014Date of Patent: December 30, 2014Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chia-Pao Shu, Kelvin Tai, Calvin Hung, Benior Chen
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Publication number: 20140203421Abstract: A device includes a first substrate bonded with a second substrate structure. The second substrate structure includes an outgasing prevention structure. At least one micro-electro mechanical system (MEMS) device is disposed over the outgasing prevention structure.Type: ApplicationFiled: April 15, 2014Publication date: July 24, 2014Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chia-Pao SHU, Chia-Ming HUNG, Wen-Chuan TAI, Hung-Sen WANG, Hsiang-Fu CHEN, Alex KALNITSKY
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Publication number: 20140186986Abstract: A micro-electro-mechanical systems (MEMS) device and method for forming a MEMS device is provided. A proof mass is suspended a distance above a surface of a substrate by a fulcrum. A pair of sensing plates are positioned on the substrate on opposing sides of the fulcrum. Metal bumps are associated with each sensing plate and positioned near a respective distal end of the proof mass. Each metal bump extends from the surface of the substrate and generally inhibits charge-induced stiction associated with the proof mass. Oxide bumps are associated with each of the pair of sensing plates and positioned between the respective sensing plate and the fulcrum. Each oxide bump extends from the first surface of the substrate a greater distance than the metal bumps and acts as a shock absorber by preventing the distal ends of the proof mass from contacting the metal bumps during shock loading.Type: ApplicationFiled: March 7, 2014Publication date: July 3, 2014Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chia-Pao Shu, Kelvin Tai, Calvin Hung, Benior Chen
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Publication number: 20140170849Abstract: A method of forming a package system includes providing a first substrate having a metallic pad and at least one metallic guard ring. The method further includes bonding the metallic pad of the first substrate with a semiconductor pad of a second substrate, wherein the at least one metallic guard ring is configured to at least partially interact with the semiconductor pad to form at least a first portion of an electrical bonding material between the first and second substrates.Type: ApplicationFiled: February 5, 2014Publication date: June 19, 2014Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chia-Pao SHU, Chun-wen CHENG, Kuei-Sung CHANG, Hsin-Ting HUANG, Shang-Ying TSAI, Jung-Huei PENG
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Patent number: 8723280Abstract: A micro-electro-mechanical systems (MEMS) device and method for forming a MEMS device is provided. A proof mass is suspended a distance above a surface of a substrate by a fulcrum. A pair of sensing plates are positioned on the substrate on opposing sides of the fulcrum. Metal bumps are associated with each sensing plate and positioned near a respective distal end of the proof mass. Each metal bump extends from the surface of the substrate and generally inhibits charge-induced stiction associated with the proof mass. Oxide bumps are associated with each of the pair of sensing plates and positioned between the respective sensing plate and the fulcrum. Each oxide bump extends from the first surface of the substrate a greater distance than the metal bumps and acts as a shock absorber by preventing the distal ends of the proof mass from contacting the metal bumps during shock loading.Type: GrantFiled: August 1, 2012Date of Patent: May 13, 2014Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chia-Pao Shu, Wen-Chuan Tai, Chia-Ming Hung, Hsiang-Fu Chen
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Patent number: 8716852Abstract: A device includes a capping substrate bonded with a substrate structure. The substrate structure includes an integrated circuit structure. The integrated circuit structure includes a top metallic layer disposed on an outgasing prevention structure. At least one micro-electro mechanical system (MEMS) device is disposed over the top metallic layer and the outgasing prevention structure.Type: GrantFiled: February 17, 2012Date of Patent: May 6, 2014Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chia-Pao Shu, Chia-Ming Hung, Wen-Chuan Tai, Hung-Sen Wang, Hsiang-Fu Chen, Alex Kalnitsky
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Patent number: 8674495Abstract: A package system includes a first substrate. A second substrate is electrically coupled with the first substrate. At least one electrical bonding material is disposed between the first substrate and the second substrate. The at least one electrical bonding material includes a eutectic bonding material. The eutectic bonding material includes a metallic material and a semiconductor material. The metallic material is disposed adjacent to a surface of the first substrate. The metallic material includes a first pad and at least one first guard ring around the first pad.Type: GrantFiled: February 25, 2011Date of Patent: March 18, 2014Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chia-Pao Shu, Chun-Wen Cheng, Kuei-Sung Chang, Hsin-Ting Huang, Shang-Ying Tsai, Jung-Huei Peng
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Publication number: 20140035072Abstract: A micro-electro-mechanical systems (MEMS) device and method for forming a MEMS device is provided. A proof mass is suspended a distance above a surface of a substrate by a fulcrum. A pair of sensing plates are positioned on the substrate on opposing sides of the fulcrum. Metal bumps are associated with each sensing plate and positioned near a respective distal end of the proof mass. Each metal bump extends from the surface of the substrate and generally inhibits charge-induced stiction associated with the proof mass. Oxide bumps are associated with each of the pair of sensing plates and positioned between the respective sensing plate and the fulcrum. Each oxide bump extends from the first surface of the substrate a greater distance than the metal bumps and acts as a shock absorber by preventing the distal ends of the proof mass from contacting the metal bumps during shock loading.Type: ApplicationFiled: August 1, 2012Publication date: February 6, 2014Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chia-Pao Shu, Wen-Chuan Tai, Chia-Ming Hung, Hsiang-Fu Chen
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Patent number: 8633554Abstract: The present disclosure provides a micro-electro-mechanical systems (MEMS) device and a method for fabricating such a device. In an embodiment, a MEMS device includes a substrate, a dielectric layer above the substrate, an etch stop layer above the dielectric layer, and two anchor plugs above the dielectric layer, the two anchor plugs each contacting the etch stop layer or a top metal layer disposed above the dielectric layer. The device further comprises a MEMS structure layer disposed above a cavity formed between the two anchor plugs and above the etch stop layer from release of a sacrificial layer.Type: GrantFiled: February 1, 2013Date of Patent: January 21, 2014Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chia-Hua Chu, Yi Heng Tsai, Kai-Chih Liang, Chia-Pao Shu, Li-Cheng Chu, Kuei-Sung Chang, Hsueh-An Yang, Chung-Hsien Lin
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Patent number: 8629516Abstract: A method for forming a semiconductor device includes forming a substrate, forming a moveable member of bulk silicon and forming a first dimple structure on a first surface of the moveable member, where the first surface faces the substrate.Type: GrantFiled: November 21, 2012Date of Patent: January 14, 2014Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chia-Pao Shu, Chia-Hua Chu
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Publication number: 20130214400Abstract: A device includes a capping substrate bonded with a substrate structure. The substrate structure includes an integrated circuit structure. The integrated circuit structure includes a top metallic layer disposed on an outgasing prevention structure. At least one micro-electro mechanical system (MEMS) device is disposed over the top metallic layer and the outgasing prevention structure.Type: ApplicationFiled: February 17, 2012Publication date: August 22, 2013Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chia-Pao SHU, Chia-Ming HUNG, Wen-Chuan TAI, Hung-Sen WANG, Hsiang-Fu CHEN, Alex KALNITSKY
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Publication number: 20130043510Abstract: The present disclosure provides one embodiment of a motion sensor structure. The motion sensor structure includes a first substrate having an integrated circuit formed thereon; a second substrate bonded to the first substrate from a first surface, wherein the second substrate includes a motion sensor formed thereon; and a third substrate bonded to a second surface of the second substrate, wherein the third substrate includes a recessed region aligned with the motion sensor.Type: ApplicationFiled: March 29, 2012Publication date: February 21, 2013Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chia-Pao Shu, Wen-Chuan Tai, Chia-Ming Hung, Hsiang-Fu Chen
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Patent number: 8368152Abstract: The present disclosure provides a micro-electro-mechanical systems (MEMS) device and a method for fabricating such a device. In an embodiment, a MEMS device includes a substrate, a dielectric layer above the substrate, an etch stop layer above the dielectric layer, and two anchor plugs above the dielectric layer, the two anchor plugs each contacting the etch stop layer or a top metal layer disposed above the dielectric layer. The device further comprises a MEMS structure layer disposed above a cavity formed between the two anchor plugs and above the etch stop layer from release of a sacrificial layer.Type: GrantFiled: April 18, 2011Date of Patent: February 5, 2013Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chia-Hua Chu, Yi Heng Tsai, Kai-Chih Liang, Chia-Pao Shu, Li-Cheng Chu, Kuei-Sung Chang, Hsueh-An Yang, Chung-Hsien Lin
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Patent number: 8338207Abstract: A method for forming a semiconductor device includes forming a substrate, forming a moveable member of bulk silicon and forming a first dimple structure on a first surface of the moveable member, where the first surface faces the substrate.Type: GrantFiled: January 13, 2011Date of Patent: December 25, 2012Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chia-Pao Shu, Chia-Hua Chu