Patents by Inventor Chia-Shih Huang

Chia-Shih Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11973040
    Abstract: A method is provided for forming an integrated circuit (IC) chip package structure. The method includes providing a substrate for an interposer, and forming a conductive interconnect structure in and on the substrate for connecting a group of selected IC dies. The method includes forming warpage-reducing trenches in non-routing regions of the interposer, wherein the warpage-reducing trenches are sized and positioned based on a warpage characteristic to reduce the warpage of the chip package structure. The method also includes depositing a warpage-relief material in the warpage-reducing trenches according to the warpage characteristic to reduce the warpage of the chip package structure, and bonding the group of selected IC dies to the interposer to form a chip package structure.
    Type: Grant
    Filed: December 9, 2021
    Date of Patent: April 30, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tsung-Yang Hsieh, Chien-Chang Lee, Chia-Ping Lai, Wen-Chung Lu, Cheng-Kang Huang, Mei-Shih Kuo, Alice Huang
  • Publication number: 20240136183
    Abstract: A photo resist layer is used to protect a dielectric layer and conductive elements embedded in the dielectric layer when patterning an etch stop layer underlying the dielectric layer. The photo resist layer may further be used to etch another dielectric layer underlying the etch stop layer, where etching the next dielectric layer exposes a contact, such as a gate contact. The bottom layer can be used to protect the conductive elements embedded in the dielectric layer from a wet etchant used to etch the etch stop layer.
    Type: Application
    Filed: January 2, 2024
    Publication date: April 25, 2024
    Inventors: Yu-Shih Wang, Hong-Jie Yang, Chia-Ying Lee, Po-Nan Yeh, U-Ting Chiu, Chun-Neng Lin, Ming-Hsi Yeh, Kuo-Bin Huang
  • Patent number: 6052852
    Abstract: The invention provides a novel mattress having massage effect for being cushioned by a human back, and comprising an upholstered seat, a number of springs, a plurality of magnetic stones and an upholstery covering said upholstered seat; wherein, said upholstered seat is provided an accommodating space therein, a lying surface on the top surface thereof, a peripheral stretcher protruded and extended upwardly and provided on at least one end on the lying surface, and a supporting plane formed at the bottom surface of said upholstered seat, the central part of said supporting plane being slightly protruded downwardly; and wherein, said springs are installed in said accommodating space, every two of said springs are linked together, and directions of compression and stretching of each spring are always perpendicular to the lying surface and the supporting plane; further, said magnetic stones are disposed on the lying surface of said upholstered seat, and each of them has a kneading part on the top periphery there
    Type: Grant
    Filed: June 10, 1998
    Date of Patent: April 25, 2000
    Inventor: Chia-Shih Huang