Patents by Inventor Chia-Piao Lee

Chia-Piao Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Prevention of trench photoresist scum
    Patent number: 7820553
    Abstract: Methods of preventing photoresist scum formation for etch processes for patterning material layers of semiconductor device material layers are disclosed. A treatment of N2 and O2 is used to prevent the formation of photoresist scum. The treatment may be performed in-situ, and may be performed during the etch process, after the etch process, or both. The treatment is particularly beneficial when implemented during the patterning of low dielectric constant material layers, and when used for the formation of isolated via patterns.
    Type: Grant
    Filed: July 20, 2005
    Date of Patent: October 26, 2010
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yin-Shen Chu, Chia-Piao Lee
  • Prevention of trench photoresist scum
    Publication number: 20070020921
    Abstract: Methods of preventing photoresist scum formation for etch processes for patterning material layers of semiconductor device material layers are disclosed. A treatment of N2 and O2 is used to prevent the formation of photoresist scum. The treatment may be performed in-situ, and may be performed during the etch process, after the etch process, or both. The treatment is particularly beneficial when implemented during the patterning of low dielectric constant material layers, and when used for the formation of isolated via patterns.
    Type: Application
    Filed: July 20, 2005
    Publication date: January 25, 2007
    Inventors: Yin-Shen Chu, Chia-Piao Lee