Abstract: Semiconductor devices and methods of manufacture which utilize lids in order to constrain thermal expansion during annealing are presented. In some embodiments lids are placed and attached on encapsulant and, in some embodiments, over first semiconductor dies. As such, when heat is applied, and the encapsulant attempts to expand, the lid will work to constrain the expansion, reducing the amount of stress that would otherwise accumulate within the encapsulant.

Abstract: A package structure is provided. The package structure includes a first conductive pad in a first insulating layer, a conductive via in a second insulating layer directly under the first conductive pad, and a first under bump metallurgy structure directly under the first conductive via. In a first horizontal direction, the conductive via is narrower than the first under bump metallurgy structure, and the first under bump metallurgy structure is narrower than the first conductive pad.

Abstract: A relay device comprises a base, a pin, and an outer cap. A gap is arranged at a peripheral of the base. The pin has a convex plate and assembled to the gap of the base and one end thereof is protruded from the gap. The convex plate is covered/shielded the gap. The outer cap includes a receiving groove. A notch of the receiving groove is covered the base and the pin. A paste is applied among the peripheral of the base, the convex plate of the pin, and the notch of the receiving groove for fastening. The gap arranged at the peripheral of the base is providing the pin for assembling without directional limitation and advantageous to once assembly of the base and the pin in an automatic machine so as to simplify the manufacturing process of the relay device.