Patents by Inventor Chia Wang

Chia Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11990418
    Abstract: A method for forming a chip package structure is provided. The method includes removing a first portion of a substrate to form a first recess in the substrate. The method includes forming a buffer structure in the first recess. A first Young's modulus of the buffer structure is less than a second Young's modulus of the substrate. The method includes forming a first wiring structure over the buffer structure and the substrate. The method includes bonding a chip package to the first wiring structure. The chip package has an interposer substrate and a chip structure over the interposer substrate, and a first corner of the interposer substrate and a second corner of the chip structure overlap the buffer structure in a top view of the chip package and the buffer structure.
    Type: Grant
    Filed: August 27, 2021
    Date of Patent: May 21, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chin-Hua Wang, Po-Chen Lai, Ping-Tai Chen, Che-Chia Yang, Yu-Sheng Lin, Po-Yao Lin, Shin-Puu Jeng
  • Patent number: 11982866
    Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.
    Type: Grant
    Filed: December 15, 2022
    Date of Patent: May 14, 2024
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Liang-Ting Ho, Chen-Er Hsu, Yi-Liang Chan, Fu-Lai Tseng, Fu-Yuan Wu, Chen-Chi Kuo, Ying-Jen Wang, Wei-Han Hsia, Yi-Hsin Tseng, Wen-Chang Lin, Chun-Chia Liao, Shou-Jen Liu, Chao-Chun Chang, Yi-Chieh Lin, Shang-Yu Hsu, Yu-Huai Liao, Shih-Wei Hung, Sin-Hong Lin, Kun-Shih Lin, Yu-Cheng Lin, Wen-Yen Huang, Wei-Jhe Shen, Chih-Shiang Wu, Sin-Jhong Song, Che-Hsiang Chiu, Sheng-Chang Lin
  • Publication number: 20240154512
    Abstract: A current generator includes a startup circuit and a bandgap reference circuit coupled to the startup circuit. The startup circuit is for generating a first voltage. The bandgap reference circuit is for generating a second voltage. The bandgap reference circuit includes an operational amplifier. The operational amplifier includes a bias source circuit and a bias generator circuit. The bias source circuit is for generating a reference current according to the first voltage and the second voltage. The bias generator circuit is for generating bias voltages according to the reference current. The startup circuit and the bandgap reference circuit receive a supply voltage.
    Type: Application
    Filed: December 15, 2022
    Publication date: May 9, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Hsiu-Ming Yeh, Min-Chia Wang
  • Publication number: 20240154026
    Abstract: A semiconductor device includes a gate structure on a substrate, an offset spacer adjacent to the gate structure, a main spacer around the offset spacer, a source/drain region adjacent to two sides of the main spacer, a contact etch stop layer (CESL) adjacent to the main spacer, and an interlayer dielectric (ILD) layer around the CESL. Preferably, a dielectric constant of the offset spacer is higher than a dielectric constant of the main spacer.
    Type: Application
    Filed: January 17, 2024
    Publication date: May 9, 2024
    Inventors: Te-Chang Hsu, Chun-Chia Chen, Yao-Jhan Wang
  • Publication number: 20240152671
    Abstract: A violation checking method includes generating a violation log report for a design, classifying violation logs in the violation log report into high-risk logs and low-risk logs by a machine learning model, reviewing the high-risk logs, and modifying the design if at least one bug is identified in the high-risk logs.
    Type: Application
    Filed: November 3, 2023
    Publication date: May 9, 2024
    Applicant: MEDIATEK INC.
    Inventors: Chi-Ming Lee, Chung-An Wang, Cheok Yan Goh, Chia-Cheng Tsai, Chien-Hsin Yeh, Chia-Shun Yeh, Chin-Tang Lai
  • Patent number: 11978509
    Abstract: A memory device includes a plurality of resistive random access memory (RRAM) cells commonly connected between a bit line (BL) and a source line (SL). Each of the RRAM cells includes a resistor, a first transistor, and a second transistor coupled to each other in series, with the resistor connected to the BL and the second transistor connected to the SL. The first transistor has a first threshold voltage, and the second transistor has a second threshold voltage, the first threshold voltage being less than the second threshold voltage.
    Type: Grant
    Filed: October 8, 2021
    Date of Patent: May 7, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Meng-Sheng Chang, Chia-En Huang, Yih Wang
  • Publication number: 20240145569
    Abstract: A semiconductor device includes a field effect transistor (FET). The FET includes a first channel, a first source and a first drain; a second channel, a second source and a second drain; and a gate structure disposed over the first and second channels. The gate structure includes a gate dielectric layer and a gate electrode layer. The first source includes a first crystal semiconductor layer and the second source includes a second crystal semiconductor layer. The first source and the second source are connected by an alloy layer made of one or more Group IV element and one or more transition metal elements. The first crystal semiconductor layer is not in direct contact with the second crystal semiconductor layer.
    Type: Application
    Filed: January 4, 2024
    Publication date: May 2, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yee-Chia YEO, Sung-Li WANG, Chi On CHUI, Jyh-Cherng SHEU, Hung-Li CHIANG, I-Sheng CHEN
  • Publication number: 20240125771
    Abstract: The present invention relates to a reaction platform, which comprises: a machine body with a bottom plate for placing non-porous substrates; and a coater module configured on the top of the machine body and capable of maintaining a preset of a predetermined height for moving along the surface of non-porous substrate, wherein the coater module has one or more slits, and a target liquid can be directly injected or sucking in from the outside of the coater module through the slit, and spreading the target liquid onto a surface of the non-porous substrate while moving along the non-porous substrate; wherein the surface of the non-porous substrate has a target to be coated. The reaction platform of the present invention can not only save time, labor and cost, but also have accurate and reproducible experimental results, showing better results than traditional methods.
    Type: Application
    Filed: July 25, 2023
    Publication date: April 18, 2024
    Inventors: An-Bang Wang, Shih-Yu Chen, Tung-Hung Su, Chia-Chi Chu, Chia-Chien Yen, Yu-Wei Chiang
  • Publication number: 20240128126
    Abstract: A conductive gate over a semiconductor fin is cut into a first conductive gate and a second conductive gate. An oxide is removed from sidewalls of the first conductive gate and a dielectric material is applied to the sidewalls. Spacers adjacent to the conductive gate are removed to form voids, and the voids are capped with a dielectric material to form air spacers.
    Type: Application
    Filed: November 20, 2023
    Publication date: April 18, 2024
    Inventors: Shu-Uei Jang, Chen-Huang Huang, Ryan Chia-Jen Chen, Shiang-Bau Wang, Shu-Yuan Ku
  • Patent number: 11958364
    Abstract: A torque security system for a vehicle is provided. The system receives a signal from a sensor coupled to a motor shaft of an electric motor and determines an acceleration of the electric motor, based on the signal from the sensor that indicates an amount of rotation of the motor shaft. The system determines an internal torque between the motor shaft and an input gear coupled to the motor shaft, based on the acceleration of the electric motor and an inertia of the electric motor and a gearbox. The powertrain of the vehicle comprises the gearbox and the electric motor, and the input gear couples the electric motor to the gearbox. The system determines whether the internal torque exceeds a threshold torque, and in response to determining that the internal torque exceeds the threshold torque, the system reduces power output to the electric motor. The system also diagnoses the health of the gearbox.
    Type: Grant
    Filed: March 5, 2021
    Date of Patent: April 16, 2024
    Assignee: Rivian IP Holdings, LLC
    Inventors: Kang Wang, Younes Sangsefidi, Chia-Chou Yeh, Brian Harries
  • Patent number: 11961514
    Abstract: An acoustic event detection system may employ one or more recurrent neural networks (RNNs) to extract features from audio data, and use the extracted features to determine the presence of an acoustic event. The system may use self-attention to emphasize features extracted from portions of audio data that may include features more useful for detecting acoustic events. The system may perform self-attention in an iterative manner to reduce the amount of memory used to store hidden states of the RNN while processing successive portions of the audio data. The system may process the portions of the audio data using the RNN to generate a hidden state for each portion. The system may calculate an interim embedding for each hidden state. An interim embedding calculated for the last hidden state may be normalized to determine a final embedding representing features extracted from the input data by the RNN.
    Type: Grant
    Filed: December 10, 2021
    Date of Patent: April 16, 2024
    Assignee: Amazon Technologies, Inc.
    Inventors: Chia-Jung Chang, Qingming Tang, Ming Sun, Chao Wang
  • Patent number: 11955191
    Abstract: A memory device and a method of operating a memory device are disclosed. In one aspect, the memory device includes a plurality of non-volatile memory cells, each of the plurality of non-volatile memory cells is operatively coupled to a word line, a gate control line, and a bit line. Each of the plurality of non-volatile memory cells comprises a first transistor, a second transistor, a first diode-connected transistor, and a capacitor. The first transistor, second transistor, first diode-connected transistor are coupled in series, with the capacitor having a first terminal connected to a common node between the first diode-connected transistor and the second transistor.
    Type: Grant
    Filed: June 2, 2023
    Date of Patent: April 9, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Perng-Fei Yuh, Tung-Cheng Chang, Gu-Huan Li, Chia-En Huang, Chun-Ying Lee, Yih Wang
  • Patent number: 11955201
    Abstract: A memory device includes a plurality of arrays coupled in parallel with each other. A first array of the plurality of arrays includes a first switch and a plurality of first memory cells that are arranged in a first column, a second switch and a plurality of second memory cells that are arranged in a second column, and at least one data line coupled to the plurality of first memory cells and the plurality of second memory cells. The second switch is configured to output a data signal from the at least one data line to a sense amplifier.
    Type: Grant
    Filed: July 26, 2022
    Date of Patent: April 9, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Meng-Sheng Chang, Chia-En Huang, Yi-Ching Liu, Yih Wang
  • Publication number: 20240112957
    Abstract: A fabrication method is disclosed that includes: forming a first metal layer over first and second semiconductor structures; forming a first patterned photolithographic layer with an opening that exposes a portion of the first metal layer over the first semiconductor structure but not to a boundary between semiconductor structures; removing the exposed portion of the first metal layer; forming a second metal layer over the first and second semiconductor structures; forming a second patterned photolithographic layer with an opening that exposes a portion of the second metal layer over the second semiconductor structure but not to the boundary; removing the exposed portion of the first and second metal layers; wherein a barrier structure is generated between the first and second semiconductor structures that includes remaining portions of the first metal layer and a portion of the second metal layer overlying the remaining portions of the first metal layer.
    Type: Application
    Filed: January 12, 2023
    Publication date: April 4, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yu-Xuan Wang, Cheng-Chun Tseng, Yi-Chun Chen, Yu-Hsien Lin, Ryan Chia-Jen Chen
  • Patent number: 11948972
    Abstract: The present disclosure is directed to methods for the formation of high-voltage nano-sheet transistors and low-voltage gate-all-around transistors on a common substrate. The method includes forming a fin structure with first and second nano-sheet layers on the substrate. The method also includes forming a gate structure having a first dielectric and a first gate electrode on the fin structure and removing portions of the fin structure not covered by the gate structure. The method further includes partially etching exposed surfaces of the first nano-sheet layers to form recessed portions of the first nano-sheet layers in the fin structure and forming a spacer structure on the recessed portions. In addition, the method includes replacing the first gate electrode with a second dielectric and a second gate electrode, and forming an epitaxial structure abutting the fin structure.
    Type: Grant
    Filed: June 30, 2020
    Date of Patent: April 2, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yu-Xuan Huang, Chia-En Huang, Ching-Wei Tsai, Kuan-Lun Cheng, Yih Wang
  • Publication number: 20240107250
    Abstract: A method for performing audio enhancement with aid of timing control includes: utilizing a UE to determine a first predetermined synchronization delay and notify a first earphone of the first predetermined synchronization delay, wherein a first DSP circuit in the first earphone is arranged to determine a synchronization point according to a first time point of a first event and the first predetermined synchronization delay for the first earphone; utilizing the UE to determine a second predetermined synchronization delay and notify a second earphone of the second predetermined synchronization delay, wherein a second DSP circuit in the second earphone is arranged to determine the synchronization point according to a second time point of a second event and the second predetermined synchronization delay for the second earphone; and utilizing the UE to receive first uplink audio data from the first earphone and receive second uplink audio data from the second earphone.
    Type: Application
    Filed: December 6, 2022
    Publication date: March 28, 2024
    Applicant: MEDIATEK INC.
    Inventors: Hsi-Hsien Chen, Yili Wang, Chia-Wei Tao, Sheng-Ming Wang
  • Publication number: 20240102853
    Abstract: An electronic device and a related tiled electronic device are disclosed. The electronic device includes a protective layer, a circuit structure, a sensing element and a control unit. The circuit structure is disposed on the protective layer and surrounds the sensing element. The control unit is disposed between the circuit structure and the protective layer and electrically connected to the sensing element. The protective layer surrounds the control unit and contacts a surface of the circuit structure.
    Type: Application
    Filed: November 4, 2022
    Publication date: March 28, 2024
    Applicant: InnoLux Corporation
    Inventors: Yu-Chia HUANG, Ju-Li WANG, Nai-Fang HSU, Cheng-Chi WANG, Jui-Jen YUEH
  • Publication number: 20240107163
    Abstract: Methods, systems, and apparatus, including computer programs encoded on computer-storage media, for multi-camera video stabilization. In some implementations, a video capture device has a first camera and a second camera. The video capture device provides a digital zoom capability permitting user-specified magnification changes within a digital zoom range during video recording. The video capture device is configured to use video data from different cameras over different portions of the digital zoom range. The video capture device can process image data captured using the second camera by applying a set of transformations including (i) a first transformation to a canonical reference space for the second camera, (ii) a second transformation to a canonical reference space for the first camera, and (iii) a third transformation to apply electronic image stabilization to image data in the canonical reference space for the first camera.
    Type: Application
    Filed: November 28, 2023
    Publication date: March 28, 2024
    Inventors: Youyou Wang, Fuhao Shi, Chia-Kai Liang
  • Patent number: 11942155
    Abstract: A memory system includes a memory array comprising a plurality of memory cells. Each of the memory cells includes a first programming transistor, a second programming transistor, a first reading transistor coupled to the first programming transistor in series, and a second reading transistor coupled to the second programming transistor in series. The memory system includes an authentication circuit operatively coupled to the memory array. The authentication circuit is configured to generate a Physically Unclonable Function (PUF) signature based on respective logic states of the plurality of memory cells. The logic state of each of the plurality of memory cells is determined based on a preceding breakdown of either the corresponding first programming transistor or second programming transistor.
    Type: Grant
    Filed: September 30, 2021
    Date of Patent: March 26, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Meng-Sheng Chang, Chia-En Huang, Yih Wang
  • Patent number: 11942285
    Abstract: An electronic device has a keyboard with an internal membrane. The membrane has a set of strain gauges configured to respond to a key press, such as when a collapsible dome collapses into contact with the membrane. The strain gauges are connected in a half Wheatstone bridge configuration and are positioned on the membrane in order to limit effects of temperature and subtle flexure of the membrane. The strain gauges are also configured to magnify detection of a resistance differential when a keycap is pressed with sufficient force.
    Type: Grant
    Filed: November 2, 2022
    Date of Patent: March 26, 2024
    Assignee: APPLE INC.
    Inventors: Chia Chi Wu, Michael Vosgueritchian, Ming Gao, Nan Chen, Vyom Sharma, Wenhao Wang