Abstract: A heat dissipation apparatus includes a heat sink, a fan, and a fixing structure. The fan defines a number of fixing holes. The fixing structure includes a base, two resilient side panels bent from two sides of the base. The base and the side panels bound an accommodating space to accommodate the fan. An airflow opening is defined in the base for allowing air to flow between the heat sink and the fan. First ends of a number of fasteners secure the base of the fixing structure to the heat sink. Second ends of the number of fasteners protrude through the base into the accommodating space, to be accommodated in the corresponding fixing holes of the fan.

Abstract: A testing apparatus for a motherboard design includes a plurality of electrical elements. The testing apparatus includes a body, a plurality of heat source modules, and a power source terminal. The plurality of heat source modules is positioned on the body and produce heat to simulate the electrical elements of the motherboard. The power source terminal is connected to the plurality of heat source modules via cables and connected to a power supply. When the power supply is turned on, the power supply provides working voltages to the heat source modules to signal the heating source modules to simulate the heat production of the electrical elements of the motherboard design.

Abstract: A test apparatus for supporting compatibility testing between a motherboard and a number of power supply units includes a plug, a number of sockets, and a microprocessor. The plug is configured for connecting to the motherboard. The number of sockets is configured for connecting to the number of power supply units. The microprocessor is connected to the plug and the number of sockets, and is capable of turning on or turning off the number of power supply units, according to a power supply on signal received from the motherboard.