Patents by Inventor Chia-Wei Chang

Chia-Wei Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11934985
    Abstract: According to one embodiment, there is provided a computing device and method for evaluating driving risk. The computing device includes an input circuit and a processor. The input circuit is configured to receive data from a vehicle. The data includes at least one of GPS data, acceleration data or image data of views external of the vehicle or inside the cabin. Thereafter, the processor is configured to identify a plurality of risks based on the data received from the vehicle, determine a plurality of weightages which are assigned to the plurality of risks, and generate a score based on the plurality of weightages for the plurality of risks.
    Type: Grant
    Filed: March 27, 2019
    Date of Patent: March 19, 2024
    Assignee: V3 SMART TECHNOLOGIES PTE LTD
    Inventors: Shih Jon Wong, Chia Wei Chang
  • Patent number: 11929314
    Abstract: In some implementations, one or more semiconductor processing tools may form a metal cap on a metal gate. The one or more semiconductor processing tools may form one or more dielectric layers on the metal cap. The one or more semiconductor processing tools may form a recess to the metal cap within the one or more dielectric layers. The one or more semiconductor processing tools may perform a bottom-up deposition of metal material on the metal cap to form a metal plug within the recess and directly on the metal cap.
    Type: Grant
    Filed: March 12, 2021
    Date of Patent: March 12, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Hsien Huang, Peng-Fu Hsu, Yu-Syuan Cai, Min-Hsiu Hung, Chen-Yuan Kao, Ken-Yu Chang, Chun-I Tsai, Chia-Han Lai, Chih-Wei Chang, Ming-Hsing Tsai
  • Publication number: 20240077479
    Abstract: A detection system and method for the migrating cell is provided. The system is configured to detect a migrating cell combined with an immunomagnetic bead. The system includes a platform, a microchannel, a magnetic field source, a coherent light source and an optical sensing module. The microchannel is configured to allow the migrating cell to flow in it along a flow direction. The magnetic field source is configured to provide magnetic force to the migrating cell combined with the immunomagnetic bead. The magnetic force includes at least one magnetic force component and the magnetic force component is opposite to the flow direction of the microchannel. The coherent light source is configured to provide the microchannel with the coherent light. The optical sensing module is configured to receive the interference light caused by the coherent light being reflected by the sample inside the microchannel.
    Type: Application
    Filed: August 10, 2023
    Publication date: March 7, 2024
    Applicant: DeepBrain Tech. Inc
    Inventors: Han-Lin Wang, Chia-Wei Chen, Yao-Wen Liang, Ting-Chun Lin, Yun-Ting Kuo, You-Yin Chen, Yu-Chun Lo, Ssu-Ju Li, Ching-Wen Chang, Yi-Chen Lin
  • Publication number: 20240080117
    Abstract: The present invention provides a wireless communication method of an electronic device, wherein the electronic device includes a first radio and a second radio, a maximum bandwidth or a maximum. NSS supported by the first radio is different from a maximum bandwidth or a maximum NSS supported by the second radio. The wireless communication method includes the step of: using the first radio to communicate with another electronic device; determining if parameters of the electronic device satisfy a condition; and in response to the parameters of the electronic device satisfying the condition, enabling the second radio and using the second radio to communicate with the another electronic device, and disabling the first radio.
    Type: Application
    Filed: August 9, 2023
    Publication date: March 7, 2024
    Applicant: MEDIATEK INC.
    Inventors: Ying-You Lin, Jun-Wei Lin, Ren-Fang Gan, Ding-Yuh Hwang, Po-Ting Kao, Chia-Ning Chang, Ssu-Ying Hung
  • Patent number: 11921101
    Abstract: Disclosed are calibration techniques that can be implemented by a device that conducts biological tests. In certain embodiments, the device for testing a biological specimen includes a receiving mechanism to receive a carrier, a camera module arranged to capture imagery of the carrier, and a processor. Some examples of the processor can detect a calibration mode trigger. In calibration mode, the processor can divide the captured imagery into segments and selectively perform one or more calibration procedures for each segment. Then, the processor records a calibration result for each segment.
    Type: Grant
    Filed: January 25, 2022
    Date of Patent: March 5, 2024
    Assignee: Bonraybio Co., Ltd.
    Inventors: Cheng-Teng Hsu, Chih-Pin Chang, Kuang-Li Huang, Yu-Chiao Chi, Chia-Wei Chang, Chiung-Han Wang
  • Publication number: 20240071776
    Abstract: A chip packaging structure and a method for fabricating the same are provided. The chip package structure includes a conductive substrate, a dam and a metal shielding layer. The conductive substrate includes a substrate, vias and electrodes. The substrate has first and second board surfaces opposite to each other. The vias penetrate through the first board surface and the second board surface, and a part of the vias is disposed in a first die-bonding region on which a chip is to be arranged. The electrodes extend from the first board surface to the second board surface through the vias. The dam is formed on the first board surface to surround the first die-bonding region, and the dam has a height higher than that of the chip. The metal shielding layer covers the dam and a part of the first board surface that do not overlap with the electrodes.
    Type: Application
    Filed: December 2, 2022
    Publication date: February 29, 2024
    Inventors: DEI-CHENG LIU, CHIA-SHUAI CHANG, MING-YEN PAN, JIAN-YU SHIH, JHIH-WEI LAI, SHIH-HAN WU
  • Patent number: 11899007
    Abstract: Disclosed are verification techniques that can be implemented by a device that conducts biological tests to verify that the specimen holding area carries a valid biological specimen. In certain embodiments, the testing device includes a receiving mechanism to receive a carrier, and the carrier includes a holding area that is to carry or to be exposed to a biological specimen. The device can also include a camera module arranged to capture imagery of the carrier, and a processor. In some examples, the processor can capture the imagery of the carrier and identify a visual cue on the carrier. Then, the processor can verify, based on a manner of how the visual cue is displayed in the captured imagery, whether the holding area carries a valid biological specimen.
    Type: Grant
    Filed: January 25, 2022
    Date of Patent: February 13, 2024
    Assignee: Bonraybio Co., Ltd.
    Inventors: Cheng-Teng Hsu, Chih-Pin Chang, Kuang-Li Huang, Yu-Chiao Chi, Chia-Wei Chang, Chiung-Han Wang
  • Patent number: 11876122
    Abstract: A method of forming a semiconductor device. A substrate having a fin structure is provided. A dummy gate is formed on the fin structure. A polymer block is formed adjacent to a corner between the dummy gate and the fin structure. The polymer block is subjected to a nitrogen plasma treatment, thereby forming a nitridation layer in proximity to a sidewall of the dummy gate under the polymer block. After subjecting the polymer block to the nitrogen plasma treatment, a seal layer is formed on the sidewall of the dummy gate and on the polymer block. An epitaxial layer is then grown on a source/drain region of the fin structure. The dummy gate is then replaced with a metal gate.
    Type: Grant
    Filed: November 27, 2022
    Date of Patent: January 16, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Chia-Wei Chang, Chia-Ming Kuo, Po-Jen Chuang, Fu-Jung Chuang, Shao-Wei Wang, Yu-Ren Wang, Chia-Yuan Chang
  • Publication number: 20230417257
    Abstract: An integrated ceiling fan and a ceiling fan connecting device are provided. The integrated ceiling fan includes the ceiling fan connecting device, a ceiling device, and a ceiling fan device. The ceiling fan connecting device includes a connecting housing and a connecting seat, and the connecting housing has a top surface, a surrounding side surface that surrounds and is connected to an edge of the top surface, and a plurality of mounting slots that are recessed from the top surface. The ceiling device includes a ceiling housing and a plurality of first fixing members that are locked to the ceiling housing and the top surface of the connecting housing. The ceiling fan device includes a motor housing, a plurality of second fixing members that are respectively located in the mounting slots and are locked to the motor housing, and a ceiling fan main body.
    Type: Application
    Filed: June 24, 2022
    Publication date: December 28, 2023
    Inventors: KAI-JEN TSAI, HSIN-CHU CHANG, CHIA-WEI CHANG, MIN-YUAN HSIAO
  • Publication number: 20230390337
    Abstract: Provided are methods and compositions for obtaining functionally enhanced derivative effector cells obtained from directed differentiation of genomically engineered iPSCs. The iPSC-derived cells provided herein have stable and functional genome editing that delivers improved or enhanced therapeutic effects. Also provided are therapeutic compositions and the use thereof comprising the functionally enhanced derivative effector cells alone, or with antibodies or checkpoint inhibitors in combination therapies.
    Type: Application
    Filed: November 4, 2021
    Publication date: December 7, 2023
    Inventors: Bahram VALAMEHR, Eigen PERALTA, Chia-Wei CHANG
  • Publication number: 20230381235
    Abstract: Provided are methods and compositions for obtaining functionally enhanced derivative effector cells obtained from directed differentiation of genomically engineered iPSCs. The iPSC-derived cells provided herein have stable and functional genome editing that delivers improved or enhanced therapeutic effects. Also provided are therapeutic compositions and the use thereof comprising the functionally enhanced derivative effector cells alone, or with antibodies or checkpoint inhibitors in combination therapies.
    Type: Application
    Filed: November 4, 2021
    Publication date: November 30, 2023
    Inventors: Bahram VALAMEHR, Tom T. LEE, Bi-Huei YANG, Mochtar PRIBADI, Chia-Wei CHANG
  • Patent number: 11825915
    Abstract: An apparatus for buffing a shoe part includes a housing adapted to be articulated around at least a portion of the footwear part. A rotating spindle is positioned in the housing and has a buffing surface for engagement with the footwear part. A carriage is slideably connected to the housing and holds the spindle such that the buffing surface can be moved closer to and further away from the footwear part. An actuator is in the housing and in contact with the carriage. The actuator applies force to the carriage to increase the force of the buffing surface onto the footwear part. A biasing member is in the housing and in contact with the carriage. The biasing member exerts force onto the carriage in a direction opposite the force exerted by the actuator.
    Type: Grant
    Filed: July 1, 2022
    Date of Patent: November 28, 2023
    Assignee: NIKE, Inc.
    Inventors: Dragan Jurkovic, Shih-Yuan Wu, Chia-Wei Chang, Wen-Ruei Chang, Chien-Chun Chen, Chang-Chu Liao, Chia-Hung Lin
  • Publication number: 20230357716
    Abstract: Provided are methods and compositions for obtaining functionally enhanced derivative effector cells obtained from directed differentiation of genomically engineered iPSCs. Also provided are derivative cells having stable and functional genome editing that delivers improved or enhanced therapeutic effects. Further provided are therapeutic compositions and the use thereof comprising the functionally enhanced derivative effector cells alone, or with antibodies or checkpoint inhibitors in combination therapies.
    Type: Application
    Filed: June 30, 2023
    Publication date: November 9, 2023
    Inventors: Bahram VALAMEHR, Tom Tong LEE, Martin HOSKING, Eigen PERALTA, Chia-Wei CHANG
  • Patent number: 11805876
    Abstract: A bag set comprises a first bag unit combined with a second bag unit. The first bag unit includes a main bag body and a strap set. The main bag body has two first fasteners disposed on an outer surface. The strap set includes a first strap component having two ends connected with the main bag body, and a second strap component having a loop structure and one end connected with the main bag body. The second bag unit has two second fasteners to be attached to or disassembled from the two first fasteners selectively. When in use, the first strap component is hung diagonally on a shoulder of a user; and the second strap component is extended forward from the waist of the user to make the loop structure positioned in front side of the user, to pass the first strap component through the loop structure.
    Type: Grant
    Filed: December 17, 2020
    Date of Patent: November 7, 2023
    Assignee: BITPLAY INC.
    Inventor: Chia-Wei Chang
  • Publication number: 20230340370
    Abstract: Disclosed herein is a composition for removing post-etch residues in the presence of a layer comprising silicon and a dielectric layer including a silicon oxide, the composition including: (a) 0.005 to 0.3 % by weight HF; (b) 0.01 to 1 % by weight of an ammonium fluoride of formula NRE4F, where RE is H or a C1 to C4 alkyl group; (c) 5 to 30 % by weight of an organic solvent selected from the group consisting of a sulfoxide and a sulfone; (d) 70 % by weight or more water, and (e) optionally 0.01 to 1 % by weight of an ammonium compound selected from the group consisting of ammonia and a C4 to C20 quaternized aliphatic ammonium.
    Type: Application
    Filed: August 16, 2021
    Publication date: October 26, 2023
    Inventors: Andreas KLIPP, Chia Wei CHANG, Meng Ju YU, Jhih Jheng KE, Cheng Shun CHEN
  • Patent number: 11791413
    Abstract: A semiconductor device includes a fin protruding from a substrate and extending in a first direction, a gate structure extending on the fin in a second direction, and a seal layer located on the sidewall of the gate structure. A first peak carbon concentration is disposed in the seal layer. A first spacer layer is located on the seal layer. A second peak carbon concentration is disposed in the first spacer layer. A second spacer layer is located on the first spacer layer.
    Type: Grant
    Filed: August 2, 2021
    Date of Patent: October 17, 2023
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Shi-You Liu, Shih-Cheng Chen, Chia-Wei Chang, Chia-Ming Kuo, Tsai-Yu Wen, Yu-Ren Wang
  • Publication number: 20230297285
    Abstract: An apparatus can include a number of memory devices and a memory controller coupled to one or more of the number of memory devices. The memory controller can include a row hammer detector. The memory controller can be configured increment for a first time period a row counter in a first data structure and a refresh counter. The memory controller can be configured to increment for a second time period a row counter in a second data structure and the refresh counter. The memory controller can be configured to determine that a value of the refresh counter exceeds a refresh threshold and responsive to the determination that the value of the refresh counter exceeds the refresh threshold, issue a notification.
    Type: Application
    Filed: March 15, 2023
    Publication date: September 21, 2023
    Inventors: Amitava Majumdar, Anandhavel Nagendrakumar, Mohammed Ebrahim Hargan, Scott Garner, Danilo Caraccio, Daniele Balluchi, Chia Wei Chang, Ankush Lal
  • Publication number: 20230275077
    Abstract: A chip-on-wafer-on-substrate (CoWoS) semiconductor assembly is formed which includes a chip-on-wafer (CoW) sub-assembly of integrated circuit (IC) dies mounted on an interposer, which is in turn mounted on a package substrate with a top metallization stack and a bottom metallization stack using bonding bumps connecting the backside of the interposer and the front side of the package substrate. The bonding bumps provide electrical connections between the ends of through-vias exposed at the backside of the interposer and the top metallization stack of the package substrate. The likelihood of certain failure mechanisms that can adversely affect CoWoS yield are reduced or eliminated by ensuring a total metal thickness of the top metallization stack is greater than a total metal thickness of the bottom metallization stack, but not so much greater as to induce cracking of the underfill material during curing thereof.
    Type: Application
    Filed: February 25, 2022
    Publication date: August 31, 2023
    Inventors: Chia-Wei Chang, Ju-Min Chen, Jyun-Lin Wu, Yao-Chun Chuang
  • Patent number: D1004070
    Type: Grant
    Filed: January 27, 2022
    Date of Patent: November 7, 2023
    Assignee: HOTECK INC.
    Inventors: Chung-Yu Lin, Chia-Wei Chang, Kai-Jen Tsai, Min-Yuan Hsiao
  • Patent number: D1013147
    Type: Grant
    Filed: June 20, 2022
    Date of Patent: January 30, 2024
    Assignee: HOTECK INC.
    Inventors: Chien-Li Huang, Kai-Jen Tsai, Chia-Wei Chang, Min-Yuan Hsiao