Patents by Inventor Chia-Sheng Wu

Chia-Sheng Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240162833
    Abstract: A power supply unit supplies power to a load, and the power supply unit includes a power factor corrector, a DC conversion module, and an isolated conversion module. The power factor corrector is plugged into a first main circuit board and converts an AC power into a DC power. The DC conversion module is plugged into the first main circuit board and converts the DC power into a main power. The isolated conversion module includes a bus capacitor, the bus capacitor is coupled to the DC conversion module through a first power copper bar, and coupled to the power factor corrector through a second power copper bar. The first power copper bar and the second power copper bar are arranged on a side opposite to the first main circuit board, and are arranged in parallel with the first main circuit board.
    Type: Application
    Filed: November 13, 2023
    Publication date: May 16, 2024
    Inventors: Yi-Sheng CHANG, Cheng-Chan HSU, Chia-Wei CHU, Chun-Yu YANG, Deng-Cyun HUANG, Yi-Hsun CHIU, Chien-An LAI, Yu-Tai WANG, Chi-Shou HO, Zhi-Yuan WU, Ko-Wen LU
  • Publication number: 20240139990
    Abstract: An internal rotor type nail drive device of electric nail gun, comprising a nailing rod and an internal rotor type rotary actuator that can output a specific rotation angle and can drive the nailing rod to move downward for nailing. Specifically, the rotary actuator comprises a stator and a rotor arranged inside the stator, even groups of electromagnetic mutual action components are configured in pairs between the stator and the rotor, to generate a tangential force to drive the rotor to rotate for a specific rotation angle, and to drive the nailing rod to move for a nailing stroke. The nailing stroke can be determined by a specific rotation angle. Thus, through the above configuration of the rotary actuator, the structure of the electric nail gun can be simplified, and the kinetic energy for nailing can be increased.
    Type: Application
    Filed: August 22, 2023
    Publication date: May 2, 2024
    Inventors: I-TSUNG WU, CHIA-SHENG LIANG, YU-CHE LIN, WEN-CHIN CHEN
  • Patent number: 11964299
    Abstract: A method for manufacturing a golf ball having a multi-layered pattern is provided. Firstly, a semi-finished product of the golf ball is provided and includes a ball-shaped body and a base layer covering an outer surface of the ball-shaped body. Then, the semi-finished product of the golf ball is rotated at a predetermined rotation speed, and a color paint is applied to the semi-finished product of the golf ball by spraying from each of an upper position, a middle position, and a lower position. The multi-layered pattern includes an upper-layer pattern area, a mid-layer pattern area, and a lower-layer pattern area that are different in color from each other.
    Type: Grant
    Filed: October 26, 2021
    Date of Patent: April 23, 2024
    Assignee: FOREMOST GOLF MFG. LTD.
    Inventors: Chia-Sheng Huang, Chi-Ling Lin, Chia-Cheng Wu, Ching-Hsiang Liu
  • Publication number: 20240125329
    Abstract: A fan control method, a processing device, and a fan control system are provided. The fan control method includes: obtaining at least one temperature-fan speed table and at least one current-fan speed table corresponding to each of at least one fan device; obtaining an estimated temperature value corresponding to a predetermined area according to a sensing result of at least one temperature sensor disposed in the predetermined area; obtaining rotational speed information of a target rotational speed of the at least one fan device according to the estimated temperature value and the at least one temperature-fan speed table; and providing the rotational speed information to a controller configured to control a fan speed in the at least one fan device.
    Type: Application
    Filed: January 17, 2023
    Publication date: April 18, 2024
    Applicant: Wiwynn Corporation
    Inventors: Chia-Chien Wu, Ya-Hsuan Tseng, Kai-Sheng Chen
  • Patent number: 11952467
    Abstract: A method for processing a polyalkylene benzenedicarboxylate material includes subjecting a polyalkylene benzenedicarboxylate material to an immersion treatment with an immersion liquid including ethylene glycol, so as to obtain an immersed polyester material, and subjecting the immersed polyester material to a disintegration treatment to obtain a disintegrated polyester material. The immersed polyester material has crystallinity higher than that of the polyalkylene benzenedicarboxylate material.
    Type: Grant
    Filed: February 8, 2022
    Date of Patent: April 9, 2024
    Assignee: National Taiwan University
    Inventors: Chia-Wen Wu, Wei-Sheng Liao, Yu-Wen Chiao
  • Publication number: 20240104746
    Abstract: The present invention discloses a vessel tracking and monitoring system and operating method thereof. Specifically, the vessel tracking and monitoring system comprises at least one camera, a processing module and a storage module. On the other hand, the processing module may keep the water object which is detected and recognized by the at least one camera in the center area of a monitoring screen. Therefore, the present invention may track and recognize the type of the at least one water object, assisting areas such as ports in managing and tracking water object arrivals and departures under various environmental conditions.
    Type: Application
    Filed: December 15, 2022
    Publication date: March 28, 2024
    Inventors: CHIA-YU WU, YAN-SHENG SONG, YU-TING PENG, CHIEN-HUNG LIU
  • Patent number: 11942563
    Abstract: A manufacturing method of a chip package includes patterning a wafer to form a scribe trench, in which a light-transmissive function layer below the wafer is in the scribe trench, the light-transmissive function layer is between the wafer and a carrier, and a first included angle is formed between an outer wall surface and a surface of the wafer facing the light-transmissive function layer; cutting the light-transmissive function layer and the carrier along the scribe trench to form a chip package that includes a chip, the light-transmissive function layer, and the carrier; and patterning the chip to form an opening, in which the light-transmissive function layer is in the opening, a second included angle is formed between an inner wall surface of the chip and a surface of the chip facing the light-transmissive function layer, and is different from the first included angle.
    Type: Grant
    Filed: June 1, 2023
    Date of Patent: March 26, 2024
    Assignee: XINTEC INC.
    Inventors: Chia-Sheng Lin, Hui-Hsien Wu, Jian-Hong Chen, Tsang-Yu Liu, Kuei-Wei Chen
  • Patent number: 10721841
    Abstract: A heat dissipator structure includes a heat-dissipation base and a conductive metal block. The heat-dissipation base includes a substrate and a plurality of heat-dissipating fins disposed on the substrate. A receiving portion and a limit sliding block are disposed on the substrate, with the limit sliding block disposed on the receiving portion and movable within a restrictive interval. The conductive metal block includes a body portion, an assembling portion disposed beside the body portion, and a heat dissipation plane disposed on the body portion to face away from the assembling portion and be in contact with an electronic component, with the assembling portion disposed on the receiving portion, a positioning slot disposed on the assembling portion to hold the limit sliding block laterally and keep the heat dissipation plane flat, and at least one resilient unit disposed between the assembling portion plane and the receiving portion plane to provide resilient support to the conductive metal block.
    Type: Grant
    Filed: June 29, 2016
    Date of Patent: July 21, 2020
    Assignee: YU QIN TECHNOLOGY, LTD.
    Inventor: Chia-Sheng Wu
  • Publication number: 20180007811
    Abstract: A heat dissipator structure, comprising: a heat-dissipation base and a conductive metal block. The heat-dissipation base includes a substrate and a plurality of heat-dissipating fins disposed on the substrate, wherein a receiving portion and a limit sliding block are disposed on the substrate, with the limit sliding block disposed on the receiving portion and movable within a restrictive interval.
    Type: Application
    Filed: June 29, 2016
    Publication date: January 4, 2018
    Inventor: Chia-Sheng WU
  • Patent number: 7930778
    Abstract: A pinch-preventing unit for bed guardrail includes a guardrail, a bed frame, and an actuating unit. The actuating unit is provided with a gap cover, which is located at a lower edge of the guardrail to close a gap existed between the lower edge of the guardrail and a top of the bed frame when the guardrail is in a lifted position for use, so as to ensure the safety use of the guardrail.
    Type: Grant
    Filed: December 7, 2007
    Date of Patent: April 26, 2011
    Assignee: Hill-Rom Services, Inc.
    Inventors: Chia-Sheng Wu, Chien-Kuo Tsai
  • Publication number: 20090144898
    Abstract: A pinch-preventing unit for bed guardrail includes a guardrail, a bed frame, and an actuating unit. The actuating unit is provided with a gap cover, which is located at a lower edge of the guardrail to close a gap existed between the lower edge of the guardrail and a top of the bed frame when the guardrail is in a lifted position for use, so as to ensure the safety use of the guardrail.
    Type: Application
    Filed: December 7, 2007
    Publication date: June 11, 2009
    Inventors: Chia-Sheng Wu, Chien-Kuo Tsai
  • Publication number: 20090007332
    Abstract: A handrail means for a bed frame includes a handrail frame, a shield, a handrail fixing frame, and a swinging assembly. When the swinging assembly acts, the shield does not act yet so as to avoid from interfering with the swinging assembly. When the swinging assembly is oriented horizontally, the shield can be folded toward the inside of the handrail frame. When the swinging assembly achieves a predetermined point, the shield has completed its action. Therefore, during the action, the shield avoids the handrail means from contacting the ground, thereby smoothing the folding of the handrail means of the bed frame.
    Type: Application
    Filed: November 7, 2007
    Publication date: January 8, 2009
    Applicant: OPTIMA HEALTHCARE INC.
    Inventors: Chia-Sheng Wu, Chien-Kuo Tsai
  • Patent number: 7467427
    Abstract: A handrail means for a bed frame includes a handrail frame, a shield, a handrail fixing frame, and a swinging assembly. When the swinging assembly acts, the shield does not act yet so as to avoid from interfering with the swinging assembly. When the swinging assembly is oriented horizontally, the shield can be folded toward the inside of the handrail frame. When the swinging assembly achieves a predetermined point, the shield has completed its action. Therefore, during the action, the shield avoids the handrail means from contacting the ground, thereby smoothing the folding of the handrail means of the bed frame.
    Type: Grant
    Filed: November 7, 2007
    Date of Patent: December 23, 2008
    Assignee: Optima Healthcare Inc.
    Inventors: Chia-Sheng Wu, Chien-Kuo Tsai